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公开(公告)号：US10435594B2
公开(公告)日：2019-10-08
申请号：US15561808
申请日：2016-03-29
Applicant: TESA SE
Inventor： Anna Blazejewski , Axel Burmeister , Franciska Lohmann , Anika Petersen
IPC: C09J7/38 , C09J7/10 , C09J7/20 , C09J5/00 , C09J11/08 , C09J153/02 , C09J5/08 , C08K5/01 , C08K7/20 , B29B7/48
Abstract: The invention relates to a pressure-sensitive adhesive strip, for the residue-free and nondestructive removal by which by substantially expanding it in the plane of adhesion, comprising an adhesive compound layer, said adhesive compound layer consisting of a pressure-sensitive adhesive compound, constituted by vinyl aromatic block copolymers and adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and a softening point (ring & ball) of greater than or equal to 70° C., preferably greater than or equal to 100° C., and the pressure-sensitive adhesive compound being foamed.
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公开(公告)号：US20220056312A1
公开(公告)日：2022-02-24
申请号：US17404258
申请日：2021-08-17
Applicant: TESA SE
Inventor： Franziska Czerwonatis , Axel Burmeister , Ingo Neubert , Anna Blazejewski , Jessica Bulda
Abstract: The present invention relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked thermoplastic polyurethane that has typically been produced by means of extrusion and has a Shore A hardness of not more than 87, where the carrier has a ratio of force at 400% elongation F400% to breaking force Fbreak of not more than 45%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fstrip to breaking force Fbreak of less than 60%. The invention also relates to an adhesive tape of thickness 40 to 300 μm that can be redetached without residue or destruction by stretching essentially in the plane of the bond, comprising at least one carrier of thickness 10 to 150 μm comprising at least one layer based on preferably uncrosslinked polyurethane that has been produced from a dispersion and has a modulus at 100% elongation of not more than 1.8 MPa, where the carrier has a ratio of force at 400% elongation F400% to breaking force Fbreak of not more than 30%, and on which a pressure-sensitive adhesive layer is disposed on at least one side, and wherein the adhesive tape has a ratio of stripping force Fstrip to breaking force Fbreak of less than 60%. The invention also relates to a process for producing the adhesive tapes and to the use thereof for bonding of components in electronic devices.
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公开(公告)号：US10759974B2
公开(公告)日：2020-09-01
申请号：US16551109
申请日：2019-08-26
Applicant: tesa SE
Inventor： Anna Blazejewski , Axel Burmeister , Franciska Lohmann , Anika Petersen
IPC: C09J7/38 , C09J7/10 , C09J7/20 , C09J5/08 , C09J153/02 , C09J11/08 , C08K5/01 , C08K7/22 , B29B7/48
Abstract: Pressure-sensitive adhesive (PSA) strips, configured or adapted for the residue-free and non-destructive removal by which by substantially expanding it in the plane of adhesion, are provided. The PSA strips comprise at least one adhesive compound layer consisting of a PSA compound, constituted by vinyl aromatic block copolymers and one or more adhesive resins, at least 75 wt.-% (relative to the total amount of resin) of a resin being selected that has a DACP (diacetone alcohol cloud point) of greater than −20° C., and a softening point (ring & ball) of greater than or equal to 70° C., and the PSA compound has being foamed.
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公开(公告)号：US10669455B2
公开(公告)日：2020-06-02
申请号：US15674765
申请日：2017-08-11
Applicant: TESA SE
Inventor： Anna Blazejewski , Axel Burmeister , Franciska Lohmann , Anika Petersen
Abstract: The invention relates to a pressure-sensitive adhesive strip composed of at least three layers, comprising an inner layer F composed of a non-extensible film carrier, a layer SK1 composed of a self-adhesive composition arranged on one of the surfaces of the film carrier layer F and based on a vinylaromatic block copolymer composition foamed with microballoons, a layer SK2 composed of a self-adhesive composition arranged on the opposite surface of the film carrier layer F from the layer SK1 and based on a vinylaromatic block copolymer composition foamed with microballoons, where the mean diameter of the voids formed by the microballoons in the self-adhesive composition layers SK1 and SK2 is independently 20 to 60 μm.
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