公开(公告)号：US07743514B2

公开(公告)日：2010-06-29

申请号：US12318126

申请日：2008-12-22

申请人： Sadaharu Oki ,  Shinji Hirabayashi ,  Kenji Kobayashi

发明人： Sadaharu Oki ,  Shinji Hirabayashi ,  Kenji Kobayashi

IPC分类号： B27B3/26

CPC分类号： B23D49/162

摘要： It is an object of the invention to provide a useful technique for reducing vibration of a handgrip and improving the cutting efficiency while achieving weight reduction of a reciprocating power tool. According to the invention, a representative reciprocating power tool is provided to comprise a body, a tool bit, an actuating mechanism, a handgrip. The handgrip and the body can rotate with respect to each other via a pivot in a direction crossing the direction of reciprocating linear motion of the tool bit. An elastic element is disposed between the handgrip and the body and serves to absorb vibration transmitted from the body to the handgrip by elastically receiving the relative rotation of the handgrip and the body. According to the invention, vibration in the handgrip can be reduced and the cutting efficiency can be improved without complicating the construction.

摘要翻译： 本发明的目的是提供一种用于减少手柄的振动并提高切割效率同时实现往复动力工具的减重的有用技术。 根据本发明，提供了一种代表性的往复动力工具，其包括主体，工具钻头，致动机构，手柄。 手柄和主体可以通过枢轴在与刀头的往复线性运动方向相交的方向上相对于彼此旋转。 弹性元件设置在手柄和本体之间，用于通过弹性地接收手柄和身体的相对旋转来吸收从身体传递到手柄的振动。 根据本发明，可以减少手柄中的振动，并且可以提高切割效率，而不会使施工复杂化。

公开(公告)号：US07676094B2

公开(公告)日：2010-03-09

申请号：US11032893

申请日：2005-01-11

申请人： Kenta Hoki ,  Yukimasa Tamatsu ,  Kenji Kobayashi

发明人： Kenta Hoki ,  Yukimasa Tamatsu ,  Kenji Kobayashi

IPC分类号： G06K9/48 ,  G06K9/00 ,  G06K9/46 ,  G06K9/66

CPC分类号： G06K9/4604 ,  B60Q1/085 ,  B60Q1/143 ,  B60Q2300/054 ,  B60Q2300/112 ,  B60Q2300/122 ,  B60Q2300/134 ,  B60Q2300/142 ,  B60Q2300/312 ,  B60Q2300/41 ,  G06K9/00791 ,  G06K2209/23 ,  G08G1/161

摘要： A road surface reflection detecting apparatus includes a road recognition unit for recognizing a road in a picture taken by a camera of a road existing in front of a vehicle. A road surface reflection detection unit extracts a picture from the road recognized by the road recognition unit and determines the degree of reflection of light from the surface of the road based on the picture extracted from the road. The picture includes the reflection of light beam radiated from vehicle headlights. If the reflection is determined to be high, the direction or intensity of the light beam from the vehicle headlights is regulated.

摘要翻译： 路面反射检测装置包括道路识别单元，用于识别由车辆前方存在的道路的照相机拍摄的图像中的道路。 路面反射检测单元从道路识别单元识别的道路中提取图像，并且基于从道路提取的图像来确定来自道路表面的光的反射度。 该图包括从车灯头辐射的光束的反射。 如果反射被确定为高，则调节来自车辆前灯的光束的方向或强度。

公开(公告)号：US07648169B2

公开(公告)日：2010-01-19

申请号：US11855833

申请日：2007-09-14

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： B62J27/00

CPC分类号： B62J27/00 ,  B62K2202/00 ,  B62K2204/00

摘要： A motorcycle includes a guard frame provided near an upper portion of a vehicle body of the motorcycle that is arranged to reduce or prevent damage to the components of the motorcycle in the event of an overturn of the motorcycle. The guard frame includes a pair of guard frame rails, each rail extending in a longitudinal direction of the vehicle body. A connecting portion connects the rear end portions of the rails. The front end portion of each rail is fixed to a body frame of the motorcycle. The connecting portion is supported by the body frame for pivotal movement about a pivot axis. The rails have a normal bow shape that projects outwardly. In some arrangements, an intermediate portion of each rail is formed of a material having lower rigidity than a material of the front and rear end portions of the rail.

