公开(公告)号：US20170207194A1

公开(公告)日：2017-07-20

申请号：US15409511

申请日：2017-01-18

Applicant: XINTEC INC.

Inventor： Hsing-Lung SHEN ,  Jiun-Yen LAI ,  Yu-Ting HUANG ,  Tsung-Cheng CHAN ,  Jan-Lian LIAO ,  Hung-Chang CHEN ,  Ming-Chieh HUANG ,  Hsi-Chien LIN

IPC: H01L25/065 ,  H01L23/29 ,  H01L21/56 ,  H01L25/00 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L24/03 ,  H01L21/563 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3171 ,  H01L23/3178 ,  H01L24/06 ,  H01L24/13 ,  H01L24/24 ,  H01L24/82 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/02373 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2224/82005 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/82

Abstract: A chip package is provided. The chip package includes a first chip including a carrier substrate and a device substrate thereon. A second chip is mounted on the device substrate. A portion of the device substrate extends outward from the edge of the second chip, so as to be exposed from the second chip. A conductive pad is between the device substrate and the second chip. A polymer protective layer conformally covers the second chip, the exposed portion of the device substrate, and the edge of the carrier substrate. A redistribution layer is disposed on the polymer protective layer and extends into a first opening that passes through the polymer protective layer and the second chip and exposes the conductive pad, so as to be electrically connected to the conductive pad.