Process for the electrolytic deposition of gold and gold alloy coatings
and compositions therefore
    91.
    发明授权
    Process for the electrolytic deposition of gold and gold alloy coatings and compositions therefore 失效
    因此,金和金合金涂层的电解沉积方法

    公开(公告)号:US4274927A

    公开(公告)日:1981-06-23

    申请号:US135766

    申请日:1980-03-31

    IPC分类号: C25D3/48 C25D3/62 C25D3/66

    CPC分类号: C25D3/62 C25D3/48 C25D3/66

    摘要: For the electrolytic deposition of gold alloys there is required a process with which low carat coatings can be deposited which nevertheless have a high resistance to tarnish. Such coatings are obtained from electrolytes which consist of a salt melt and contain gold salts, alkali thiocyanate and salts of one or more alloyings elements as constituents. Preferably the electrolyte contains per liter of salt melt 0.5 to 20 grams of gold, up to 300 grams of Cu, Zn, Sn, Cd, Ni, Ag, Pd, Ru and/or Pt, up to 200 grams of alkali cyanide and/or water.

    摘要翻译: 对于金合金的电解沉积,需要一种可以沉积低克拉涂层的方法,然而其具有很高的抗褪色性。 这样的涂层是由电解质获得的,该电解质由盐熔体组成并含有金盐,硫氰酸碱金属和一种或多种合金元素的盐作为组分。 优选地,电解液含有每升盐0.5至20克的金,至多300克Cu,Zn,Sn,Cd,Ni,Ag,Pd,Ru和/或Pt,至多200克碱金属氰化物和/ 或水。

    Gold and gold alloy deposition
    92.
    发明授权
    Gold and gold alloy deposition 失效
    金和金合金沉积

    公开(公告)号:US4062736A

    公开(公告)日:1977-12-13

    申请号:US631780

    申请日:1975-11-13

    IPC分类号: C25D3/48 C25D3/62

    CPC分类号: C25D3/62 C25D3/48

    摘要: Disclosed is a bath and process for obtaining deposits of gold or gold alloys of improved uniformity of deposit thickness on an irregularly shaped conductive surface. The aqueous plating bath contains gold as the aurocyanide complex, a mild reducing agent, a complexing agent, arsenic as a water-soluble arsenic compound, and a substituted polyamine.

    摘要翻译: 公开了一种用于获得在不规则形状的导电表面上提高沉积物厚度均匀性的金或金合金沉积物的浴和工艺。 含水电镀液含有金,作为亚砷氰化物络合物,温和的还原剂,络合剂,砷作为水溶性砷化合物和取代的多胺。

    Electrolytic burnished gold bath with higher rate of deposition
    93.
    发明授权
    Electrolytic burnished gold bath with higher rate of deposition 失效
    电解抛光金浴具有较高的沉积速率

    公开(公告)号:US3929595A

    公开(公告)日:1975-12-30

    申请号:US52084474

    申请日:1974-11-04

    申请人: DEGUSSA

    IPC分类号: C25D3/48 C25D3/62

    CPC分类号: C25D3/48

    摘要: There is provided an electrolytic gold bath for the deposition of thicker, bright gold coatings at high rates of deposition. The bath contains a heterocyclic azohydrocarbon sulfonic acid or salt thereof, e.g. pyridine sulfonic acid.

    摘要翻译: 提供了一种电解金浴,用于在高沉积速率下沉积更厚,更亮的金涂层。 该浴含有杂环偶氮烃磺酸或其盐,例如 吡啶磺酸。

    Gold plating bath and process
    94.
    发明授权
    Gold plating bath and process 失效
    镀金浴和工艺

    公开(公告)号:US3893896A

    公开(公告)日:1975-07-08

    申请号:US37561673

    申请日:1973-07-02

    申请人: HANDY & HARMAN

    IPC分类号: C25D3/62 C23B5/42 C23B5/46

    CPC分类号: C25D3/62

    摘要: The specification relates to an improved electrolyte. The specification relates also to the use of this electrolyte to deposit gold on a surface. The electrolyte has an alkali gold cyanide, a weak Lewis acid, a weak polyfunctional water-soluble aliphatic acid, a non-depositing metallic compound, a metallic hardener, and water.

