Abstract:
Provided is an intervertebral implant which is fixedly placed between spinous processes of adjacent vertebrae to maintain a predetermined space between the spinous processes and to prevent a relative displacement between superior and inferior facets of adjacent vertebrae. The intervertebral implant includes a spacer having two opposing notches for receiving two adjacent spinous processes and a band for securing the two spinous processes and the spacer, the spacer comprising a through-hole bored through sides of the spacer to allow the band to pass therethrough and depressions curved inwardly from outsides of the spacer to facilitate fastening of the band passed through the through-hole, and the band binding the two spinous processes and the spacer in a figure 8 form while passing through the through-hole to secure the two spinous processes and the spacer.
Abstract:
A duplexing control system and method of an ATM switching system capable of carrying out a stable switching of duplexing with a simple circuit construction is disclosed. The system has two boards respectively having a first interface matching with an input bus so as to interface received ATM cell, a second interface matching with an output bus so as to interface a transmitted ATM cell, an SAR for disassembling and assembling data units contained in an application layer in the transmitted/received ATM cell by a unit of ATM cell, a control section for controlling general operation in order to maintain the active state according to data processing information contained in a signal applied from the cell disassembling and assembling circuit, when the its own board is endowed with the active authority by the signal, and a DRAM for storing data transmitted/received for the switching of duplexing between the boards. The duplexing control system and method in an ATM system causes data processing information of one board and a duplexing authority to be formed into an ATM cell and to be transferred through a cell bus, so that a duplexing control can be stably carried out.
Abstract:
Rotary punching apparatus includes: an upper rotation plate provided with punching member on which punching blade having a pattern of a specific shape is formed, and an upper jig which support elastically the punching member and forms a guide hole in the same shape as the pattern; an upper plate configured to enable the upper rotation plate to be rotated; a lower rotation plate including lower jig on which a punching hole in the same shape as the pattern is formed; and lower plate configured to enable the lower rotation plate to be rotated. The upper and the lower plate are provided with at least one magnets in a position opposite to each other and the upper and the lower rotation plate are provided with at least one or more magnets in a position opposite to each other, so that the fixed position is mutually aligned due to the magnetic force of the magnet. As a result, the present invention can freely punch a desired position irrespective of punching positions such as the seat as an object of the punching.
Abstract:
A semiconductor device and a fabrication method thereof which can, for example, prevent a punch-through from occurring by forming oxide spacers around source/drain regions in a semiconductor substrate instead of forming a conventional halo ion implanting layer. Such structure improves, for example, an operational speed by reducing junction capacitance, prevents a hot carrier effect from occurring by weakening an electric field around the drain region, and improves reliability by preventing a latch up from occurring. The semiconductor device includes a gate electrode formed on the semiconductor substrate, sidewall spacers formed at the sidewalls of the gate electrode, an impurity layer formed in the semiconductor substrate below each sidewall spacer, a trench formed in the semiconductor substrate at both sides of the gate electrode, oxide spacers formed at the bottom inside corner of each trench, and a conductive material filling up each trench.
Abstract:
A method for determining a coverage area according to antenna patterns in a sector base station system provided that the antenna gain of the omni base station is identical to the antenna gain of the sector base station. The method includes the steps of calculating the ratio of the coverage area of the sector base station to the omni base station, calculating the coverage area of the omni base station considering a handover area, and multiplying the calculated ratio of coverage area of the sector base station by the calculated coverage area of the omni base station, to determine the number of base stations required in designing the wireless network by the operator.
Abstract:
A semiconductor device and a fabrication method thereof which can, for example, prevent a punch-through from occurring by forming oxide spacers around source/drain regions in a semiconductor substrate instead of forming a conventional halo ion implanting layer. Such structure improves, for example, an operational speed by reducing junction capacitance, prevents a hot carrier effect from occurring by weakening an electric field around the drain region, and improves reliability by preventing a latch up from occurring. The semiconductor device includes a gate electrode formed on the semiconductor substrate, sidewall spacers formed at the sidewalls of the gate electrode, an impurity layer formed in the semiconductor substrate below each sidewall spacer, a trench formed in the semiconductor substrate at both sides of the gate electrode, oxide spacers formed at the bottom inside corner of each trench, and a conductive material filling up each trench.
Abstract:
A counter circuit uses a plurality of counter circuits so as to be used in all products employing a counter circuit in a semiconductor device, and thereby performs a multi-bit linear burst sequence operation. The counter circuit for embodying a linear burst sequence includes: a low order counting means which responds to an external clock signal and an external counting control signal, receives and counts a least significant first bit data among base input signals having bits ranging from a first bit to a N-th bit, and then generates a first data signal and a first high order control signal; and a plurality of high order counting means which receive bits ranging from a second bit successively connected to the least significant first bit to N-th bit, perform a counting operation, and generate a second data signal and a second high order control signal. The high order counting means which responds to the high order control signal and the counting control signal which are generated from the high order counting means of a previous bit of a present input bit, performs a counting operation, and outputs data signal.
Abstract:
A thin film transistor and a method for fabricating the same in which a self alignment method is used to form an offset area and source and drain electrodes are disclosed, the TFT including a substrate; a trench formed in the substrate,; an active layer fromed on the substrate and on the trench; a gate insulating film formed on the active layer; a gate electrode formed on the gate insulating film on at least one side of the trench; a source region formed in the active layer on a bottom side of the trench; and drain regions formed in the active layer on the substrate to be isolated form the gate electrode.
Abstract:
A write error preventing circuit for a semiconductor memory device prevents an erroneous reading operation an input buffer compares an externally applied write enable signal to an effective level signal, which is preset therein. A write error preventive circuit outputs a disable signal to the input buffer during an interval of time when a ground voltage bounces in accordance with an internal output signal from a NAND gate of an output buffer. The circuit prevents the outputting of a write signal from the input buffer during a read operation in accordance with the internal output signal from the output buffer when the ground voltage bounces.