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公开(公告)号:US12080816B2
公开(公告)日:2024-09-03
申请号:US18357028
申请日:2023-07-21
发明人: Ning Li , Pengjun Xiao , Zhigang Dai , Sen Yang , Weichong Kong , Bo Li , Jiaxiang Yin , Chunhua Tao
IPC分类号: H01L31/0475 , H01L31/048 , H01L31/18
CPC分类号: H01L31/0475 , H01L31/048 , H01L31/186
摘要: The photovoltaic module includes multiple cell sheets arranged in an array including multiple rows and multiple columns, where each of the multiple rows of cell sheets is arranged at intervals along a first direction, each of the multiple columns of cell sheets is arranged at intervals along a second direction, and each of the multiple cell sheets has a first surface and a second surface. The photovoltaic module further includes a first flexible cover layer located on a side of the first surface of each of the multiple cell sheets, and a second flexible cover layer located on a side of the second surface of each of the multiple cell sheets. The photovoltaic module is configured to be folded along a gap between two adjacent rows of cell sheets or along a gap between two adjacent columns of cell sheets with the folding angle of 0 degree to 180 degrees.
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2.
公开(公告)号:US20240282872A1
公开(公告)日:2024-08-22
申请号:US18569659
申请日:2022-06-08
发明人: Henning Helmers , Oliver HÖHN , David LACKNER , Felix PREDAN
IPC分类号: H01L31/0392 , H01L31/02 , H01L31/0443 , H01L31/054 , H01L31/18
CPC分类号: H01L31/0392 , H01L31/0201 , H01L31/0443 , H01L31/0547 , H01L31/186
摘要: A method for producing at least one photovoltaic cell for converting electromagnetic radiation into electrical energy, having the method steps of: A. providing a superstrate in the form of a semiconductor substrate; B. applying photovoltaic cell semiconductor layers for forming at least one photovoltaic cell to a rear face of the superstrate indirectly or directly, and the photovoltaic cell semiconductor layers have at least one absorber layer formed from a direct semiconductor. The superstrate is in the form of a current conducting layer having a thickness greater than 10 μm and, in method step B, the photovoltaic cell semiconductor layers are formed with an electrically conductive connection to the current conducting layer and wherein the band gap of the current conducting layer is larger by at least 50 meV than the band gap of the absorber layer.
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公开(公告)号:US11942561B2
公开(公告)日:2024-03-26
申请号:US17869513
申请日:2022-07-20
发明人: Ratson Morad , Gilad Almogy , Itai Suez , Jean Hummel , Nathan Beckett , Yafu Lin , John Gannon , Michael J. Starkey , Robert Stuart , Tamir Lance , Dan Maydan
IPC分类号: H01L31/02 , H01L31/0224 , H01L31/0352 , H01L31/042 , H01L31/044 , H01L31/048 , H01L31/05 , H01L31/0747 , H01L31/18 , H02J3/38 , H02J3/46 , H02J5/00 , H02S40/32 , H02S40/34
CPC分类号: H01L31/02008 , H01L31/0201 , H01L31/022441 , H01L31/035281 , H01L31/042 , H01L31/044 , H01L31/048 , H01L31/0508 , H01L31/0512 , H01L31/0747 , H01L31/186 , H01L31/1876 , H01L31/188 , H02J3/381 , H02J3/46 , H02J5/00 , H02S40/32 , H02S40/34 , H02J2300/24 , Y02E10/50
摘要: A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.
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公开(公告)号:US20240030361A1
公开(公告)日:2024-01-25
申请号:US18039723
申请日:2021-05-11
发明人: Wei DENG , Chufeng YANG , Qian WU
IPC分类号: H01L31/0216 , H01L31/0236 , H01L31/18
CPC分类号: H01L31/02167 , H01L31/02366 , H01L31/186
摘要: Provided are a patterned adhesive film and a photovoltaic assembly. The patterned adhesive film includes a bottom-layer adhesive film and a patterned coating layer arranged on the surface of the bottom-layer adhesive film, the minimum torque value ML of the bottom-layer adhesive film at 100° C. is 0.2-2.5 dN·m, and the elongation at break of the patterned coating layer is ≥20%. Therefore, while laminating is performed on the photovoltaic assembly including the patterned adhesive film, the bottom-layer adhesive film has relatively low fluidity, and the elongation at break of the patterned coating layer may be matched with the bottom-layer adhesive film having the relatively low fluidity, such that the cracking problem of the patterned adhesive film is avoided in the laminating process of the photovoltaic assembly.
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5.
