公开(公告)号：US20210320233A1

公开(公告)日：2021-10-14

申请号：US17356755

申请日：2021-06-24

Applicant: Xiamen Sanan Optoelectronics Technology Co., LTD

Inventor： Hailin Rao ,  Shaohua Huang ,  Xiaoqiang Zeng ,  Lixun Yang ,  Shuiqing LI ,  Linrong CAI

IPC: H01L33/58 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62

Abstract: A light-emitting device includes an LED chip disposed on a supporting component. The LED chip includes a semiconductor stack formed on a substrate, a first electrode, and a second electrode. A light-blocking layer fills the supporting component to cover a lateral side of the LED chip and expose a top chip surface of the LED chip. The light-blocking layer has a top surface not lower than the top chip surface of the LED chip. A height difference among the top chip surface, the top surface of the light-blocking layer and a top end of the supporting component is less than 10 μm. A top light exit port defined by the light-blocking layer to expose the top chip surface has a cross sectional area not larger than that of the top chip surface.