公开(公告)号：US20100084749A1

公开(公告)日：2010-04-08

申请号：US12285346

申请日：2008-10-02

申请人： Young-Moon Hong ,  Chang-Suk Han ,  Chang-Won Park

发明人： Young-Moon Hong ,  Chang-Suk Han ,  Chang-Won Park

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L23/49572 ,  H01L23/49582 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant.

摘要翻译： 提供了一种封装及其制造方法。 封装包括引线框架，芯片和密封剂。 引线框架具有凹口和多个第一切口侧引线，多个第一切口侧焊盘，多个第二切口侧引线和多个第二切口侧焊盘。 第一缺口侧引线延伸到凹口的第一侧。 第一切口侧焊盘相应地设置在第一切口侧引线上。 第二缺口侧引线延伸到凹口的第二侧。 第二切口侧焊盘相应地设置在第二切口侧引线上。 密封剂密封芯片和引线框架并暴露引线框架的下表面。 切口露出一部分密封剂。

公开(公告)号：US08008784B2

公开(公告)日：2011-08-30

申请号：US12285346

申请日：2008-10-02

申请人： Young-Moon Hong ,  Chang-Suk Han ,  Chang-Won Park

发明人： Young-Moon Hong ,  Chang-Suk Han ,  Chang-Won Park

IPC分类号： H01L23/52

CPC分类号： H01L23/49548 ,  H01L23/49572 ,  H01L23/49582 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A package and a fabricating method thereof are provided. The package includes a lead frame, a chip and a sealant. The lead frame has a notch and a plurality of first notch-side leads, a plurality of first notch-side pads, a plurality of second notch-side leads and a plurality of second notch-side pads. The first notch-side leads extend to a first side of the notch. The first notch-side pads are correspondingly disposed on the first notch-side leads. The second notch-side leads extend to a second side of the notch. The second notch-side pads are correspondingly disposed on the second notch-side leads. The sealant seals up the chip and the lead frame and exposes a lower surface of the lead frame. The notch exposes a portion of the sealant.

摘要翻译： 提供了一种封装及其制造方法。 封装包括引线框架，芯片和密封剂。 引线框架具有凹口和多个第一切口侧引线，多个第一切口侧焊盘，多个第二切口侧引线和多个第二切口侧焊盘。 第一缺口侧引线延伸到凹口的第一侧。 第一切口侧焊盘相应地设置在第一切口侧引线上。 第二缺口侧引线延伸到凹口的第二侧。 第二切口侧焊盘相应地设置在第二切口侧引线上。 密封剂密封芯片和引线框架并暴露引线框架的下表面。 切口露出一部分密封剂。