摘要翻译： 摩托车包括设置在摩托车的车体的上部附近的防护框架，其被设置为在摩托车的翻倒的情况下减少或防止对摩托车的部件的损坏。 防护框架包括一对防护框架轨道，每个轨道沿着车体的纵向方向延伸。 连接部分连接轨道的后端部分。 每个轨道的前端部固定在摩托车的车架上。 连接部分由主体框架支撑以围绕枢转轴线枢转运动。 轨道具有向外突出的正常弓形状。 在一些布置中，每个轨道的中间部分由比轨道的前端部和后端部的材料刚性低的材料形成。

公开(公告)号：US07611600B2

公开(公告)日：2009-11-03

申请号：US11587853

申请日：2005-04-27

申请人： Masaki Tsujimoto ,  Takahisa Yoshioka ,  Kenji Kobayashi

发明人： Masaki Tsujimoto ,  Takahisa Yoshioka ,  Kenji Kobayashi

IPC分类号： B32B37/26 ,  B29C65/02 ,  B29C63/00 ,  C09J5/06 ,  B32B38/10 ,  B32B38/04

CPC分类号： H01L21/67132 ,  Y10T156/108 ,  Y10T156/11 ,  Y10T156/1195 ,  Y10T156/12 ,  Y10T156/16 ,  Y10T156/17 ,  Y10T156/19 ,  Y10T156/1994

摘要： A sticking apparatus 10 includes a sticking table 11 supporting a semiconductor wafer W and a sticking unit 12 sticking a heat sensitive adhesive sheet S to the semiconductor wafer W. The sticking unit 12 includes a peeling section that, when paying out a raw sheet L having adhesive sheet S laminated to one side face of a release liner PS, peels off the release liner PS and the adhesive sheet S and a sheet preliminary peeling unit 40 provided at an upstream side of the peeling section in a pay-out direction of the raw sheet. The sheet preliminary peeling unit 40 includes a moving member 50 that moves to and from in a state of being pinched between the release liner PS and the adhesive sheet S. The preliminarily peeled-off release liner PS and adhesive sheet S are temporarily re-bonded by a temporary re-bonding unit 41, enabling to stick the adhesive sheet S on the wafer W.

摘要翻译： 粘贴装置10包括支撑半导体晶片W的粘贴台11和将热敏粘合片S粘贴到半导体晶片W的粘贴单元12.粘贴单元12包括：剥离部，当将具有 将剥离衬垫PS的一个侧面层合的粘合片S剥离剥离衬垫PS和粘合片S，以及在原料的放出方向上设置在剥离部的上游侧的片材预剥离部40 片。 片材预剥离单元40包括在被剥离衬垫PS和粘合片S之间夹持的状态下移动的移动构件50.预先剥离的剥离衬垫PS和粘合片S暂时重新粘合 通过临时重新接合单元41，能够将粘合片S粘合在晶片W上。

公开(公告)号：US20090229735A1

公开(公告)日：2009-09-17

申请号：US12090202

申请日：2006-10-25

申请人： Hideaki Nonaka ,  Kenji Kobayashi

发明人： Hideaki Nonaka ,  Kenji Kobayashi

IPC分类号： B32B37/10

CPC分类号： H01L21/67132

摘要： A sheet sticking apparatus 10 comprises a sheet feed-out unit 12 that feeds out an adhesive sheet S to a position facing a surface of a semiconductor wafer W and a press roller 14 that presses the adhesive sheet S to stick the adhesive sheet S onto the wafer W. The sheet feed-out unit 12 includes a tension measuring means 35 for measuring a tension of the adhesive sheet S between the sheet feed-out unit 12 and the press roller 14 and a sticking angle maintaining means 37 provided with a feed-out head 49 for maintaining a sticking angle θ. After measuring and adjusting the tension immediately before sticking the adhesive sheet S, the feed-out head 49 is lowered in proportion to the movement amount of the press roller 14, thereby the sticking angle θ is maintained, and thus the tension is maintained at a constant level.

