公开(公告)号：US5256903A

公开(公告)日：1993-10-26

申请号：US797964

申请日：1991-11-26

申请人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

发明人： Maya Obata ,  Asao Nishimura ,  Makoto Kitano ,  Akihiro Yaguchi ,  Ryuji Kohno ,  Nae Yoneda ,  Ichiro Anjoh ,  Gen Murakami

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/30

CPC分类号： H01L23/49506 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/4951 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01057 ,  H01L2924/181

摘要： A plastic encapsulated semiconductor device containing one or more of insulating films. Uneven surfaces, such as recesses and roughened surfaces, are strategically provided on peripheral side (edge) surfaces of the insulating films. As a result, therefore, an interface separation does not easily occur between the side surfaces of the insulating films and the encapsulating resin. If such an interface separation should occur, it cannot develop easily. Thus, it is possible to obtain a plastic encapsulated semiconductor device of a high level of reliability even when the largest possible semiconductor element is mounted therein within limited outside dimensions.

摘要翻译： 一种包含一种或多种绝缘膜的塑料封装半导体器件。 在绝缘膜的周边（边缘）表面上策略性地提供不均匀的表面，例如凹槽和粗糙表面。 因此，绝缘膜和封装树脂的侧面之间不容易发生界面分离。 如果这样的界面分离应该发生，就不容易开发。 因此，即使在有限的外部尺寸下将最大可能的半导体元件安装在其中，也可以获得高可靠性的塑料封装的半导体器件。

公开(公告)号：US5194935A

公开(公告)日：1993-03-16

申请号：US647416

申请日：1991-01-29

申请人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Sueo Kawai ,  Gen Murakami ,  Ichio Shimizu

发明人： Makoto Kitano ,  Asao Nishimura ,  Akihiro Yaguchi ,  Nae Yoneda ,  Ryuji Kohno ,  Sueo Kawai ,  Gen Murakami ,  Ichio Shimizu

IPC分类号： H01L23/29 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/3675 ,  H01L2224/48091 ,  H01L2224/48247

摘要： The plastic encapsulated semiconductor device according to the present invention has a semiconductor chip, leads, and members for electrically connecting these parts to each other. A part of leads, the semiconductor chip and the connecting members are encapsulated with a plastic to form a package. The plate type plastic fins formed on the surface of and integrally with the package are divided in two directions perpendicular to each other thereby forming, for example, rows and columns of fins or fin segments, on the package surface. Therefore, the semiconductor device according to the present invention can be molded easily by a transfer molding. It has a high reliability with respect to the prevention of cracks in the plastic, and a low thermal resistance, and is most suitably used to obtain a high-density package mounting structure.

摘要翻译： 根据本发明的塑料封装半导体器件具有半导体芯片，引线和用于将这些部件彼此电连接的部件。 引线，半导体芯片和连接构件的一部分用塑料封装以形成封装。 形成在包装表面上并与包装整体形成的板状塑料翅片在彼此垂直的两个方向上分开，从而在包装表面上形成例如翅片或鳍片的行和列。 因此，根据本发明的半导体器件可以通过传递模塑容易地模制。 它在防止塑料中的裂纹方面具有高的可靠性，并且具有低的热阻，并且最适合用于获得高密度封装安装结构。