公开(公告)号：US20200303107A1

公开(公告)日：2020-09-24

申请号：US16821014

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H01F41/076 ,  H01F41/063 ,  H05K1/11

Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

公开(公告)号：US20240105379A1

公开(公告)日：2024-03-28

申请号：US18227295

申请日：2023-07-27

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Hao-Chun Chang ,  Tung-Cheng Chuang

IPC: H01F27/28 ,  H01F27/26 ,  H01F37/00 ,  H01F41/10

CPC classification number: H01F27/2828 ,  H01F27/263 ,  H01F37/00 ,  H01F41/10

Abstract: A magnetic component includes a core, a winding, a lead frame and a conductive material. The winding is disposed in the core. A winding end of the winding extends to an outer periphery of the core. The lead frame is disposed on the outer periphery of the core. At least one hole is formed on the lead frame and corresponds to the winding end. The conductive material is disposed in the at least one hole. The conductive material is in contact with the winding end.

公开(公告)号：US20220157512A1

公开(公告)日：2022-05-19

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01F27/28 ,  H01F27/24 ,  H01F41/04 ,  H01F27/32

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US20200303114A1

公开(公告)日：2020-09-24

申请号：US16820944

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： TSUNG-CHAN WU ,  PEI-I WEI ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/24 ,  H01F27/29

Abstract: An inductor array comprising a magnetic body and a plurality of coils disposed in the magnetic body, wherein the magnetic body comprises a unitary portion that is disposed over and across the plurality of coils and extended into a space between each two adjacent coils of the plurality of coils.

公开(公告)号：US12183499B2

公开(公告)日：2024-12-31

申请号：US17317904

申请日：2021-05-12

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Kuan Yu Chiu ,  Ching Hsiang Yu

IPC: H01Q7/06 ,  H01F27/24 ,  H01F27/28 ,  H01F27/32 ,  H01F41/04 ,  H01Q7/08 ,  H02J7/00 ,  H02J50/10 ,  H02J50/70 ,  H05K7/20 ,  H10N10/00

Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.

公开(公告)号：US20220384088A1

公开(公告)日：2022-12-01

申请号：US17884540

申请日：2022-08-09

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hsun Lee ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F5/04 ,  H01F27/02 ,  H01F27/29 ,  H01F17/04 ,  H01F3/10 ,  H01F27/38

Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.

公开(公告)号：US11270834B2

公开(公告)日：2022-03-08

申请号：US16245259

申请日：2019-01-11

Applicant: CYNTEC CO., LTD.

Inventor： Shuen-Chang Hung ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F27/32 ,  H01F27/29 ,  H01F38/14 ,  H01F27/36

Abstract: A shielding layer that is made of a conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor so as to shield the coil from external magnetic field and make the resistance and the power loss of the inductor lower.

公开(公告)号：US20190221359A1

公开(公告)日：2019-07-18

申请号：US16245259

申请日：2019-01-11

Applicant: CYNTEC CO., LTD.

Inventor： Shuen-Chang Hung ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32

CPC classification number: H01F27/288 ,  H01F27/2804 ,  H01F27/2866 ,  H01F27/29 ,  H01F27/32

Abstract: A shielding layer that is made of a conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor so as to shield the coil from external magnetic field and make the resistance and the power loss of the inductor lower.

公开(公告)号：US12046408B2

公开(公告)日：2024-07-23

申请号：US17584333

申请日：2022-01-25

Applicant: CYNTEC CO., LTD.

Inventor： Shuen-Chang Hung ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F27/29 ,  H01F27/32 ,  H01F27/36 ,  H01F38/14 ,  H01F41/06 ,  H02J50/10

CPC classification number: H01F27/288 ,  H01F27/2804 ,  H01F27/2823 ,  H01F27/2866 ,  H01F27/2885 ,  H01F27/29 ,  H01F27/32 ,  H01F27/36 ,  H01F38/14 ,  H01F41/06 ,  H02J50/10 ,  H01F27/2871

Abstract: A shielding layer that is made of conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor to shield the coil from the external magnetic field and make the resistance and the power loss of the inductor lower.

公开(公告)号：US20230411057A1

公开(公告)日：2023-12-21

申请号：US18241916

申请日：2023-09-04

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H05K1/118 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/182 ,  H01F2027/065 ,  H05K2201/1003 ,  H05K1/112

Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.