    摘要翻译: 本说明书涉及改进的电解质。 本说明书还涉及这种电解质在表面上沉积金的用途。 电解质具有碱金氰化物,弱路易斯酸,弱多官能水溶性脂肪酸,非沉积金属化合物,金属硬化剂和水。

    Bright gold electroplating bath and method of electroplating bright gold
    95.
    发明授权
    Bright gold electroplating bath and method of electroplating bright gold 失效
    亮金电镀浴和电镀黄金的方法

    公开(公告)号:US3856638A

    公开(公告)日:1974-12-24

    申请号:US35468273

    申请日:1973-04-26

    申请人: AURIC CORP

    发明人: BICK M LOCHET J

    IPC分类号: C25D3/48 C25D3/62

    CPC分类号: C25D3/62 C25D3/48

    摘要: A bright gold electroplating bath comprising: an aqueous solution of an alkali metal gold cyanide; as an alloying agent, cobalt or nickel, in the form of a complex with at least aminoguanidine and a chelating phosphonic acid; and as conducting and buffering agents, one or more bath soluble phosphates.

    摘要翻译: 一种亮金电镀浴,包括:碱金属氰化金水溶液; 作为与至少氨基胍和螯合膦酸的络合物形式的合金化剂钴或镍; 以及作为导电和缓冲剂,一种或多种溶液溶解磷酸盐。

    Method and electrolyte for electrodepositing a gold-arsenic alloy
    96.
    发明授权
    Method and electrolyte for electrodepositing a gold-arsenic alloy 失效
    用于电沉积金 - 砷化合物的方法和电解质

    公开(公告)号:US3753874A

    公开(公告)日:1973-08-21

    申请号:US3753874D

    申请日:1971-12-21

    申请人: AMP INC

    IPC分类号: C25D3/62 C23B5/42

    CPC分类号: C25D3/62

    摘要: AN AQUEOUS ELECTROLYTE SOLUTION HAVING A PH FROM 5.5 TO 8 FOR DEPOSITING HARD, DUCTILE AND BRIGHT ARSENIC CONTAINING GOLD HS BEEN PROVIDED, BESIDES THE VARIOUS BUFFERS AND ALKALI GOLD CYANIDE, COMPLEX AA THIO SULFATE IS ADDED TO FACILITATE THE PROPER INCLUSION OF ARSENIC IN THE GOLD DEPOSIT, SALT COMPOSITION SUITABLE FOR OBTAINING AQUEOUS ELECTROLYTES, A MEHTOD FOR DEPOSITING THE ARSENIC GOLD, TE GOLD ALLOY, AND ELECTRICAL DEVICES HAVING THE ARSENIC GOLD DEPOSIT ON A SURFACE OF THESE DEVICES HAVE ALSO BEEN DISCLOSED.

    Electroplating baths and methods for electroplating gold alloys and a product thereof
    97.
    发明授权
    Electroplating baths and methods for electroplating gold alloys and a product thereof 失效
    电镀黄铜合金电镀及其制造方法

    公开(公告)号:US3607682A

    公开(公告)日:1971-09-21

    申请号:US3607682D

    申请日:1969-07-17

    申请人: KDI CORP

    发明人: MENZEL THOMAS J

    IPC分类号: C25D3/62 C23B5/42

    CPC分类号: C25D3/62

    摘要: Alkaline gold cyanide electrolyte solutions to be employed for depositing gold alloys by an electroplating process, such solutions having incorporated therein a mixture of an alkali metal silver cyanide and ethylenediaminotetraacetic acid and, optionally, alkali metal indium cyanide, processes of electroplating employing such solutions, and electroplated products produced thereby.