公开(公告)号：US20180263116A1

公开(公告)日：2018-09-13

申请号：US15975334

申请日：2018-05-09

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Han-Sung BAE ,  Wonkyu KWAK ,  Cheolgeun AN

IPC分类号： H05K1/11 ,  G02F1/1345 ,  H01L23/00 ,  H05K3/36 ,  H05K3/30 ,  H01L23/495

CPC分类号： H05K1/118 ,  G02F1/13458 ,  H01L23/49572 ,  H01L24/06 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K1/111 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/611

摘要： Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US09974175B2

公开(公告)日：2018-05-15

申请号：US14574492

申请日：2014-12-18

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Han-Sung Bae ,  Wonkyu Kwak ,  Cheolgeun An

IPC分类号： H05K1/00 ,  G02F1/1345 ,  H05K1/11 ,  H01L23/00 ,  H01R12/00 ,  H05K3/30 ,  H01L23/495 ,  H05K3/36

CPC分类号： H05K1/118 ,  G02F1/13458 ,  H01L23/49572 ,  H01L24/06 ,  H01L2224/50 ,  H01L2224/79 ,  H01L2224/86 ,  H01L2225/06579 ,  H01L2225/107 ,  H05K1/111 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/058 ,  H05K2201/094 ,  H05K2201/09418 ,  H05K2203/04 ,  Y02P70/611

摘要： Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

公开(公告)号：US09899300B2

公开(公告)日：2018-02-20

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji Fujii ,  Yasumasa Kasuya ,  Mamoru Yamagami ,  Naoki Kinoshita ,  Motoharu Haga

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20170345763A1

公开(公告)日：2017-11-30

申请号：US15505901

申请日：2014-09-26

申请人： INTEL CORPORATION

发明人： Bok Eng CHEAH ,  Jackson Chung Peng KONG ,  Shanggar PERIAMAN ,  Michael SKINNER ,  Yen Hsiang CHEW ,  Kheng Tat MAR ,  Ridza Effendi ABD RAZAK ,  Kooi Chi OOI

IPC分类号： H01L23/538 ,  H01L25/065 ,  H01L21/48

CPC分类号： H01L23/5387 ,  H01L21/4846 ,  H01L23/3736 ,  H01L23/49572 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/18 ,  H01L24/19 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73259 ,  H01L2924/15311

摘要： A flexible packaging architecture is described that is suitable for curved package shapes. In one example a package has a first die, a first mold compound layer over the first die, a wiring layer over the first mold compound layer, a second die over the wiring layer and electrically coupled to the wiring layer, and a second mold compound layer over the second die.

公开(公告)号：US20170323838A1

公开(公告)日：2017-11-09

申请号：US15655070

申请日：2017-07-20

申请人： Murata Manufacturing Co., Ltd.

发明人： Yoshihito OTSUBO ,  Muneyoshi YAMAMOTO ,  Norio SAKAI

IPC分类号： H01L23/14 ,  H01L23/48 ,  H05K1/18 ,  H01L23/495 ,  H01L23/28 ,  H01L29/41 ,  H01L23/52 ,  H01L23/498

CPC分类号： H01L23/14 ,  H01L21/561 ,  H01L23/13 ,  H01L23/28 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49572 ,  H01L23/49827 ,  H01L23/52 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L29/41 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/188 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/1316 ,  H01L2224/81 ,  H01L2924/00012

摘要： An electronic circuit module includes a circuit board, electronic components, an embedding layer, and a conductive film. The circuit board has a first principal surface, a second principal surface and a side surface, and includes a pattern conductor and a via conductor. The conductive film is connected to a conduction path to a ground electrode. The side surface includes a first region, a second region having a longer circumferential length than the first region, and a connection region connecting the first region and the second regions. The conductive film is formed on a region including at least part of each of an outer surface of the embedding layer, the first region, and the connection region. The conductive film formed on at least part of the connection region is connected to an exposed portion in the connection region of the via conductor included in the conduction path to the ground electrode.

