Pull tab design for stretch release adhesive
    101.
    发明授权
    Pull tab design for stretch release adhesive 有权
    拉伸片设计用于拉伸剥离粘合剂

    公开(公告)号:US09333706B2

    公开(公告)日:2016-05-10

    申请号:US14254809

    申请日:2014-04-16

    Applicant: Apple Inc.

    Abstract: A stretch release adhesive is disclosed. The stretch release adhesive can be used for extracting an electrical component from an interior surface of a housing of a mobile computing device. The stretch release adhesive can have a double-sided adhesive body configured to adhere the component to the interior surface of the housing. A portion of the double-sided adhesive body is configured to extend out from between the electrical component and the interior surface of the housing to provide a graspable portion. When the stretch release adhesive is adhered between the electrical component and the internal surface of the housing, the stretch release adhesive can receive a pulling force at the graspable portion. If pulled with enough force, the stretch release adhesive will extend outwardly from between the electrical component and the internal surface of the mobile computing device, then completely release the electrical component from the mobile computing device.

    Abstract translation: 公开了一种拉伸剥离粘合剂。 拉伸剥离粘合剂可用于从移动计算设备的壳体的内表面提取电气部件。 拉伸剥离粘合剂可以具有双面粘合体,其构造成将部件粘附到壳体的内表面。 双面粘合体的一部分构造成从电气部件和壳体的内表面之间延伸出来,以提供可抓握部分。 当拉伸剥离粘合剂粘附在电气部件和壳体的内表面之间时,拉伸剥离粘合剂可以在可抓握部分处受到拉力。 如果用足够的力拉动,则拉伸剥离粘合剂将从电气部件和移动计算设备的内表面之间向外延伸,然后从移动计算设备完全释放电气部件。

    OVERPASS GROUNDING SPRING AND INTEGRATED COMPONENT PROTECTION
    103.
    发明申请
    OVERPASS GROUNDING SPRING AND INTEGRATED COMPONENT PROTECTION 有权
    超导接地弹簧和集成部件保护

    公开(公告)号:US20150064937A1

    公开(公告)日:2015-03-05

    申请号:US14231372

    申请日:2014-03-31

    Applicant: Apple Inc.

    Abstract: The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.

    Abstract translation: 所描述的实施例大体上涉及用于电气接地印刷电路板上的部件的导电部件,例如接地弹簧,以及为部件提供机械保护。 更具体地,公开了一种用于将接地弹簧连接到印刷电路板上的多个位置的方法和装置。 在一个实施例中,接地弹簧可以用作布置在印刷电路板上的其它表面安装部件的接地和机械保护元件。

    Methods for containing liquid materials and maintaining part alignment during assembly operations
    104.
    发明授权
    Methods for containing liquid materials and maintaining part alignment during assembly operations 有权
    在组装操作期间包含液体材料并保持零件对准的方法

    公开(公告)号:US08728269B2

    公开(公告)日:2014-05-20

    申请号:US13757065

    申请日:2013-02-01

    Applicant: Apple Inc.

    Abstract: Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.

    Abstract translation: 组件可以使用诸如液体粘合剂和焊料的液体材料互连。 为了防止组装过程中部件之间的不期望的移动并且防止液体材料流入不期望的区域,可以提供附接和坝结构。 该结构可以由诸如涂覆有粘合剂的柔性聚合物膜的基底形成。 当介于第一和第二部件之间时,结构附接第一和第二部件并防止第一和第二部件之间的运动。 结构可以具有与液体材料相邻的一个或多个边缘,以在液体材料处于其液体状态时阻止液体材料流动。 一旦连接了组件,液体材料就可以固化。

    METHODS FOR CONTAINING LIQUID MATERIALS AND MAINTAINING PART ALIGNMENT DURING ASSEMBLY OPERATIONS
    105.
    发明申请
    METHODS FOR CONTAINING LIQUID MATERIALS AND MAINTAINING PART ALIGNMENT DURING ASSEMBLY OPERATIONS 有权
    装配液体材料的方法和维护组装操作期间的零件对齐

    公开(公告)号:US20130139962A1

    公开(公告)日:2013-06-06

    申请号:US13757065

    申请日:2013-02-01

    Applicant: Apple Inc.

    Abstract: Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.

    Abstract translation: 组件可以使用诸如液体粘合剂和焊料的液体材料互连。 为了防止组装过程中部件之间的不期望的移动并且防止液体材料流入不期望的区域,可以提供附接和坝结构。 该结构可以由诸如涂覆有粘合剂的柔性聚合物膜的基底形成。 当介于第一和第二部件之间时,结构附接第一和第二部件并防止第一和第二部件之间的运动。 结构可以具有与液体材料相邻的一个或多个边缘,以在液体材料处于其液体状态时阻止液体材料流动。 一旦连接了组件,液体材料就可以固化。

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