Non-volatile semiconductor storage device and method of manufacturing the same
    103.
    发明授权
    Non-volatile semiconductor storage device and method of manufacturing the same 有权
    非易失性半导体存储装置及其制造方法

    公开(公告)号:US07910432B2

    公开(公告)日:2011-03-22

    申请号:US12393509

    申请日:2009-02-26

    IPC分类号: H01L21/336

    CPC分类号: H01L27/11578 H01L27/11582

    摘要: Each of the memory strings includes: a first columnar semiconductor layer extending in a vertical direction to a substrate; a plurality of first conductive layers formed to sandwich an insulation layer with a charge trap layer and expand in a two-dimensional manner; a second columnar semiconductor layer formed in contact with the top surface of the first columnar semiconductor layer and extending in a vertical direction to the substrate; and a plurality of second conductive layers formed to sandwich an insulation layer with the second columnar semiconductor layer and formed in a stripe pattern extending in a first direction orthogonal to the vertical direction. Respective ends of the plurality of first conductive layers in the first direction are formed in a stepwise manner in relation to each other, entirety of the plurality of the second conductive layers are formed in an area immediately above the top layer of the first conductive layers, and the plurality of first conductive layers and the plurality of second conductive layers are covered with a protection insulation layer that is formed continuously with the plurality of first conductive layers and the second conductive layers.

    摘要翻译: 每个存储器串包括:在垂直方向上延伸到衬底的第一柱状半导体层; 多个第一导电层,其形成为夹着具有电荷陷阱层的绝缘层并以二维方式扩展; 第二柱状半导体层,其与所述第一柱状半导体层的顶表面接触并且在垂直方向上延伸到所述衬底; 以及多个第二导电层,其形成为与第二柱状半导体层夹着绝缘层,并且形成为沿与垂直方向正交的第一方向延伸的条纹图案。 多个第一导电层的第一方向的端部相对于彼此分步地形成,多个第二导电层的整体形成在第一导电层的顶层的正上方的区域中, 并且多个第一导电层和多个第二导电层被与多个第一导电层和第二导电层连续形成的保护绝缘层覆盖。