公开(公告)号：US20230049094A1

公开(公告)日：2023-02-16

申请号：US17883648

申请日：2022-08-09

Applicant: CYNTEC CO., LTD.

Inventor： CHIEN MING CHEN ,  DA-JUNG CHEN

IPC: H05K1/14 ,  H05K1/18

Abstract: An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

公开(公告)号：US11462351B2

公开(公告)日：2022-10-04

申请号：US16231415

申请日：2018-12-22

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hsun Lee ,  Min-Feng Chung

IPC: H01F27/24 ,  H01F27/28 ,  H01F5/04 ,  H01F27/02 ,  H01F27/29 ,  H01F17/04 ,  H01F3/10 ,  H01F27/38

Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.

公开(公告)号：US20220301756A1

公开(公告)日：2022-09-22

申请号：US17691081

申请日：2022-03-09

Applicant: CYNTEC CO., LTD.

Inventor： Shao-Wei Chang ,  Chu-Keng Lin ,  Hung-Chih Lin ,  Hsieh-Shen Hsieh

IPC: H01F27/02 ,  H01F17/06 ,  H01F41/02 ,  H01F27/32

Abstract: A magnetic component includes a first core component, a second core component and at least one coil. The first core component includes a first molding bobbin covering a first part of a core set by an injection molding process. The second core component includes a second molding bobbin covering a second part of the core set by the injection molding process. The first core component is assembled with the second core component to form a first pillar and a second pillar. Each of the first pillar and the second pillar includes a plurality of cores stacked with each other in a direction toward an outside or inside of the magnetic component. The at least one coil is wound on at least one of the first pillar and the second pillar.

公开(公告)号：US11450461B2

公开(公告)日：2022-09-20

申请号：US16820992

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Sen-Huei Chen ,  Chi-Cheng Ma

IPC: H05K1/18 ,  H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06

Abstract: An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.

公开(公告)号：US20220181070A1

公开(公告)日：2022-06-09

申请号：US17541255

申请日：2021-12-03

Applicant: CYNTEC CO., LTD.

Inventor： YuLun Chang ,  SEN-HUEI CHEN ,  WEI-LUN HUANG

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/24 ,  H01F41/02 ,  H01F41/06

Abstract: A magnetic device, comprising a body and a coil disposed in the body, wherein a terminal part of the conductive wire forming the coil comprises a first portion and a second portion, wherein the first portion is exposed from the body for forming an electrode, wherein the second portion of the terminal part is deformed for increasing the distance between the terminal part of the conductive wire and the coil for preventing a short circuit.

公开(公告)号：US20220148793A1

公开(公告)日：2022-05-12

申请号：US17584333

申请日：2022-01-25

Applicant: CYNTEC CO., LTD.

Inventor： Shuen-Chang Hung ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F38/14 ,  H02J50/10 ,  H01F41/06

Abstract: A shielding layer that is made of conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor to shield the coil from the external magnetic field and make the resistance and the power loss of the inductor lower.

公开(公告)号：US20220130603A1

公开(公告)日：2022-04-28

申请号：US17508935

申请日：2021-10-22

Applicant: CYNTEC CO., LTD.

Inventor： CHI-HSUN LEE ,  Min-Feng Chung

IPC: H01F27/36 ,  H01F27/29 ,  H01F41/02

Abstract: At least one shielding layer made of conductive material is formed on a body of an inductor, wherein at least one portion of the top surface of the body is exposed from the shielding layer, so as to provide an exhaust channel for moisture inside the body to leak to the outside of the body, thereby preventing the residual moisture from deforming the inductor due to thermal expansion.

公开(公告)号：US20220130599A1

公开(公告)日：2022-04-28

申请号：US17508940

申请日：2021-10-22

Applicant: CYNTEC CO., LTD.

Inventor： CHI-HSUN LEE ,  Min-Feng Chung

IPC: H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F41/04

Abstract: A recess is formed on a bottom surface of a body of an inductor, wherein an electrode for connecting to a ground is disposed in the recess, and an electrode connecting with a coil of the inductor is disposed on a protruding portion adjacent to the recess.

公开(公告)号：US20220130585A1

公开(公告)日：2022-04-28

申请号：US17317902

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： DA-JUNG CHEN ,  Chien Ming Chen

IPC: H01F27/02 ,  H01L25/16 ,  H01L49/02 ,  H01F27/29 ,  H01F27/28 ,  H01F27/26 ,  H01F41/00

Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.

公开(公告)号：US11257614B2

公开(公告)日：2022-02-22

申请号：US16177391

申请日：2018-10-31

Applicant: CYNTEC CO., LTD.

Inventor： Hsin-Jung Cheng ,  Ming-Tsung Pan

IPC: H01F27/30 ,  H01F17/00 ,  H01F27/32 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F27/26 ,  H01F27/29

Abstract: An integrated vertical inductor includes a bobbin having an elongated, hollow tube, an upper flange disposed at an upper end of the elongated, hollow tube, and a base structure integrated with a lower end of the elongated, hollow tube. The elongated, hollow tube comprises a central opening extending along its longitudinal direction. The base structure comprises a lateral opening communicating with the central opening. A first magnetic core piece is installed in the central opening of the elongated, hollow tube. A second magnetic core piece is juxtaposed with the first magnetic core piece. A plurality of electrodes is disposed on a bottom surface of the base structure.