CROSS-LAYER TME SYNCHRONIZATION METHOD
    101.
    发明申请

    公开(公告)号:US20190020432A1

    公开(公告)日:2019-01-17

    申请号:US16068104

    申请日:2017-01-04

    Abstract: The cross-layer time synchronization method is a cross-layer synchronization approach that utilizes a timing recovery module at a physical layer (PHY), derives the information about the clock frequency offset from the timestamp-embedded message, and exploits it for synchronization at the higher layers. This approach either results in minimizing the cost of synchronization resulting in energy efficiency or improving the accuracy of the clock parameters' estimates by exploiting the PHY information. Some applications of this cross-layer technique include, but are not limited to, energy efficient wireless networks, cooperative networks or distributed MIMO networks.

    PLASMONIC/TRANSITION METAL CARBO-CHALCOGENIDES COATING FOR A FLEXIBLE, DEEP AND MULTI-BANDS ELECTROMAGNETIC INTERFERENCE SHIELDING APPLICATION

    公开(公告)号:US20250159852A1

    公开(公告)日:2025-05-15

    申请号:US18938963

    申请日:2024-11-06

    Abstract: A composite material for electromagnetic interference shielding is provided. The composite material comprises an electrically conductive microscale films based on Transition Metal Carbo-Chalcogenides (Nb2S2C) stack layers. The stack is effective to provide a substantial electromagnetic interference (EMI) shielding. Once decorated with special metallic nanoparticles made mainly with noble metals including Au, Ag and Pd, this efficiency against the EMI is even enhanced. The disclosed technology introduces a special coating that can be applied to electronic devices and materials. This coating acts as a shield that protects these devices from different types of interference that can disrupt their signals and performance. This coating can work on devices that bend or move, and effectively blocks interference across a wide range of frequencies. As such, the disclosed technology keeps devices working smoothly even in places with a lot of electronic “noise” without restricting their flexibility or range of use.

    Solution-based system for printing a 3D structure

    公开(公告)号:US12269210B2

    公开(公告)日:2025-04-08

    申请号:US18217225

    申请日:2023-06-30

    Abstract: A solution-based system for printing a 3D structure is provided and includes a substrate; a first solution including an organic molecule including a functional group at each end for creation of self-assembled monolayers (SAMs) including a first self-assembled monolayer (SAM) as a building block for printing the 3D structure, wherein the first solution is applied to a surface of the substrate to form the first SAM including a first SAM surface as a basis for the 3D structure; a second solution including metal ions, wherein the substrate with the first SAM is immersed into the second solution, and wherein the first solution is applied to the substrate which is immersed in the second solution thereby obtaining molecular-metal SAMs to provide a multiple layered SAM material; and means for applying a force and forming the 3D structure from the multiple layered SAM material, wherein the 3D structure is provided on the substrate.

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