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公开(公告)号：US10165699B2
公开(公告)日：2018-12-25
申请号：US15518522
申请日：2015-01-28
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Chalam Kashyap , Kuan-Ting Wu
IPC: B32B3/02 , H05K5/04 , C23C28/00 , C25D13/12 , C25D11/02 , C25D11/04 , C25D11/18 , C25D11/26 , C25D11/30 , C25D11/34 , C25D13/20
Abstract: One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.
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公开(公告)号：US20220007533A1
公开(公告)日：2022-01-06
申请号：US17054562
申请日：2019-03-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Chalam Kashyap
Abstract: The present disclosure is drawn to covers for electronic devices, methods of making the covers, and electronic devices. In one example, a cover for an electronic device comprising: a metal cover substrate; a micro-arc oxidation layer or a non-transparent passivation treatment layer on a surface of the metal cover substrate; an outmold decoration layer on the micro-arc oxidation layer or the non-transparent passivation treatment layer, a chamfered edge including a chamfer at an edge of the metal cover substrate, wherein the chamfer cuts through the micro-arc oxidation layer or the non-transparent passivation treatment layer and the outmold decoration layer to expose the metal cover substrate at the chamfered edge; a transparent passivation layer on the chamfered edge where the metal cover substrate is exposed; and a protective coating on the transparent passivation layer.
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Patent Agency Ranking
公开(公告)号：US20210130975A1
公开(公告)日：2021-05-06
申请号：US16605052
申请日：2017-04-13
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chalam Kashyap
Abstract: The present subject matter relates to treating alloy substrates having oxidized layers. An anodized alloy substrate is contacted with an alkaline mixture including titanium to form a processed substrate. The anodized alloy substrate includes an oxidized layer on its surface. The processed substrate is baked to form a finished substrate. The finished substrate includes titanium dioxide particles in the oxidized layer.
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公开(公告)号：US09242489B2
公开(公告)日：2016-01-26
申请号：US13753109
申请日：2013-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor： Fred O. Stephens , Chalam Kashyap
IPC: B41J29/13 , B41J13/076 , F16C13/00 , B41J13/02 , B41J11/00 , B41J25/308 , B41J2/21
CPC classification number: B41J13/076 , B41J2/2114 , B41J11/007 , B41J13/02 , B41J25/308 , F16C13/00
Abstract: A roller includes an outer cylindrical portion and an inner cylindrical portion arranged concentrically with the outer cylindrical portion. A plurality of connection spokes are provided for connecting the outer cylindrical portion and the inner cylindrical portion to each other, wherein each of the connection spokes are connected along a non-linear connection path with respect to an axis extending between the outer cylindrical portion and the inner cylindrical portion of the roller to provide a tunable spring constant in the roller.
Abstract translation: 辊包括外筒部和与外筒部同心配置的内筒部。 提供多个连接轮辐，用于将外圆筒部分和内筒部分彼此连接，其中每个连接轮辐相对于在外圆筒部分和第二圆筒部分之间延伸的轴线沿着非线性连接路径连接 辊的内圆柱形部分，以在辊中提供可调节的弹簧常数。
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公开(公告)号：US20220147100A1
公开(公告)日：2022-05-12
申请号：US17296732
申请日：2019-07-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Chalam Kashyap , Hung-Sung Pan , Kuan-Ting Wu
IPC: G06F1/16 , H01L41/083 , H01L41/09 , H01F7/02
Abstract: A foldable computing device is described. The foldable computing device can include a power switch, a display screen unit including a first magnet, a base unit and an actuator. The base unit can include an assembly with a second magnet and a third magnet. The assembly can be at a first position that causes the first magnet of the display screen unit to attract to the second magnet of the assembly of the base unit to lock the display screen unit. The actuator can receive an electrical pulse when the power switch is selected to power on the foldable computing device and provide a motion to move the assembly to a second position, to cause the first magnet of the display screen unit to be moved away from the second magnet and repulse the third magnet of the assembly in the base unit to unlock the display screen unit.
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公开(公告)号：US20210207272A1
公开(公告)日：2021-07-08
申请号：US17046011
申请日：2018-09-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chi Hao Chang , Chalam Kashyap
IPC: C23C28/04 , C23C18/12 , C23C22/07 , B05D7/00 , C09D175/04
Abstract: A magnesium alloy layered composite for an electronic device can include a magnesium alloy substrate, a passivation layer positioned on the magnesium alloy substrate, and a sol-gel layer positioned on the passivation layer. The passivation layer can include a molybdate, a vanadate, a phosphate, a chromate, a stannate, or a manganese salt. The sol-gel layer can include a silicate, a silane, a siloxane, or a metal C1-C5 alkoxide.
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公开(公告)号：US20210164122A1
公开(公告)日：2021-06-03
申请号：US16499536
申请日：2017-04-25
Applicant: Hewlett-Packard Development Company, L.P.
Inventor： Kuan-Ting Wu , Chalam Kashyap , Yin-Yin Yang
Abstract: The present subject matter relates to treating anodized alloy substrates. An anodized alloy substrate is immersed in a titanium salt solution to deposit titanium ions in a surface of the anodized alloy substrate. The immersion results in the formation of a processed substrate. The processed substrate is anodized to form a finished substrate. The anodization oxidizes the titanium ions to titanium dioxide particles.
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