公开(公告)号：US20070007327A1

公开(公告)日：2007-01-11

申请号：US11334815

申请日：2006-01-18

申请人： Ok-Hwan Kim ,  Sang-Ho Lee

发明人： Ok-Hwan Kim ,  Sang-Ho Lee

IPC分类号： B26D7/01

CPC分类号： B26F1/36 ,  B26D3/10 ,  B26D7/2628 ,  B26D2007/0056 ,  B26D2007/0087 ,  B26F1/02 ,  B26F1/14 ,  B26F1/32 ,  B26F1/46 ,  Y10T83/8785 ,  Y10T83/8831 ,  Y10T83/8841 ,  Y10T83/943 ,  Y10T83/944

摘要： Rotary punching apparatus includes: an upper rotation plate provided with punching member on which punching blade having a pattern of a specific shape is formed, and an upper jig which support elastically the punching member and forms a guide hole in the same shape as the pattern; an upper plate configured to enable the upper rotation plate to be rotated; a lower rotation plate including lower jig on which a punching hole in the same shape as the pattern is formed; and lower plate configured to enable the lower rotation plate to be rotated. The upper and the lower plate are provided with at least one magnets in a position opposite to each other and the upper and the lower rotation plate are provided with at least one or more magnets in a position opposite to each other, so that the fixed position is mutually aligned due to the magnetic force of the magnet. As a result, the present invention can freely punch a desired position irrespective of punching positions such as the seat as an object of the punching.

摘要翻译： 旋转冲孔装置包括：上旋转板，其上形成有形成具有特定形状的图案的冲压刀片的冲压构件;弹性地支撑冲压构件并形成与图案相同形状的引导孔的上夹具; 配置成使上部旋转板旋转的上板; 下部旋转板包括下部夹具，其上形成与图案相同形状的冲孔; 并且下板被配置为使得下旋转板能够旋转。 上板和下板在彼此相对的位置设置有至少一个磁体，并且上下旋转板在彼此相对的位置中设置有至少一个或多个磁体，使得固定位置 由于磁体的磁力而相互对准。 结果，本发明可以自由地冲压期望的位置，而不管冲孔位置如作为冲孔的对象的座。

公开(公告)号：US07392730B2

公开(公告)日：2008-07-01

申请号：US11334815

申请日：2006-01-18

申请人： Ok-Hwan Kim ,  Sang-Ho Lee

发明人： Ok-Hwan Kim ,  Sang-Ho Lee

IPC分类号： B26F1/04

CPC分类号： B26F1/36 ,  B26D3/10 ,  B26D7/2628 ,  B26D2007/0056 ,  B26D2007/0087 ,  B26F1/02 ,  B26F1/14 ,  B26F1/32 ,  B26F1/46 ,  Y10T83/8785 ,  Y10T83/8831 ,  Y10T83/8841 ,  Y10T83/943 ,  Y10T83/944

摘要： A rotary punching apparatus includes: an upper rotation plate provided with punching member on which punching blade having a pattern of a specific shape is formed, and an upper jig which support elastically the punching member and forms a guide hole in the same shape as the pattern; an upper plate configured to enable the upper rotation plate to be rotated; a lower rotation plate including lower jig on which a punching hole in the same shape as the pattern is formed; and lower plate configured to enable the lower rotation plate to be rotated.

摘要翻译： 旋转冲孔装置包括：上旋转板，设置有冲压构件，在该冲切构件上形成有具有特定形状的图案的冲压刀;以及上夹具，其弹性地支撑冲压构件并形成与图案相同形状的引导孔 ; 配置成使上部旋转板旋转的上板; 下部旋转板包括下部夹具，其上形成与图案相同形状的冲孔; 并且下板被配置为使得下旋转板能够旋转。