公开(公告)号：US09812800B2

公开(公告)日：2017-11-07

申请号：US14883478

申请日：2015-10-14

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Cheong Hun Lee ,  Seung-Won Kuk ,  Chung Hui Lee ,  Sang Hyuk Kim ,  Yong Nam Shin ,  Seon Jeong Yun

IPC分类号： H05K1/00 ,  H01R12/77 ,  H05K5/00 ,  G02F1/1345 ,  H05K1/02 ,  H05K1/11 ,  H01L23/495 ,  H05K1/14 ,  H05K3/46 ,  H05K1/18

CPC分类号： H01R12/771 ,  G02F1/13452 ,  G02F1/13458 ,  H01L23/49572 ,  H01L2224/50 ,  H01L2225/107 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/10681

摘要： An exemplary embodiment provides a conductive connecting member, and a display device including the same, that includes a flexible elongated body and terminals formed at opposite ends of the body to be electrically connected to the body, wherein the body may include terminal areas in which the terminals are formed and a central area disposed between the terminal areas, and wherein two or more recess portions may be formed in edges of the body within the central area of the body.

公开(公告)号：US09754803B2

公开(公告)日：2017-09-05

申请号：US14217969

申请日：2014-03-18

申请人： SEIKO EPSON CORPORATION

发明人： Manabu Kondo

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/34 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H03H9/10 ,  H01L23/00

CPC分类号： H01L21/4842 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/345 ,  H01L23/49572 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83102 ,  H03H9/10 ,  Y10T29/4913 ,  H01L2924/00014

摘要： An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

公开(公告)号：US20170194234A1

公开(公告)日：2017-07-06

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US09543235B2

公开(公告)日：2017-01-10

申请号：US14875672

申请日：2015-10-05

申请人： Amkor Technology, Inc.

发明人： Hyung Il Jeon ,  Ji Young Chung ,  Byong Jin Kim ,  In Bae Park ,  Jae Min Bae ,  No Sun Park

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49572 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13014 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13138 ,  H01L2224/13147 ,  H01L2224/16013 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/014 ,  H01L2924/00014

摘要： In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

摘要翻译： 在一个实施例中，电子封装结构包括具有第一宽度的引线。 一种在主表面上具有导电凸块的电子芯片，所述导电凸块具有大于所述第一宽度的第二宽度。 导电凸块附接到引线，使得导电凸块的一部分延伸到至少部分地围绕引线的侧表面。 模塑复合树脂封装电子芯片，导电凸块和引线的至少一部分。 引线被配置为加强引线和导电凸块之间的接合力。

公开(公告)号：US09532460B2

公开(公告)日：2016-12-27

申请号：US14366503

申请日：2012-10-30

申请人： Robert Bosch GmbH

发明人： Thomas Meier ,  Ingo Mueller-Vogt

IPC分类号： H05H1/14 ,  H05K1/18 ,  H01L23/31 ,  H05K1/14 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K3/28 ,  H01L23/00

CPC分类号： H05K1/185 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0207 ,  H05K1/0298 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/284 ,  H05K5/0082 ,  H01L2924/00012

摘要： A transmission control module includes a printed circuit board. The circuit board has conductor tracks routed on at least one layer of the circuit board and configured to electrically connect a carrier substrate to electrical components. The circuit board has an inner conductor track layer arranged between two insulating layers. A first outer insulating layer, at least on a first side of the circuit board, has a recess. Surfaces of conductor track sections of conductor tracks of the at least one inner conductor track layer are arranged at the bottom of the recess. The carrier substrate is inserted into the recess and makes electrical contact with the surfaces of the conductor track sections. The recess is filled with a moulding compound which covers at least the carrier substrate and the conductor track sections to protect the carrier substrate and the conductor track sections from transmission fluid.

摘要翻译： 变速器控制模块包括印刷电路板。 电路板具有在电路板的至少一层上布线的导体迹线，并且被配置为将载体基板电连接到电气部件。 电路板具有布置在两个绝缘层之间的内导体轨道层。 至少在电路板的第一侧上的第一外部绝缘层具有凹部。 至少一个内部导体轨道层的导体轨道的导体轨道部分的表面布置在凹部的底部。 载体基板插入凹部并与导体轨道部分的表面电接触。 凹部填充有至少覆盖载体基板和导体轨道部分的模制化合物，以保护载体基板和导体轨道部分免受透射流体的影响。