公开(公告)号：US07339258B2

公开(公告)日：2008-03-04

申请号：US11379740

申请日：2006-04-21

申请人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

发明人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

IPC分类号： H01L23/496

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.

摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端头。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。

公开(公告)号：US07129569B2

公开(公告)日：2006-10-31

申请号：US10837347

申请日：2004-04-30

申请人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

发明人： Jeffrey D. Punzalan ,  Jose Alvin Caparas ,  Jae Hun Ku

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。