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公开(公告)号:US20210101258A1
公开(公告)日:2021-04-08
申请号:US17126338
申请日:2020-12-18
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Jiashu LI
Abstract: A grinding wheel assembly is disclosed and includes an arbor in which a pull stud may be installed. Further, the arbor can include a head assembly that includes a mounting plate, a cover plate, and an abrasive body disposed there between. The abrasive is removably engaged with the mounting plate and the cover plate.
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公开(公告)号:US10946499B2
公开(公告)日:2021-03-16
申请号:US15799077
申请日:2017-10-31
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Srinivasan Ramanath , William H. Lane , Rachana Upadhyay , Michael P. Hitchiner
IPC: B24D3/10
Abstract: An abrasive article configured to grind a workpiece having a fracture toughness of at least about 5.5 MPa·m0.5 may include a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of VAG/VBM of at least about 1.3, wherein VAG is a volume percent of abrasive particles within a total volume of the body and VBM is a volume percent of bond material within the total volume of the body, and wherein the abrasive particles have an average particle size of at least about 1 micron and not greater than about 20 microns.
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公开(公告)号:US20210008690A1
公开(公告)日:2021-01-14
申请号:US17037026
申请日:2020-09-29
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Jianna WANG , Shih-Chieh KUNG , Timothy E. SCOVILLE , Shyiguei HSU , Fernando J. RAMIREZ , Zhong XU
Abstract: The present disclosure relates to abrasive articles that include abrasive aggregates of silicon carbide with a vitrified bond, and methods of making and using such abrasive articles and abrasive aggregates. In particular, the abrasive aggregates can possess a combination of beneficial properties and comprise a vitreous binder composition having a specific composition, sintering temperature, glass transition temperature, or a combination thereof.
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公开(公告)号:US20210001452A1
公开(公告)日:2021-01-07
申请号:US16914004
申请日:2020-06-26
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Ji XIAO , Aiyun LUO , Gwenaëlle RINGENBACH , Ignazio GOSAMO , Lise LAUVERGEON
Abstract: An abrasive article can include an abrasive component including a body. The body can include a bond matrix and abrasive particles contained in the bond matrix. In an embodiment, the body can include an interconnected phase extending through at least a portion of the bond matrix. The body can include a discontinuous phase including a plurality of discrete members. At least one of the discrete member can include a macroscopic pore. In another embodiment, the body can include a porosity of at least 15 vol % for a total volume of the body.
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公开(公告)号:US20200316754A1
公开(公告)日:2020-10-08
申请号:US16840312
申请日:2020-04-03
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Robin Chandras JAYARAM , Arunvel THANGAMANI
Abstract: An abrasive article includes a body and an electronic assembly coupled to the body, the electronic assembly including an electronic device, and a first portion between the body and the communication device, the first portion having a material of an average relative magnetic permeability of not greater than 15.
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公开(公告)号:US10589402B2
公开(公告)日:2020-03-17
申请号:US16010638
申请日:2018-06-18
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Naresh Saha , Varadharajan Ranganathan , Sabine Schmidt
Abstract: An abrasive article is provided that may include a body. The body may include a bond component and abrasive particles within the bond component. The bond component may include a Fe—Co—Cu—Ni—Sn based bond material and a performance enhancing material. The performance enhancing material may include hex-boron nitride. The content of the performance enhancing material may be at least about 6 vol. % and not greater than about 14 vol. % for a total volume of the bond component.
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公开(公告)号:US20200023494A1
公开(公告)日:2020-01-23
申请号:US16519797
申请日:2019-07-23
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Lenny C. SALES , Trent GRAHAM , Lucie FRAICHARD , Cecile O. MEJEAN , Anton COTTRILL
Abstract: An abrasive article including a substrate, a first bonding material including metal overlying the substrate, abrasive particles overlying the substrate and coupled to the first bonding material, and a second bonding material including a metal and phosphorus overlying at least a portion of the first bonding material.
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公开(公告)号:US10449659B2
公开(公告)日:2019-10-22
申请号:US15223306
申请日:2016-07-29
Applicant: SAINT-GOBAIN ABRASIVES, INC. , SAINT-GOBAIN ABRASIFS
Inventor: Srikant Gollapudi , Naresh Saha , Adiseshaiah K. Sathyanarayanaiah
IPC: C09K3/14 , B24D3/00 , B24D3/28 , B24D3/06 , B24D3/02 , B24D11/00 , B24D18/00 , B24D7/02 , B24D5/02
Abstract: An abrasive article including a bonded abrasive body coupled to a core, the core includes a composite material including an organic material and a metallic material, and the composite material includes at least a first filler that can include nitrides, carbides, borides, oxides, silicates, or a combination thereof.
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公开(公告)号:US10434626B2
公开(公告)日:2019-10-08
申请号:US14431842
申请日:2013-09-27
Applicant: Saint-Gobain Abrasives, Inc. , Saint-Gobain Abrasifs
Inventor: Christophe Huber , Christopher Arcona , Robin Bright
Abstract: A method of conducting a material removal operation using a grinding system including moving an abrasive article relative to a workpiece, detecting a change in a dimension of the abrasive article during moving, and reducing resonance vibrations in the grinding system.
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公开(公告)号:US20190224813A1
公开(公告)日:2019-07-25
申请号:US16300435
申请日:2017-05-10
Applicant: SAINT-GOBAIN ABRASIVES, INC , SAINT-GOBAIN ABRASIFS
Inventor: Zehua SHI
Abstract: An abrasive article can include a body including a bond material and abrasive particles contained within the bond material. The bond material can include an organic material including a resin, particularly a phenolic resin. A methylene bridge can be present at para or ortho sites of aromatic phenolic rings. The bond material can include an average ortho to para substituent ratio for the methylene bridge within a range including at least 1.5:1 and not greater than 9:1, particularly, within a range including at least 3 and not greater than 6.9.
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