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公开(公告)号：US09914838B2
公开(公告)日：2018-03-13
申请号：US15157453
申请日：2016-05-18
发明人： Yoko Mizuno , Makoto Kondo , Koichi Yomogida , Toshiyuki Morinaga
IPC分类号： B05D5/12 , C09D5/08 , H05K1/03 , H05K3/00 , C07D333/04 , C25D3/38 , C08K5/3462 , C07D233/02 , C25D11/24 , C09D7/12 , C09D179/04 , C23C26/00 , C25D5/48 , H01L21/288 , C08G73/06 , C08G59/00 , H05K1/00 , C07D233/00 , C08K5/00 , C08K3/32 , C25D5/12
CPC分类号： C09D5/08 , C07D233/00 , C07D233/02 , C07D333/04 , C08G59/00 , C08G73/0616 , C08K3/32 , C08K5/00 , C08K5/3462 , C08K2003/324 , C09D7/61 , C09D179/04 , C23C26/00 , C25D3/38 , C25D3/48 , C25D3/62 , C25D5/12 , C25D5/48 , C25D7/00 , C25D11/246 , H01L21/288 , H05K1/00 , H05K1/0346 , H05K3/00
摘要： A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.
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公开(公告)号：US09683303B2
公开(公告)日：2017-06-20
申请号：US14244071
申请日：2014-04-03
摘要： The invention relates to a make-up solution for a galvanic bath comprising organometallic components, a wetting agent, a complexing agent and free cyanide, wherein the make-up solution further comprises copper in the form of copper II cyanide and potassium, and complex indium allowing, after addition of alkaline aurocyanide, to galvanically depositing a gold alloy.
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3.发明授权Method of obtaining a yellow gold alloy deposition by galvanoplasty without using toxic materials 有权通过电铸成形术获得黄金合金沉积而不使用有毒物质的方法公开(公告)号：US09567684B2
公开(公告)日：2017-02-14
申请号：US14452364
申请日：2014-08-05
摘要： The invention concerns the field of galvanic depositions and relates to a method of galvanoplastic deposition of a gold alloy on an electrode dipped into a bath including metal gold in alkaline aurocyanide form, organometallic compounds, a wetting agent, a sequestering agent and free cyanide. According to the invention, the alloy metals are copper, in double copper and potassium cyanide form, and silver in cyanide form, allowing a mirror bright yellow gold alloy to be deposited on the electrode.
摘要翻译： 本发明涉及电沉积领域，涉及一种将金合金浸入浸入包含碱金属氰化物形式的金属金，有机金属化合物，润湿剂，多价螯合剂和游离氰化物的浴中的电镀锌的方法。 根据本发明，合金金属是双铜和氰化钾形式的铜，氰化物形式的银，允许在电极上沉积镜面明亮的黄金合金。
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4.发明申请USE OF METAL PHOSPHORUS IN METALLIZATION OF PHOTOVOLTAIC DEVICES AND METHOD OF FABRICATING SAME 审中-公开金属磷在金属化光伏器件中的应用及其制备方法公开(公告)号：US20160197208A1
公开(公告)日：2016-07-07
申请号：US15069514
申请日：2016-03-14
IPC分类号： H01L31/0224 , H01L31/18 , H01L31/068 , H01L31/0216
CPC分类号： H01L31/022433 , C25D3/38 , C25D3/56 , C25D3/562 , C25D3/567 , C25D3/58 , C25D3/60 , C25D3/62 , C25D3/64 , C25D5/006 , C25D5/10 , C25D5/12 , C25D5/50 , C25D7/12 , H01L21/2885 , H01L21/76841 , H01L23/53238 , H01L31/02168 , H01L31/022425 , H01L31/068 , H01L31/1864 , H01L2924/0002 , Y02E10/50 , H01L2924/00
摘要： A photovoltaic device, such as a solar cell, including a copper-containing-grid metallization structure that contains a metal phosphorus layer as a diffusion barrier is provided. The copper-containing-grid metallization structure includes, from bottom to top, an electroplated metal phosphorus layer that does not include copper or a copper alloy located within a grid pattern formed on a front side surface of a semiconductor substrate, and an electroplated copper-containing layer. A method of forming such a structure is also provided.
摘要翻译： 提供了包含含有金属磷层作为扩散阻挡层的含铜网状金属化结构的太阳能电池等太阳能电池。 含铜网格金属化结构从底部到顶部包括不包括位于半导体衬底的前侧表面上的栅格图案内的铜或铜合金的电镀金属磷层，以及电镀铜 - 含有层。 还提供了一种形成这种结构的方法。
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公开(公告)号：US20160145756A1
公开(公告)日：2016-05-26
申请号：US14549571
申请日：2014-11-21
发明人： Adolphe FOYET , Margit CLAUSS , Reto BUCHS
摘要： Gold electroplating compositions are substantially free of many environmental toxins to provide an environmentally friendly pure gold electroplating composition. The substantially pure gold electroplating compositions may electroplate gold over a broad current density range to deposit bright to matte gold layers on various types of electronic components and decorative articles.
摘要翻译： 金电镀组合物基本上不含许多环境毒素，以提供环保的纯金电镀组合物。 基本上纯的金电镀组合物可以在宽的电流密度范围内电镀金，以在各种类型的电子部件和装饰物品上沉积明亮的无光泽的金层。
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公开(公告)号：US20160048159A1
公开(公告)日：2016-02-18
申请号：US14460286
申请日：2014-08-14
发明人： Mark Thomas McCormack , Anthony Allen Fischer , Raj Master , Farah Shariff , Dennis Tom , Zulfiqar Alam
摘要： An electronic device includes an electronic component configured to receive electric current and a plated contact electrically coupled to the electronic component and configured to carry the electric current to the electronic component from a system external to the device. The plated contact includes a copper-alloy layer, a platinum-group metal (PGM) layer plated over the copper-alloy layer, and a gold-alloy layer plated over the PGM layer.
