ASSESSING INTEGRITY OF BONDED JOINTS
    10.
    发明申请
    ASSESSING INTEGRITY OF BONDED JOINTS 审中-公开
    评估焊接接头的完整性

    公开(公告)号:US20160313210A1

    公开(公告)日:2016-10-27

    申请号:US15105263

    申请日:2014-12-15

    申请人: BAE SYSTEMS PLC

    发明人: Ian James Read

    摘要: There is provided apparatus and a method for assessing the integrity of a bonded joint and a bonded joint assembly. The assembly has a bonded joint monitored for bond integrity and comprises first (1) and second (2) components each defining a bonding surface (3,4); the joint (5) is formed between the bonding surfaces (3,4) and the first component (1) defines a passage (15) therethrough from the bonding surface to an exterior of the component. The joint (5) includes an optical fibre (11) extending along the joint (5) between the bonding surfaces, through the passage (15) and emerging from the passage (15) to the exterior of the component. The method of constructing the assembly includes the steps of passing the optical fibre (11) through the passage (15) and adhering the optical fibre (11) to the bonding surface (3) of the first component (1), thus bringing the two bonding surfaces (3,4) together and forming the bond (5).

    摘要翻译: 提供了用于评估接合接头和接合接头组件的完整性的装置和方法。 所述组件具有粘结接头,用于粘合完整性,并包括每个限定粘合表面(3,4)的第一(1)和第二(2)部件。 接头(5)形成在接合表面(3,4)之间,并且第一部件(1)限定从接合表面到部件外部的通道(15)。 接头(5)包括通过通道(15)沿着接合部(5)延伸并且从通道(15)向部件外部延伸的光纤(11)。 构成组件的方法包括使光纤(11)穿过通道(15)并将光纤(11)粘附到第一部件(1)的接合表面(3)的步骤,从而使两个 接合表面(3,4)在一起并形成键(5)。