公开(公告)号：US20210356778A1

公开(公告)日：2021-11-18

申请号：US17043321

申请日：2018-07-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Kuan-Ting Wu ,  Ann Alejandro Villegas

IPC: G02F1/13 ,  G02F1/1334 ,  G02F1/1339

Abstract: In one example in accordance with the present disclosure, a screen privacy device is described. The screen privacy device includes a substrate with channels having angled walls. A polymer-dispersed liquid crystal (PDLC) compound within the channels selectively alters a viewing angle of an underlying display screen. The screen privacy device also includes electrodes disposed on opposite wails of each of the channels to selectively apply a voltage potential across the PDLC compound within a corresponding channel.

公开(公告)号：US20210294388A1

公开(公告)日：2021-09-23

申请号：US16481466

申请日：2017-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu ,  Chung Hua Ku

IPC: G06F1/16

Abstract: The present subject matter relates to hinge connectors with rotation control units. In an example, a hinge connector may couple a base unit with a cover unit of a device. The hinge connector includes hinge shaft. The rotation control unit is to control the rotation of the hinge shaft and stop a free-rotation of the hinge shaft at a predefined angle with respect to the base unit.

公开(公告)号：US20210286234A1

公开(公告)日：2021-09-16

申请号：US16481509

申请日：2017-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Ya-Ting Yeh ,  Kuan-Ting Wu ,  Shih-Hsun Huang

IPC: G03B11/04 ,  G03B9/08 ,  G03B9/58 ,  G06F1/16 ,  H04N5/225

Abstract: Examples of shutter assembly are described herein. In an example, the shutter assembly includes an opening having a magnetic rubber-based shutter disposed in the opening. The magnetic rubber-based shutter is slidable along a length of the opening to selectively cover and expose the camera.

公开(公告)号：US20210265597A1

公开(公告)日：2021-08-26

申请号：US17042156

申请日：2018-11-16

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Hsing-Hung Hsieh ,  Super Liao ,  Kuan-Ting Wu

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/50 ,  H01L51/10

Abstract: In some examples, an organic light emitting transistor (OLET) comprises a substrate layer; a gate electrode disposed on the substrate layer; and a dielectric layer disposed on the gate electrode. The OLET further comprises a first organic semiconductor layer (OSL) disposed on the dielectric layer; a second OSL disposed on the first OSL; a third OSL disposed on the second OSL; a drain electrode disposed on the third OSL; a first source electrode partially disposed on both the first OSL and the third OSL; and a second source electrode partially disposed on both the first OSL and the third OSL, wherein a length of the first OSL is larger than lengths of both the second and third OSLs, and wherein a width of the first OSL is smaller than widths of both the second and third OSLs.

公开(公告)号：US20210247559A1

公开(公告)日：2021-08-12

申请号：US17048626

申请日：2018-11-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Super Liao ,  Hsing-Hung Hsieh ,  Kuan-Ting Wu

IPC: F21V8/00 ,  G02F1/1343 ,  G02F1/133

Abstract: An example display device includes a display panel to display an image; a backlight unit to provide light to the display panel, the backlight unit including a light emitting unit to emit the light; a light guide plate to transmit the light emitted from the light emitting unit; a pair of electrodes adjacent to the light guide plate; and a polymer layer including liquid crystal molecules within the light guide plate. The liquid crystal molecules are to change orientation upon being introduced to an electric field created by the pair of electrodes to change an opacity of the light guide plate. The display device includes at least one film to collimate and direct light from the backlight unit to the display panel; and a processor to switch voltage being applied on/off to the pair of electrodes.

公开(公告)号：US11061441B2

公开(公告)日：2021-07-13

申请号：US16649174

申请日：2017-12-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Wei-Chung Chen ,  Kuan-Ting Wu

IPC: G06F1/16

Abstract: In one example, a housing is described, which may include an outer cover and an electromagnet. The outer cover may include at least one slot and at least one slot cover to cover the at least one slot. The electromagnet may be fixedly disposed in the housing and aligned with the at least one slot cover to electromagnetically control a movement of the at least one slot cover.

公开(公告)号：US20210207272A1

公开(公告)日：2021-07-08

申请号：US17046011

申请日：2018-09-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chi Hao Chang ,  Chalam Kashyap

IPC: C23C28/04 ,  C23C18/12 ,  C23C22/07 ,  B05D7/00 ,  C09D175/04

Abstract: A magnesium alloy layered composite for an electronic device can include a magnesium alloy substrate, a passivation layer positioned on the magnesium alloy substrate, and a sol-gel layer positioned on the passivation layer. The passivation layer can include a molybdate, a vanadate, a phosphate, a chromate, a stannate, or a manganese salt. The sol-gel layer can include a silicate, a silane, a siloxane, or a metal C1-C5 alkoxide.

公开(公告)号：US20210199150A1

公开(公告)日：2021-07-01

申请号：US17042997

申请日：2018-08-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chien Tu Cheng ,  Al-Tsung LI ,  Sung Hsueh Tsai ,  Jamil Abdul Wakil

IPC: F16B33/00 ,  G06F1/20 ,  G06F1/16

Abstract: A thermally resistant coupling device coupled to an electronic device may include a screw to threadingly engage with a boss hole formed in the electronic device and an elastic insulative layer encapsulating a portion of the screw. An electronic device may include a screw hole, an elastic insulative layer placed within the screw hole, and a screw to threadingly engage with the screw hole and elastic insulative layer.

公开(公告)号：US20210195814A1

公开(公告)日：2021-06-24

申请号：US17046029

申请日：2018-09-14

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Shih-Huang Wu ,  Kuan-Ting Wu

IPC: H05K9/00

Abstract: The present disclosure is drawn to an electronic device including a substrate, an electronic component carried by the substrate, an EMI protection film over-molded on the electronic component, and an adhesive layer directly adhering the EMI protection film to the electronic component. The EMI protection film includes a ferromagnetic material.

公开(公告)号：US20210164122A1

公开(公告)日：2021-06-03

申请号：US16499536

申请日：2017-04-25

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kuan-Ting Wu ,  Chalam Kashyap ,  Yin-Yin Yang

IPC: C25D11/08 ,  C22C21/00 ,  C25D11/24

Abstract: The present subject matter relates to treating anodized alloy substrates. An anodized alloy substrate is immersed in a titanium salt solution to deposit titanium ions in a surface of the anodized alloy substrate. The immersion results in the formation of a processed substrate. The processed substrate is anodized to form a finished substrate. The anodization oxidizes the titanium ions to titanium dioxide particles.