摘要翻译： 片材贴附装置10包括将粘合片S送出到面向半导体晶片W的表面的位置的片材供给单元12以及按压粘合片S以将粘合片S粘贴到其上的压辊14 片材送出单元12包括用于测量片材送出单元12和加压辊14之间的粘合片S的张力的张力测量装置35和设置有馈送单元12的粘贴角度保持装置37。 输出头49用于保持粘着角度θ。 在粘贴片S之前立即测量和调节张力之后，送出头49与按压辊14的移动量成比例地下降，从而保持粘着角θ，因此张力保持在 恒定水平。

公开(公告)号：US20090223638A1

公开(公告)日：2009-09-10

申请号：US11916788

申请日：2006-06-26

申请人： Hideaki Nonaka ,  Kenji Kobayashi

发明人： Hideaki Nonaka ,  Kenji Kobayashi

IPC分类号： H01L21/683

CPC分类号： H01L21/67132 ,  Y10T156/1343 ,  Y10T156/17 ,  Y10T156/1705

摘要： A sheet sticking apparatus comprises a sheet feed-out unit 12 including a peel plate 22 for peeling off an adhesive sheet S from a release liner PS; and a press roller 14 for pressing the adhesive sheet S onto a wafer W supported by a table 13 to stick the sheet thereto, wherein the peel plate 22 is supported movably forward and backward by a cylinder 50. The peel plate 22 is arranged so that the initial position of the front end is adjusted forward/backward corresponding to the size of the wafer W or the size of the table 13 supporting the same.

摘要翻译： 片材粘贴装置包括片材送出单元12，其包括用于从剥离衬垫PS剥离粘合片S的剥离板22; 以及用于将粘合片S按压到由桌子13支撑的晶片W上以将片材粘贴在其上的压辊14，其中剥离板22由圆柱体50可向前和向后可移动。剥离板22被布置成使得 前端的初始位置根据晶片W的大小或支撑该晶片W的台13的大小进行前后调整。

公开(公告)号：US20090151875A1

公开(公告)日：2009-06-18

申请号：US12067280

申请日：2006-10-05

申请人： Hideaki Nonaka ,  Kenji Kobayashi ,  Yoshiaki Sugishita

发明人： Hideaki Nonaka ,  Kenji Kobayashi ,  Yoshiaki Sugishita

IPC分类号： B32B38/10

CPC分类号： B26D3/10 ,  B26F1/3846 ,  H01L21/67132 ,  Y10T83/7684 ,  Y10T83/7688 ,  Y10T83/7693 ,  Y10T83/7697 ,  Y10T83/7701 ,  Y10T83/7705 ,  Y10T83/7709 ,  Y10T83/7713 ,  Y10T83/7718 ,  Y10T83/7722 ,  Y10T83/7726 ,  Y10T83/773 ,  Y10T156/1052 ,  Y10T156/12

摘要： A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.

摘要翻译： 在将切割装置15作为不需要的粘合片S1切断半导体晶片W外侧的区域之后，将粘合片S粘贴到半导体晶片W之后的片材切割台13.台13包括内台52， 半导体晶片W和与半导体晶片W外侧的不需要的粘合片S1对应的外台51.外台51的上表面设置有不可粘接的处理面51A，形成有环状部件 53或用于将粘合片S粘贴的板构件63。

公开(公告)号：US20090149019A1

公开(公告)日：2009-06-11

申请号：US12368693

申请日：2009-02-10

申请人： Kenji Kobayashi

发明人： Kenji Kobayashi

IPC分类号： H01L21/768

CPC分类号： H01L21/76801 ,  H01L21/76807 ,  H01L21/76819 ,  H01L21/76834 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device has a first interlayer insulating film formed on a substrate, having a first interconnection buried therein, and having a depressed portion and an insulating barrier film formed on the first interlayer insulating film. A second interlayer insulating film is formed to fill in the depressed portion, cover the upper surface of the insulating barrier film, and have a second interconnection buried therein.

