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91.发明申请公开(公告)号：US20190103585A1
公开(公告)日：2019-04-04
申请号：US16192066
申请日：2018-11-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
Abstract: A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and the light-emitting element, with a gap left between the partition and the bonding layer. A pair of substrates overlap with each other under a reduced-pressure atmosphere and then exposed to an air atmosphere or a pressurized atmosphere, whereby the reduced-pressure state of a space surrounded by the pair of substrates and the partition is maintained and atmospheric pressure is applied to the pair of substrates. Alternatively, a light-emitting element and a bonding layer are formed over a substrate. A pair of substrates overlap with each other, and then, pressure is applied to the bonding layer with the use of a member having a projection before or at the same time as curing of the bonding layer.
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公开(公告)号：US10164219B2
公开(公告)日：2018-12-25
申请号：US15671453
申请日：2017-08-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tomoya Aoyama , Akihiro Chida , Ryu Komatsu
Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.
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93.发明授权公开(公告)号：US10135037B2
公开(公告)日：2018-11-20
申请号：US15897191
申请日：2018-02-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
Abstract: A highly reliable light-emitting device is provided. A yield in a manufacturing process of a light-emitting device is increased. A light-emitting device is provided in which a non-light-emitting portion having a frame-like shape outside a light-emitting portion includes a portion thinner than the light-emitting portion. A light-emitting element and a bonding layer are formed over a substrate. The light-emitting element is sealed by overlapping a pair of substrates and curing the bonding layer. Then, while the cured bonding layer is heated, pressure is applied to at least a portion of the non-light-emitting portion with a member having a projection.
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公开(公告)号：US09978981B2
公开(公告)日：2018-05-22
申请号：US15259325
申请日：2016-09-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L51/52 , H01L33/62 , H01L51/00 , H01L51/56 , H01L27/12 , H01L27/32 , H01L33/20 , H01L33/48 , H01L33/00
CPC classification number: H01L51/5203 , H01L27/1214 , H01L27/1266 , H01L27/3276 , H01L33/005 , H01L33/20 , H01L33/483 , H01L33/62 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2224/4847 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
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公开(公告)号：US20180026228A1
公开(公告)日：2018-01-25
申请号：US15707383
申请日：2017-09-18
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida , Tomoya Aoyama
IPC: H01L51/52
Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.
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Patent Agency Ranking
公开(公告)号：US09799682B2
公开(公告)日：2017-10-24
申请号：US14597548
申请日：2015-01-15
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
CPC classification number: H01L27/1244 , H01L21/02554 , H01L21/02565 , H01L21/02631 , H01L27/1225 , H01L27/1266 , H01L2227/323 , H01L2227/326
Abstract: An object is to provide a manufacturing method of a semiconductor device in which a defect in characteristics due to a crack occurring in a semiconductor device is reduced. Provision of a crack suppression layer formed of a metal film in the periphery of a semiconductor element makes it possible to suppress a crack occurring from the outer periphery of a substrate and reduce damage to the semiconductor element. In addition, even if the semiconductor device is subjected to physical forces from the outer periphery in separation and transposition steps, progression (growth) of a crack to the semiconductor device can be suppressed by the crack suppression layer.
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公开(公告)号：US09780070B2
公开(公告)日：2017-10-03
申请号：US14728134
申请日：2015-06-02
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida , Yoshiaki Oikawa , Chiho Kawanabe
CPC classification number: H01L24/96 , H01L21/561 , H01L21/568 , H01L21/78 , H01L27/1262 , H01L2924/0002 , H01L2924/00
Abstract: A first semiconductor substrate is used which has a structure in which a peeling layer is not formed in a section subjected to a first dividing treatment, so that the peeling layer is not exposed at the end surface of a second semiconductor substrate when the second semiconductor substrate is cut out of the first semiconductor substrate. In addition, a supporting material is provided on a layer to be peeled of the second semiconductor substrate before the second semiconductor substrate is subjected to a second dividing treatment.
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公开(公告)号：US09444020B2
公开(公告)日：2016-09-13
申请号：US14943330
申请日：2015-11-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida
IPC: H01L21/00 , H01L33/62 , H01L33/48 , H01L51/00 , H01L51/52 , H01L51/56 , H01L27/12 , H01L27/32 , H01L33/20 , H01L33/00
CPC classification number: H01L51/5203 , H01L27/1214 , H01L27/1266 , H01L27/3276 , H01L33/005 , H01L33/20 , H01L33/483 , H01L33/62 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/56 , H01L2224/4847 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2924/0002 , H01L2924/12044 , H01L2933/0033 , H01L2933/0066 , H01L2924/00
Abstract: A highly reliable light-emitting device and a manufacturing method thereof are provided. A light-emitting element and a terminal electrode are formed over an element formation substrate; a first substrate having an opening is formed over the light-emitting element and the terminal electrode with a bonding layer provided therebetween; an embedded layer is formed in the opening; a transfer substrate is formed over the first substrate and the embedded layer; the element formation substrate is separated; a second substrate is formed under the light-emitting element and the terminal electrode; and the transfer substrate and the embedded layer are removed. In addition, an anisotropic conductive connection layer is formed in the opening, and an electrode is formed over the anisotropic conductive connection layer. The terminal electrode and the electrode are electrically connected to each other through the anisotropic conductive connection layer.
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公开(公告)号：US09431618B2
公开(公告)日：2016-08-30
申请号：US14459565
申请日：2014-08-14
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Takuya Kawata , Akihiro Chida
CPC classification number: H01L27/3227 , G06F1/1652 , H01L27/323 , H01L27/3244 , H01L51/0097 , H01L51/5237 , H01L51/56 , H01L2227/323 , H01L2251/5315 , H01L2251/533 , H01L2251/5338 , H01L2251/55 , Y02E10/549 , Y02P70/521 , Y10T428/10 , Y10T428/1086
Abstract: A display device, an electronic device, or a lighting device that is unlikely to be broken is provided. A flexible first substrate and a flexible second substrate overlap with each other with a display element provided therebetween. A flexible third substrate is bonded on the outer surface of the first substrate, and a flexible fourth substrate is bonded on the outer surface of the second substrate. The third substrate is formed using a material softer than the first substrate, and the fourth substrate is formed using a material softer than the second substrate.
Abstract translation: 提供了不太可能被破坏的显示装置，电子装置或照明装置。 柔性第一基板和柔性第二基板彼此重叠，在其间设置显示元件。 柔性第三基板接合在第一基板的外表面上，柔性第四基板接合在第二基板的外表面上。 使用比第一基板更软的材料形成第三基板，并且使用比第二基板更软的材料形成第四基板。
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公开(公告)号：US20160240822A1
公开(公告)日：2016-08-18
申请号：US15141157
申请日：2016-04-28
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Akihiro Chida , Kaoru Hatano , Tomoya Aoyama , Ryu Komatsu , Masatoshi Kataniwa
CPC classification number: H01L51/56 , H01L27/1225 , H01L27/3246 , H01L27/3276 , H01L51/5203 , H01L51/5237 , H01L51/5246 , H01L51/5253 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/5361
Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.
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