摘要:
A method is provided for designing an integrated circuit device. The method includes placing four transistors of a first transistor type and four transistors of a second transistor type within a gate electrode level. Each of the transistors includes a respective linear-shaped gate electrode segment positioned to extend lengthwise in a first direction. The transistors of the first and second transistor types are placed according to a substantially equal centerline-to-centerline spacing as measured perpendicular to the first direction. A first linear conductive segment is placed to electrically connect the gate electrodes of the first transistors of the first and second transistor types. A second linear conductive segment is placed to electrically connect the gate electrodes of the fourth transistors of the first and second transistor types. A third linear conductive segment is placed beside either the first or second linear conductive segment.
摘要:
A first linear-shaped conductive structure (LSCS) forms gate electrodes of a first p-transistor and a first n-transistor. A second LSCS forms a gate electrode of a second p-transistor. A third LSCS forms a gate electrode of a second n-transistor, and is separated from the second LSCS by a first end-to-end spacing (EES). A fourth LSCS forms a gate electrode of a third p-transistor. A fifth LSCS forms a gate electrode of a third n-transistor, and is separated from the fourth LSCS by a second EES. A sixth LSCS forms gate electrodes of a fourth p-transistor and a fourth n-transistor. An end of the second LSCS adjacent to the first EES is offset from an end of the fourth LSCS adjacent to the second EES, and/or an end of the third LSCS adjacent to the first EES is offset from an end of the fifth LSCS adjacent to the second EES.
摘要:
An integrated circuit includes at least four linear-shaped conductive structures formed to extend lengthwise in a parallel direction to each other and each respectively including a gate electrode portion and an extending portion that extends away from the gate electrode portion. The gate electrode portions of the linear-shaped conductive structures respectively form gate electrodes of different transistors, such that at least one of the linear-shaped conductive structures forms a gate electrode of a transistor of a first transistor type and does not form a gate electrode of any transistor of a second transistor type, and such that at least one of the linear-shaped conductive structures forms a gate electrode of a transistor of the second transistor type and does not form a gate electrode of any transistor of the first transistor type. Extending portions of the at least four linear-shaped conductive structures include at least two different extending portion lengths.
摘要:
An integrated circuit includes a first gate electrode track and a second gate electrode track. The first gate electrode track includes a first gate electrode feature that forms an n-channel transistor as it crosses an n-diffusion region. The first gate electrode track does not cross a p-diffusion region. The second gate electrode track includes a second gate electrode feature that forms a p-channel transistor as it crosses a p-diffusion region. The second gate electrode track does not cross an n-diffusion region. The integrated circuit also includes a linear shaped conductor that crosses both the first and second gate electrode features in a reference direction perpendicular to the first and second gate electrode tracks. The linear shaped conductor provides electrical connection between the first and second gate electrode features.
摘要:
A cell of a semiconductor device includes a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Some of the conductive features form respective PMOS and/or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the cell. The cell also includes a number of interconnect levels formed above the gate electrode level.
摘要:
Regular layout shapes are placed in accordance with a virtual grate. A determination is made as to whether an unoccupied layout space adjacent to a regular layout shape to be reinforced, and extending in a direction perpendicular to the regular layout shape, is large enough to support placement of a sub-resolution shape. Upon determining that the unoccupied layout space is large enough to support placement of the sub-resolution shape, the sub-resolution shape is placed so as to be substantially centered upon a virtual line of the virtual grate within the unoccupied layout space. Also, one or more sub-resolution shapes are placed between and parallel with neighboring regular layout shapes when windows of lithographic reinforcement associated with each of the neighboring regular layout shapes permit. The sub-resolution shapes may be placed according to a virtual grate, or may be placed based on proximity to edges of the neighboring regular layout shapes.
摘要:
A cell of a semiconductor device is disclosed to include a diffusion level including a plurality of diffusion regions separated by inactive regions. The cell also includes a gate electrode level including conductive features defined to extend in only a first parallel direction. Adjacent ones of the conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. The gate electrode level includes conductive features defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features is less than a wavelength of light used in a photolithography process for their fabrication.
摘要:
A layout of a cell of a semiconductor device is disclosed to include a diffusion level layout including a plurality of diffusion region layout shapes, including p-type and n-type diffusion regions. The layout of the cell also includes a gate electrode level layout defined to include a number of linear-shaped layout features placed to extend in only a first parallel direction. Each of the number of the linear-shaped layout features within the gate electrode level layout of the restricted layout region is rectangular-shaped. Linear-shaped layout features within the gate electrode level layout extend over one or more of the p-type and/or n-type diffusion regions to form PMOS and NMOS transistor devices. A total number of the PMOS and NMOS transistor devices in the cell is greater than or equal to eight.
摘要:
A semiconductor device includes a substrate portion including a plurality of diffusion regions defined in a non-symmetrical manner relative to a virtual bisecting line. A gate electrode level region above the substrate portion includes a number of conductive features that extend in only a first parallel direction. Adjacent conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features separated by an equal and minimal sized end-to-end spacing. Conductive features are defined along at least four different virtual lines of extent in the first parallel direction. A width of the conductive features within a photolithographic interaction radius is less than a wavelength of light of 193 nanometers as used in a photolithography process for their fabrication. The photolithographic interaction radius is five times the wavelength of light used in the photolithography process.
摘要:
A semiconductor device includes a substrate portion having a plurality of diffusion regions defined therein. The semiconductor device includes a gate electrode level region including a number of conductive features defined to extend in only a first parallel direction. Adjacent ones of the number of conductive features that share a common line of extent in the first parallel direction are fabricated from respective originating layout features that are separated from each other by an end-to-end spacing having a size that is substantially equal across the gate electrode level region and is minimized to an extent allowed by a semiconductor device manufacturing capability. Some of the conductive features within the gate electrode level region extend over the plurality of diffusion regions to form PMOS or NMOS transistor devices. A number of the PMOS transistor devices is equal to a number of the NMOS transistor devices in the gate electrode level region.