摘要翻译： 电子设备包括被配置为接收电流的电子部件和电耦合到电子部件并被配置为将电流从设备外部的系统传送到电子部件的电镀触点。 电镀触点包括铜合金层，镀在铜合金层上的铂族金属（PGM）层和镀在PGM层上的金合金层。
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公开(公告)号：US09004960B2
公开(公告)日：2015-04-14
申请号：US13772755
申请日：2013-02-21
申请人： Apple Inc.
发明人： Douglas J. Weber , Naoto Matsuyuki , Eric S. Jol
IPC分类号： H01R13/02 , H01R13/03 , H01R24/20 , H01R43/20 , B32B15/01 , C25D3/62 , C22C5/00 , C22C5/02 , H01R43/16 , C25D5/12 , C25D7/00 , C23C18/16
CPC分类号： H01R13/03 , B32B15/018 , C22C5/00 , C22C5/02 , C23C18/1653 , C25D3/62 , C25D5/12 , C25D7/00 , H01R24/20 , H01R43/16 , H01R43/205 , Y10T29/49208
摘要： An improved outer layer of plating comprising a binary metal alloy of gold and palladium is employed on connector contacts. The binary metal alloy is plated on at least the contact surface of the contacts. Intermediate plating layers can be applied between the outer layer of gold and palladium and the conductive base of the contacts. The binary metal alloy of gold and palladium may be configured to have a mostly gold or a mostly silver appearance, depending upon the relative concentration of gold and palladium in the binary metal alloy.
摘要翻译： 在连接器触点上使用包括金和钯的二元金属合金的改进的镀层外层。 二元金属合金电镀在至少触点的接触表面上。 可以在金和钯的外层和触点的导电基底之间施加中间镀层。 根据二元金属合金中金和钯的相对浓度，金和钯的二元金属合金可以被配置为具有大多数金或大部分银外观。
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公开(公告)号：US20150068908A1
公开(公告)日：2015-03-12
申请号：US14389794
申请日：2013-04-02
申请人： Pierre-Antoine Gay
发明人： Pierre-Antoine Gay
摘要： A galvanic bath for the electrolytic deposition of a composite material based on gold, copper and cadmium, including gold, copper and cadmium as cyanide, has a pH higher than 7, and further includes carbon nanotubes, and does not contain any surfactant used to disperse the carbon nanotubes. A method for the galvanic deposition of a composite material on a substrate, includes the steps of preparing such a bath and ultrasound treatment of the bath, and does not include any step of thermal pre-treatment of the bath.
摘要翻译： 用于以金，铜和镉（包括金，铜和镉）为氰化物的复合材料的电解沉积的电镀浴的pH高于7，并且还包括碳纳米管，并且不含任何用于分散的表面活性剂 碳纳米管。 将复合材料电沉积在基材上的方法包括如下步骤：制备这种浴并对浴进行超声波处理，并且不包括浴的热预处理的任何步骤。
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9.发明申请METHOD OF OBTAINING A YELLOW GOLD ALLOY DEPOSITION BY GALVANOPLASTY WITHOUT USING TOXIC METALS OR METALLOIDS 审中-公开在不使用有毒金属或金属物质的情况下获得黄铜合金沉积的方法公开(公告)号：US20140299481A1
公开(公告)日：2014-10-09
申请号：US14244071
申请日：2014-04-03
IPC分类号： C25D3/62
摘要： The invention relates to a make-up solution for a galvanic bath comprising organometallic components, a wetting agent, a complexing agent and free cyanide, wherein the make-up solution further comprises copper in the form of copper II cyanide and potassium, and complex indium allowing, after addition of alkaline aurocyanide, to galvanically depositing a gold alloy.
摘要翻译： 本发明涉及包含有机金属组分，润湿剂，络合剂和游离氰化物的电镀浴的补充溶液，其中补充溶液还包含铜II氰化物和钾形式的铜和复合铟 在加入碱金属氰化物之后，允许电镀沉积金合金。
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10.发明申请公开(公告)号：US20140200133A1
公开(公告)日：2014-07-17
申请号：US14212372
申请日：2014-03-14
申请人： Hiroko KIMURA , Naoki TAKEHIRO , Koshi SEKIZAWA , Atsuo IIO , Tatsuya ARAI
发明人： Hiroko KIMURA , Naoki TAKEHIRO , Koshi SEKIZAWA , Atsuo IIO , Tatsuya ARAI
CPC分类号： H01M4/8853 , B22F1/0018 , B22F1/025 , B82Y30/00 , C23C18/08 , C23C18/54 , C25D3/38 , C25D3/48 , C25D3/50 , C25D3/567 , C25D3/62 , C25D7/006 , H01M4/92 , H01M4/921 , H01M4/926
摘要： The present invention provides core-shell type metal nanoparticles having a high surface coverage of the core portion with the shell portion, and a method for producing the same. Disclosed is core-shell type metal nanoparticles comprising a core portion comprising a core metal material and a shell portion covering the core portion, wherein the core portion substantially has no {100} plane of the core metal material on the surface thereof.
摘要翻译： 本发明提供具有壳部分的芯部分的高表面覆盖率的核 - 壳型金属纳米粒子及其制造方法。 公开了一种核 - 壳型金属纳米粒子，其包含芯部，其包含芯金属材料和覆盖芯部的壳部，其中芯部在其表面上基本上不具有芯金属材料的{100}面。
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