公开(公告)号：US06852574B1

公开(公告)日：2005-02-08

申请号：US10638181

申请日：2003-08-11

申请人： Guan Keng Quah ,  Darrell D. Truhitte

发明人： Guan Keng Quah ,  Darrell D. Truhitte

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01I21/44 ,  H01L21/50 ,  H01I21/48

CPC分类号： H01L21/4842 ,  H01L21/565 ,  H01L23/49548 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a leadframe (10) provides blocking fulcrums (21,23) adjacent to the leads (12,13,14, and 15). During the process of encapsulating the leadframe (10), the blocking fulcrums (21,23) restrict encapsulating material from exiting the mold cavity and from attaching to the leads (12,13,14, and 15).

摘要翻译： 形成引线框架（10）的方法提供邻近引线（12,13,14和15）的阻挡支点（21,23）。 在封装引线框架（10）的过程中，阻塞支点（21,23）限制密封材料离开模腔并且不附着到引线（12,13,14和15）。

公开(公告)号：US06897097B2

公开(公告)日：2005-05-24

申请号：US10669564

申请日：2003-09-25

申请人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

发明人： Takao Matsuura ,  Yoshihiko Yamaguchi ,  Shouichi Kobayashi ,  Kouji Tsuchiya

IPC分类号： H01L23/12 ,  H01L21/301 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/48 ,  H01L23/50 ,  H01I21/44 ,  H01L21/50 ,  H01I21/48

CPC分类号： H01L23/3107 ,  H01L21/4835 ,  H01L21/4842 ,  H01L21/565 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

摘要翻译： 半导体器件包括：用于支撑半导体芯片的桶; 通过用树脂密封半导体芯片形成的密封体; 多个由铜合金制成的引线，暴露于密封体的背面，并且在暴露的安装面上具有焊接层; 以及用于连接半导体芯片的焊盘和相应引线的导线。 在制造方法中，密封体在树脂成形后用刷子在其背面进行抛光，以形成从密封体的背面露出的两个宽度方向的边缘部分，使其成为圆形面，以及 包括圆形面的引线的安装面在其中心部分处从密封体的背面突出，从而提高了封装时的连接可靠性。