摘要翻译： 半导体器件具有形成在基板上的第一层间绝缘膜，其具有埋在其中的第一互连，并且具有形成在第一层间绝缘膜上的凹陷部分和绝缘阻挡膜。 形成第二层间绝缘膜以填充凹陷部分，覆盖绝缘阻挡膜的上表面，并且其中埋设有第二互连。

公开(公告)号：US20090127145A1

公开(公告)日：2009-05-21

申请号：US11995452

申请日：2006-07-21

申请人： Hideaki Nonaka ,  Kan Nakata ,  Yoshiaki Sugishita ,  Kenji Kobayashi

发明人： Hideaki Nonaka ,  Kan Nakata ,  Yoshiaki Sugishita ,  Kenji Kobayashi

IPC分类号： A45C11/00

CPC分类号： B26D7/00 ,  B25J11/0055 ,  B25J15/0491 ,  B26D7/088 ,  B26D7/2614 ,  B26D2007/0025 ,  Y10T83/242 ,  Y10T83/293

摘要： A stock device 11 for storing cutter blades 21 for a cutting device 10, which includes a case body 40 provided with a receiving section 41 for the cutter blades 21. Within the case body 40, engagement surfaces 43A are provided so as, when the cutter blades 21 are stored in the receiving section 41, to ensure the orientation of the cutter blades 21 to a constant direction when a cutter blade 21 is mounted onto the cutting device 10. Also, the case body 40 stores organic solvent L therein for washing the cutter blades 21, and is arranged so as to be able to dissolve and remove adhesive and the like adhered to a blade 21B with the organic solvent L.

摘要翻译： 用于存储用于切割装置10的切割刀片21的储存装置11，其包括设置有用于切割刀片21的接收部分41的壳体40.在壳体40内，设置接合表面43A，当切割器 叶片21被存储在接收部分41中，以便当切割刀片21安装到切割装置10上时确保切割刀片21朝向恒定方向。此外，壳体40将有机溶剂L存储在其中用于洗涤 刀片21，并且被布置成能够用有机溶剂L溶解并除去粘附到刀片21B上的粘合剂等。

公开(公告)号：US20090120587A1

公开(公告)日：2009-05-14

申请号：US11994950

申请日：2006-06-26

申请人： Tsuyoshi Kurita ,  Koichi Yamaguchi ,  Kenji Kobayashi

发明人： Tsuyoshi Kurita ,  Koichi Yamaguchi ,  Kenji Kobayashi

IPC分类号： B32B38/04 ,  B29C65/56

CPC分类号： H01L21/67132 ,  Y10T156/1348

摘要： A sheet sticking table 13 used for sticking an adhesive sheet S onto the upper surface of a semiconductor wafer W is provided. The sheet sticking table 13 comprises an outer table 51 and an inner table 52. The outer table 51 and inner table 52 are provided movably in the vertical direction via uniaxial robots 54, 56 respectively, and the inner table 52 is provided movably together with the outer table 51 in the vertical direction when the outer table 51 is moved in the vertical direction.

摘要翻译： 提供了用于将粘合片S粘贴到半导体晶片W的上表面上的片材粘贴台13。 片材台13包括外台51和内台52.外台51和内台52分别通过单轴机器人54,56在垂直方向上可移动地设置，内台52与可移动地一起设置 外台面51在垂直方向上移动时，外台面51沿垂直方向移动。