公开(公告)号:US11881544B2
公开(公告)日:2024-01-23
申请号:US17960794
申请日:2022-10-05
申请人: OSRAM OLED GmbH
发明人: Markus Pindl , Thomas Schwarz , Frank Singer , Sandra Sobczyk
IPC分类号: H01L33/54 , H01L33/00 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/50 , H01L33/48 , H01L33/56 , H01L21/56
CPC分类号: H01L33/54 , H01L31/0203 , H01L31/02322 , H01L31/186 , H01L33/0095 , H01L33/502 , H01L21/568 , H01L33/486 , H01L33/505 , H01L33/56 , H01L2224/18 , H01L2224/24 , H01L2224/2518 , H01L2224/82 , H01L2933/005 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
摘要: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.
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公开(公告)号:US11862746B2
公开(公告)日:2024-01-02
申请号:US16856301
申请日:2020-04-23
申请人: Ian D. Hosein
发明人: Ian D. Hosein
IPC分类号: H01L31/042 , H01L31/054 , H01L31/18 , H01L31/048 , B82Y20/00
CPC分类号: H01L31/0543 , H01L31/0481 , H01L31/186 , B82Y20/00
摘要: A metallo-dielectric waveguide array used as an encapsulation material for silicon solar cells. The array is produced through light-induced self-writing combined with in situ photochemical synthesis of silver nanoparticles. Each waveguide comprises a cylindrical core consisting of a high refractive index polymer and silver nanoparticles homogeneously dispersed in its medium, all of which are surrounded by a low refractive index common cladding. These waveguide array films are processed directly over a silicon solar cell.
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公开(公告)号:US20230352605A1
公开(公告)日:2023-11-02
申请号:US18346477
申请日:2023-07-03
申请人: The Boeing Company
发明人: Eric Rehder
IPC分类号: H01L31/0236 , H01L31/02 , H01L31/18 , H02S50/10 , H01L31/20
CPC分类号: H01L31/02366 , H01L31/02013 , H01L31/1876 , H02S50/10 , H01L31/208 , H01L31/186 , Y02E10/50 , Y02P70/50
摘要: The present disclosure is directed to a method of processing a solar cell device. The method comprises detecting at least one inconsistency at a surface of a semiconductor substrate having a solar cell active region formed therein. A deposition pattern is determined based on the location of the at least one inconsistency. A material is selectively deposited on the substrate according to the deposition pattern.
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8.
公开(公告)号:US11804562B2
公开(公告)日:2023-10-31
申请号:US17454404
申请日:2021-11-10
发明人: Sanghyeon Kim , DaeMyeong Geum , SeungYeop Ahn , Jinha Lim
IPC分类号: H01L31/0352 , H01L31/0232 , H01L31/18 , H01L49/02 , H01L27/144
CPC分类号: H01L31/035236 , H01L27/1443 , H01L28/40 , H01L31/0232 , H01L31/186
摘要: Various embodiments relate to a superlattice photodetector and a method of manufacturing the same. The superlattice photodetector includes an absorption layer for absorbing incident light and a waveguide layer coupled with the absorption layer and enabling the incident light to be waveguided within the absorption layer. The waveguide layer may include a periodic structure in which a plurality of metal patterns and a plurality of dielectric patterns are repeatedly arranged. According to various embodiments, the superlattice photodetector can be thinned while having improved performance.
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公开(公告)号:US20230207715A1
公开(公告)日:2023-06-29
申请号:US17926750
申请日:2021-06-21
申请人: H. GLASS SA
CPC分类号: H01L31/0508 , H01L31/186
摘要: The present invention concerns an electronic device, preferably a thin film electronic device, and a method for producing the device. The device comprises an intermediate structure (301, 401, 501) at the interface between neighboring unit devices connected in series. The intermediate structure is suitable to employ deposition techniques that make it possible to avoid steps of scribing or patterning insulating and/or separating lines between adjacent layers of the device.
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公开(公告)号:US20230170429A1
公开(公告)日:2023-06-01
申请号:US18159508
申请日:2023-01-25
申请人: Waymo LLC
发明人: Caner Onal , Simon Verghese , Pierre-Yves Droz
IPC分类号: H01L31/0352 , H01L31/107 , H01L31/18 , H01L27/144 , G01S17/89
CPC分类号: H01L31/035272 , G01S17/89 , H01L27/1443 , H01L31/107 , H01L31/186 , H01L31/035281 , G01S7/4868
摘要: Example embodiments relate to controlling detection time in photodetectors. An example embodiment includes a device. The device includes a substrate. The device also includes a photodetector coupled to the substrate. The photodetector is arranged to detect light emitted from a light source that irradiates a top surface of the device. A depth of the substrate is at most 100 times a diffusion length of a minority carrier within the substrate so as to mitigate dark current arising from minority carriers photoexcited in the substrate based on the light emitted from the light source.
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