Digital certificate based theft control for computers
    91.
    发明申请
    Digital certificate based theft control for computers 审中-公开
    基于数字证书的电脑盗窃控制

    公开(公告)号:US20080229433A1

    公开(公告)日:2008-09-18

    申请号:US11717236

    申请日:2007-03-13

    申请人: Richard Chen

    发明人: Richard Chen

    IPC分类号: G08B29/00

    CPC分类号: G06F21/575 G06F21/88

    摘要: A theft control system may be implemented between a server and a client. The server may provide a certificate which must be periodically renewed. Execution of the certificate may be controlled by a trusted platform module on the client under control of a theft control controller.

    摘要翻译: 盗窃控制系统可以在服务器和客户端之间实现。 服务器可以提供必须定期更新的证书。 证书的执行可以由在盗窃控制控制器的控制下的客户端上的可信平台模块来控制。

    Power supply early warning device for pulling out a power plug
    92.
    发明授权
    Power supply early warning device for pulling out a power plug 有权
    用于拔出电源插头的电源预警装置

    公开(公告)号:US07414860B1

    公开(公告)日:2008-08-19

    申请号:US11790089

    申请日:2007-04-23

    申请人: Richard Chen

    发明人: Richard Chen

    IPC分类号: H05K7/14 H05K7/18

    CPC分类号: H05K5/0208 G06F1/188

    摘要: A power supply early warning device for pulling out a power plug is composed of a power supply, which is loosely connected with a handle, with the handle being installed with a locking hole. A long through-hole is installed at a side edge of the power socket, and a locking member is provided with a pushing plate, with an end of which being formed with a projection piece. the locking member is installed with a locking plate which can be locked or loosely connected into the long through-hole, and the pushing plate can be slidingly displaced on an outer wall of a rim of the long through-hole, allowing the projected piece to be locked into or released from the locking hole of the handle, so as to prevent from a deformation or a short-circuiting between the power plug and the socket by a dragging of external force, and to further enable a user to displace the power supply more safely, without damaging the entire power supply system.

    摘要翻译: 用于拉出电源插头的电源预警装置由与手柄松动连接的电源组成,手柄上安装有锁定孔。 一个长的通孔安装在电源插座的侧边缘处,锁定件设置有一个推板,其端部形成一个突出片。 锁定构件安装有可以被锁定或松动地连接到长通孔中的锁定板,并且推板可以在长通孔的边缘的外壁上滑动移位,从而允许突出件 被锁定在手柄的锁定孔中或从手柄的锁定孔释放,以便通过外力的拖动来防止电源插头和插座之间的变形或短路,并且进一步使用户能够使电源 更安全,而不会损坏整个电源系统。

    Positioning device for fixing an interface card on a computer casing without using screws
    93.
    发明授权
    Positioning device for fixing an interface card on a computer casing without using screws 有权
    定位装置,用于将接口卡固定在计算机外壳上,而不用螺丝

    公开(公告)号:US07402072B1

    公开(公告)日:2008-07-22

    申请号:US11790086

    申请日:2007-04-23

    申请人: Richard Chen Alan Lee

    发明人: Richard Chen Alan Lee

    IPC分类号: H01R13/64

    CPC分类号: H05K7/1408 G06F1/183

    摘要: A positioning device for fixing an interface card on a computer casing without using screws, is composed of a vertical wall board of a computer casing, which is provided with long through-holes; fixing seats, which are connected on an interface of the vertical wall board, and are provided with shaft holes and one movable groove; elastic members, which are provided with shaft holes and spring leaves, and are emplaced into the movable grooves; a shaft, which is connected on the fixing seats and the elastic members; and an interface card is provided with a cover, with an end of the cover being provided with an outer board. When the elastic member is subjected to force to rotate, the spring leaf will be abutted on the outer board. When the elastic member rotates reversely, the spring leaf will be escaped from the outer board, and the cover and the interface card can be removed from the vertical wall board simultaneously.

