摘要:
A reverse staggered type silicon thin film transistor includes a substrate having a gate electrode; a gate insulating layer on the substrate and the gate electrode, the gate insulating layer having a transistor-forming portion; a lower layer silicon film on the transistor-forming portion of the gate insulating layer and in contact therewith, the lower layer silicon film being formed at a first temperature and with a first thickness; an upper layer silicon film formed on the transistor-forming portion of the gate insulating layer at a second temperature which is lower than the first temperature and with a second thickness greater than the first thickness; an n-type silicon layer on the upper layer silicon film and in contact therewith; a source electrode on the n-type silicon layer; and a drain electrode on the n-type silicon layer.
摘要:
A reverse staggered amorphous silicon thin film transistor array substrate includes an array of amorphous silicon thin film transistors, gate wiring interconnecting the gate electrodes of the amorphous silicon thin film transistors, and source wirings. The transistor array is provided on a thin film transistor array substrate. A protective insulation layer and an amorphous silicon layer having a greater width than the source wiring are provided under the source wiring.
摘要:
A semiconductor device has a fuse element formed on an insulating substrate, and a first insulating layer formed on the substrate and covering the fuse element. Further insulation on the first insulating layer nitride has an opening exposing the region of the first insulating layer above said fuse.