Abstract:
A stretch release adhesive is disclosed. The stretch release adhesive can be used for extracting an electrical component from an interior surface of a housing of a mobile computing device. The stretch release adhesive can have a double-sided adhesive body configured to adhere the component to the interior surface of the housing. A portion of the double-sided adhesive body is configured to extend out from between the electrical component and the interior surface of the housing to provide a graspable portion. When the stretch release adhesive is adhered between the electrical component and the internal surface of the housing, the stretch release adhesive can receive a pulling force at the graspable portion. If pulled with enough force, the stretch release adhesive will extend outwardly from between the electrical component and the internal surface of the mobile computing device, then completely release the electrical component from the mobile computing device.
Abstract:
An apparatus comprises a fingerprint sensor having a set of capacitive elements configured for capacitively coupling to a user fingerprint. The fingerprint sensor may be disposed under a control button or display element of an electronic device, for example one or more of a control button and a display component. A responsive element is responsive to proximity of the user fingerprint, for example one or both of a first circuit responsive to motion of the control button, and a second circuit responsive to a coupling between the fingerprint and a surface of the display element. The fingerprint sensor is disposed closer to the fingerprint than the responsive element. The control button or display component may include an anisotropic dielectric material, for example sapphire.
Abstract:
The described embodiments relate generally to use of an electrically conductive member, such as a grounding spring, used to electrically ground components on a printed circuit board as well as provide mechanical protection to the components. More particularly, a method and apparatus for attaching a grounding spring to multiple locations on the printed circuit board are disclosed. In one embodiment, the grounding spring can act as both a ground and a mechanical protection element for other surface mounted components disposed on the printed circuit board.
Abstract:
Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.
Abstract:
Components may be interconnected using liquid materials such as liquid adhesive and solder. To prevent undesired movement between the components during the assembly process and to prevent the liquid material from flowing into undesired areas, an attachment and dam structure may be provided. The structure may be formed from a substrate such as a flexible polymer film coated with adhesive. When interposed between first and second components, the structure attaches the first and second components and prevents movement between the first and second components. The structure may have one or more edges adjacent to the liquid material to block the liquid material from flowing while the liquid material is in its liquid state. Once the components have been connected, the liquid material can be solidified.