    摘要翻译: 一种用于将接口卡固定在计算机外壳上而不使用螺钉的定位装置由设置有长通孔的计算机外壳的垂直壁板组成; 固定座,连接在垂直壁板的接口上,并设有轴孔和一个可移动槽; 弹性构件,其设置有轴孔和弹簧片,并且被放置在可动凹槽中; 连接在固定座和弹性构件上的轴; 并且接口卡设置有盖,所述盖的端部设置有外板。 当弹性构件受力转动时,弹簧片将与外板相接。 当弹性构件反向旋转时,弹簧片将从外板逸出,并且盖和接口卡可以同时从垂直壁板移除。

    Medium Time Allocation and Scheduling Using Iso-Zone Structured Superframe for Qos Provisioning in Wireless Networks
    94.
    发明申请
    Medium Time Allocation and Scheduling Using Iso-Zone Structured Superframe for Qos Provisioning in Wireless Networks 有权
    使用等区域结构化超帧进行中等时间分配和调度,用于无线网络中的Qos配置

    公开(公告)号:US20080144597A1

    公开(公告)日:2008-06-19

    申请号:US11912516

    申请日:2006-04-24

    申请人: Richard Chen

    发明人: Richard Chen

    IPC分类号: H04J3/00

    摘要: Allocation of contiguous blocks of airtime for data or airtime transmission can lead to large maximum service intervals for an application stream. This may result in a large delay bound where large blocks of contiguous MAS blocks other applications from meeting their low-latency requirements. A method and network that overcomes at least the shortcomings of known methods includes transmitting information over a wireless network. This includes the steps of: organizing the shared medium into periodical superframes; organizing the superframe into allocation zones; organizing the allocation zones into iso-zones; generating an allocation map; determining a periodic service interval and medium time based on a TSPEC including a latency requirement of an application stream, and local resource of the transmitting device; searching for transmission opportunity that accommodates the periodic service interval and the medium time required based on the allocation map; transmitting information in the superframe upon finding transmission opportunity in the searching step.

    摘要翻译: 对于数据或通话时间传输,连续的通话时间块的分配可能导致应用流的大的最大服务间隔。 这可能导致大的延迟约束,其中大块连续的MAS阻止其他应用程序满足其低延迟要求。 克服至少已知方法的缺点的方法和网络包括通过无线网络发送信息。 这包括以下步骤:将共享介质组织成定期超帧; 将超帧组织到分配区域; 将分配区划分为等级区; 生成分配图; 基于包括应用流的等待时间需求的TSPEC以及所述发送设备的本地资源来确定周期性服务间隔和中等时间; 根据分配图寻找适应周期性服务间隔和中等时间的传输机会; 在搜索步骤中发现传播机会时在超帧中传送信息。

    Microprobe Tips and Methods for Making
    95.
    发明申请
    Microprobe Tips and Methods for Making 审中-公开
    微型技巧和制作方法

    公开(公告)号:US20080108221A1

    公开(公告)日:2008-05-08

    申请号:US11931308

    申请日:2007-10-31

    IPC分类号: H01L21/44

    CPC分类号: C25D1/00 C25D1/003 C25D7/123

    摘要: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.

    摘要翻译: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中,尖端由与探针本身相同的建筑材料形成,而在其它实施例中,尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中,尖端在探针的主要部分之前形成,并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生,包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制,通过在曝光的光致抗蚀剂中形成的空隙中模制,通过在牺牲材料中的空隙中模制, 由于牺牲材料通过电介质材料的细小尺寸和定位的区域,经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

    Modularized redundant heat sink for dissipating heat generated from chips
    96.
    发明授权
    Modularized redundant heat sink for dissipating heat generated from chips 有权
    模块化冗余散热器,用于散发芯片产生的热量

    公开(公告)号:US07310226B2

    公开(公告)日:2007-12-18

    申请号:US11283974

    申请日:2005-11-22

    IPC分类号: H05K7/20

    摘要: A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

    摘要翻译: 用于散发由芯片产生的热量的模块化冗余散热器包括独立的矩形翅片,其侧面设置有至少两个以上的弹性销,并且其设置有用于传导温度的底面; 焊接有至少两个具有上表面的芯片的电路板。 翅片的底表面通过导热胶附接到至少两个芯片的上表面,以便通过一个翅片提供至少多于两个芯片的温度传导和散热。

    Spinal implant loading block with multiple orientations
    97.
    发明申请
    Spinal implant loading block with multiple orientations 审中-公开
    具有多个取向的脊柱植入物加载块

