公开(公告)号：US20160343882A1

公开(公告)日：2016-11-24

申请号：US15157776

申请日：2016-05-18

Applicant: XINTEC INC.

Inventor： Yi-Ying KUO ,  Ming-Chieh HUANG ,  Hsi-Chien LIN

IPC: H01L31/02 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L31/02002 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/562 ,  H01L31/0216 ,  H01L31/186 ,  H01L2224/11

Abstract: A chip package includes a chip, an insulating layer, a flowing insulating material layer and conductive layer. The chip has a conductive pad, a side surface, a first surface and a second surface opposite to the first surface, which the side surface is between the first surface and the second surface, and the conductive is below the first surface and protruded from the side surface. The insulating layer covers the second surface and the side surface, and the flowing insulating material layer is disposed below the insulating layer, and the flowing insulating material layer has a trench exposing the conductive pad protruded form the side surface. The conductive layer is disposed below the flowing insulating material layer and extended into the trench to contact the conductive pad.

Abstract translation: 芯片封装包括芯片，绝缘层，流动绝缘材料层和导电层。 芯片具有导电焊盘，侧表面，与第一表面相对的第一表面和第二表面，侧表面位于第一表面和第二表面之间，并且导电体在第一表面下方并且从第一表面突出 侧面。 绝缘层覆盖第二表面和侧表面，并且流动绝缘材料层设置在绝缘层下方，并且流动绝缘材料层具有暴露从侧表面突出的导电焊盘的沟槽。 导电层设置在流动的绝缘材料层下方并延伸到沟槽中以接触导电焊盘。