公开(公告)号：US20080121083A1

公开(公告)日：2008-05-29

申请号：US11693947

申请日：2007-03-30

申请人： Ok-Hwan Kim ,  Sang-Ho Lee

发明人： Ok-Hwan Kim ,  Sang-Ho Lee

IPC分类号： B26D7/00

CPC分类号： B26F1/36 ,  B26D3/10 ,  B26D7/015 ,  B26D2007/0087 ,  B26F1/40 ,  B26F2001/407 ,  Y10T83/8878

摘要： A punching apparatus is disclosed. The apparatus includes an upper plate including a punching member having punching blade and guide blade with specific patterns, and upper jig to elastically support the punching member and having guide hole with the same pattern as the blade pattern; a lower plate including lower jig formed with punching hole having the same pattern as the blade pattern, and a guide protrusion to punch by variously changing positions of an object to be punched; and magnets independently provided at corresponding positions of the upper and lower plates, independent from each other, to face each other and to align the upper plate with the lower plate at a predetermined position. The punching can be freely performed at a desired position regardless of the position of the object to be punched and the object can have a continuous punched pattern.

摘要翻译： 公开了冲孔装置。 该装置包括上板，该上板包括具有冲切刀片和具有特定图案的引导刀片的冲压件，以及上部夹具，用于弹性地支撑冲压件并具有与刀片图案相同图案的导向孔; 下板，包括形成有与刀片图案相同图案的冲孔的下夹具，以及通过不同地改变待冲压物体的位置来冲压的引导突起; 独立地设置在彼此独立的上板和下板的相应位置处的磁体彼此面对并且将上板与下板对准在预定位置。 可以在期望的位置自由地执行冲孔，而不管待冲压的物体的位置如何，并且物体可以具有连续的冲压图案。

公开(公告)号：US08685797B2

公开(公告)日：2014-04-01

申请号：US13597086

申请日：2012-08-28

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US20120261810A1

公开(公告)日：2012-10-18

申请号：US13536268

申请日：2012-06-28

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.

摘要翻译： 提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

公开(公告)号：US08254933B2

公开(公告)日：2012-08-28

申请号：US12029809

申请日：2008-02-12

申请人： Young-Hak Choi ,  Pyeong-Hwan Wee ,  Sang-Jun Lee ,  Jae-Yeong Kwon ,  Sang-Ho Lee

发明人： Young-Hak Choi ,  Pyeong-Hwan Wee ,  Sang-Jun Lee ,  Jae-Yeong Kwon ,  Sang-Ho Lee

IPC分类号： H04Q7/20

CPC分类号： H04W36/18 ,  H04W36/0022 ,  H04W36/0072 ,  H04W36/14 ,  H04W36/30 ,  H04W88/06 ,  H04W88/10

摘要： An apparatus and a method for handover between a broadband wireless communication system and a heterogeneous communication system are provided. An operating method of a base station for the handover between a broadband wireless communication system and a and a heterogeneous communication system includes when a terminal enters a border cell, sending a message requesting to measure a signal level of a downlink, to the terminal, when a signal level measured by the terminal falls below a preset threshold, requesting a handover, to a corresponding heterogeneous communication system, over a core network, receiving a message, including channel allocation information for the handover, from the corresponding heterogeneous communication system, and forwarding the message, including the channel allocation information, to the terminal. Hence, when the terminal gets out of the service coverage area of the broadband wireless communication system, it can be handed over to the heterogeneous communication system seamlessly.

摘要翻译： 提供了宽带无线通信系统与异构通信系统之间切换的装置和方法。 用于宽带无线通信系统和异构通信系统之间的切换的基站的操作方法包括当终端进入边界小区时，向终端发送请求测量下行链路的信号电平的消息，当时 由终端测量的信号电平低于预设阈值，通过核心网请求切换到相应的异构通信系统，从对应的异构通信系统接收包括用于切换的信道分配信息的消息，以及转发 向终端发送包括信道分配信息的消息。 因此，当终端离开宽带无线通信系统的服务覆盖区域时，可以无缝地切换到异构通信系统。

公开(公告)号：US08067307B2

公开(公告)日：2011-11-29

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L21/44 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 以及将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。