    公开(公告)号:US20070270966A1

    公开(公告)日:2007-11-22

    申请号:US11414833

    申请日:2006-04-28

    申请人: Richard Chen

    发明人: Richard Chen

    IPC分类号: A61F2/44

    摘要: Spinal implant systems, apparatus, and methods of use are provided. One such apparatus for holding an implantable spinal device includes a base having a generally flat first surface and a second surface spaced apart from the first surface. The base has a third surface between the first and second surfaces and generally orthogonal to at least one of the first and second surfaces. The base further includes a fourth surface spaced apart from the third surface. At least one cavity is provided in the base, with the cavity being accessible through the base second and fourth surfaces, and adapted to receive the implantable spinal device. In some embodiments, the spinal implant has an opening accessible through the fourth surface when the spinal device is positioned in the cavity. In this manner, bony growth-promoting substances may be inserted into the implant when the implant is positioned in the apparatus.

    摘要翻译: 提供脊柱植入系统,装置和使用方法。 用于保持可植入脊柱装置的一种这样的装置包括具有大致平坦的第一表面的基部和与第一表面间隔开的第二表面。 基座在第一和第二表面之间具有第三表面,并且大致垂直于第一和第二表面中的至少一个。 底座还包括与第三表面间隔开的第四表面。 至少一个空腔设置在基座中,空腔可通过底座第二和第四表面接近,并适于接纳可植入脊柱装置。 在一些实施例中,当脊柱装置定位在空腔中时,脊柱植入物具有通过第四表面可接近的开口。 以这种方式,当植入物定位在装置中时,可将骨生长促进物质插入到植入物中。

    Assembly device for a computer case and outer cover
    98.
    发明申请
    Assembly device for a computer case and outer cover 有权
    电脑外壳和外盖的组装装置

    公开(公告)号:US20070236876A1

    公开(公告)日:2007-10-11

    申请号:US11400183

    申请日:2006-04-10

    IPC分类号: G06F1/16

    CPC分类号: G06F1/181

    摘要: An assembly device for a computer case and outer cover incorporating: a host case provided with a bottom plate and perpendicular left and right side walls; a circuit motherboard fixed within the holding space, a jack panel of relatively small area and size is located at a tail end of the circuit motherboard, and an electrical circuit is printed on an inverse side of the jack panel; a rectangular outer cover; The outer cover can be assembled/disassembled to/from the rectangular gap of the host case, and the jack panel can be plugged into or withdrawn from the socket, thereby realizing a rapid and convenient method of assembling and disassembling the outer cover to and from the host case.

    摘要翻译: 一种用于计算机外壳和外盖的组装装置,包括:主壳,其具有底板和垂直的左右侧壁; 固定在保持空间内的电路母板,面积相对较小的插座面板和尺寸位于电路母板的尾端,电路印刷在插座面板的相反侧; 矩形外盖; 外盖可以与主机的矩形间隙组装/拆卸,并且插座面板可以插入插座或从插座中取出,从而实现快速方便地将外盖组装和拆卸的方法 主机箱。

    Cantilever microprobes for contacting electronic components and methods for making such probes
    99.
    发明申请
    Cantilever microprobes for contacting electronic components and methods for making such probes 有权
    用于接触电子部件的悬臂微探针和用于制造这种探针的方法

    公开(公告)号:US20070205374A1

    公开(公告)日:2007-09-06

    申请号:US11636147

    申请日:2006-12-07

    IPC分类号: G01K1/08 H01J3/14

    摘要: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

    摘要翻译: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地,实施例涉及两部分探针元件,可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中,例如,探针在安装结构中具有滑动,在安装结构中扭转,包括柔顺元件的安装结构等。

    Pin-type probes for contacting electronic circuits and methods for making such probes
    100.
    发明申请
    Pin-type probes for contacting electronic circuits and methods for making such probes 审中-公开
    用于接触电子电路的针型探针和制造这种探针的方法

    公开(公告)号:US20070109004A1

    公开(公告)日:2007-05-17

    申请号:US11650206

    申请日:2007-01-03

    IPC分类号: G01R31/02

    摘要: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

    摘要翻译: 提供引脚探针和引脚探针阵列,其允许用选定的电子电路部件进行电接触。 一些实施例包括位于护套内的一个或多个柔性销元件。 一些实施例包括销探针,其包括可用于将探针的引脚部分固定到护套中的锁定或闭锁元件。 一些实施例提供使用多层电化学制造方法制造探针。