公开(公告)号：US20100061288A1

公开(公告)日：2010-03-11

申请号：US12517350

申请日：2007-09-21

申请人： Mi-Young Yun ,  Jung-Mo Moon ,  Sang-Ho Lee

发明人： Mi-Young Yun ,  Jung-Mo Moon ,  Sang-Ho Lee

IPC分类号： H04H20/71

CPC分类号： H04J3/0647 ,  H04J3/0682 ,  H04W4/06 ,  H04W56/00 ,  H04W76/40

摘要： In a communication system, a plurality of radio access systems (RASs) respectively receives connection resources from an MBS server for transmitting a multicast broadcast data packet. The MBS server is involved in transmission of the multicast broadcast data packet. Then, the plurality of RASs receive the multicast broadcast data packet including parameters for synchronization between the plurality of RASs and parameters for size and location of the multicast broadcast data packet and deliver the received multicast broadcast data packet to a portable subscriber station (PSS). Thereby, the plurality of RASs can transmit the multicast broadcast data packets with the same location and the same size to the PSSs at the same time.

摘要翻译： 在通信系统中，多个无线接入系统（RAS）分别从用于发送组播广播数据分组的MBS服务器接收连接资源。 MBS服务器涉及组播广播数据包的传输。 然后，多个RAS接收组播广播数据分组，其包括用于多个RAS之间的同步的参数和用于组播广播数据分组的大小和位置的参数，并将接收到的多播广播数据分组传送到便携式用户台（PSS）。 因此，多个RAS可以同时发送具有相同位置和相同大小的多播广播数据分组给PSS。

公开(公告)号：US20090140408A1

公开(公告)日：2009-06-04

申请号：US11948060

申请日：2007-11-30

申请人： Taewoo Lee ,  Sang-Ho Lee ,  Soo-San Park

发明人： Taewoo Lee ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L25/105 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206

摘要： An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected.

摘要翻译： 集成电路封装封装系统包括：提供具有底部衬底的底部集成电路封装系统; 安装顶部集成电路封装系统，该系统在底部集成电路封装系统上具有顶部衬底; 通过顶部基板形成顶部堆叠通孔; 将底部堆叠通孔形成底部集成电路封装系统到底部基板; 以及通过经由对齐和连接的顶部堆叠通孔和底部堆叠的互连形成堆叠。

公开(公告)号：US20090103799A1

公开(公告)日：2009-04-23

申请号：US12253618

申请日：2008-10-17

申请人： Chan-Kyeong Hyon ,  Young-Seog Kang ,  Sang-Ho Lee ,  Hyun-Jong Lee

发明人： Chan-Kyeong Hyon ,  Young-Seog Kang ,  Sang-Ho Lee ,  Hyun-Jong Lee

IPC分类号： G06K9/00 ,  G06K9/62

CPC分类号： G03F1/84

摘要： A pattern matching method for use in manufacturing a semiconductor memory device increases a pattern matching rate between a GDS image and an SEM image. The pattern matching method includes extracting a scanning electron microscope (SEM) image and a graphic data system (GDS) image to perform a pattern matching; performing a two-dimensional furrier transform (FFT) for the extracted GDS image and analyzing a low spatial frequency; deciding whether or not a pattern is a repeated pattern or non-repeated pattern by using the analyzed low spatial frequency; and limiting an X/Y range for a pattern matching when the decision result is for the repeated pattern, and then performing the pattern matching between the SEM image and the GDS image.

摘要翻译： 用于制造半导体存储器件的图案匹配方法增加了GDS图像和SEM图像之间的图案匹配率。 模式匹配方法包括提取扫描电子显微镜（SEM）图像和图形数据系统（GDS）图像以执行模式匹配; 对所提取的GDS图像执行二维傅立叶变换（FFT），并分析低空间频率; 通过使用所分析的低空间频率来确定图案是否是重复图案或非重复图案; 并且当判定结果用于重复图案时，限制用于模式匹配的X / Y范围，然后执行SEM图像和GDS图像之间的图案匹配。