Abstract:
One embodiment provides a method of testing humidity, comprising: i) determining a property of a device which encloses a plurality of interferometric modulators and ii) determining a relative humidity value or a degree of the relative humidity inside the device based at least in part upon the determined property, wherein the determined property comprises at least one of i) the thickness and width of a seal of the device and ii) adhesive permeability of a component of the device. In one embodiment, the determined property further comprises at least one of the following: i) temperature-humidity combination inside the device, ii) a desiccant capacity inside the device and iii) a device size.
Abstract:
Some implementations of the invention provide hidden static images. Some such images can only be perceived when viewed from an angle to the normal to a surface. Such images may appear as a solid color when viewed along an axis perpendicular to a surface, but may reveal a hidden image when viewed from an angle relative to that axis. The hidden image may be defined according to interfaces between areas that pass substantially the same wavelength when viewed along the axis, but which pass noticeably different wavelengths when viewed from an angle relative to that axis. The hidden images may or may not be discernable to a human observer. The hidden image may comprise a code that is not readable by an optical scanner positioned to read along an axis normal to a surface, but that is readable by an optical scanner positioned to read along another axis.
Abstract:
Charge balanced display data writing methods use write and hold cycles of opposite polarity during selected frame update periods. A release cycle may be provided to reduce the chance that a given display element will become stuck in an actuated state.
Abstract:
An interferometric mask covers reflective conductors on the back side of a photovoltaic device. Such an interferometric mask may reduce reflections of incident light from the conductors. In various embodiments, the mask reduces reflections, so that a front and back electrode pattern appears black or similar in color to surrounding features of the device. In other embodiments, the mask may modulate reflections of light such that the electrode pattern matches a color in the visible spectrum.
Abstract:
The width and location of a hysteresis window of an interferometric modulator may be altered by adjusting various physical characteristics of the interferometric modulator. Thus, depending on the particular application for which the interferometric modulators are manufactured, the width and location of the hysteresis window may be altered. For example, in some applications, reducing the power required to operate an array of interferometric modulators may be an important consideration. In other applications, the speed of the interferometric modulators may be of more importance, where the speed of an interferometric modulator, as used herein, refers to the speed of actuating and relaxing the moveable mirror. In other applications, the cost and ease of manufacturing may be of most importance. Systems and methods are introduced that allow selection of a width and location of a hysteresis window by adjusting various physical characteristics.
Abstract:
One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.
Abstract:
MEMS devices include materials which are used in LCD or OLED fabrication to facilitate fabrication on the same manufacturing systems. Where possible, the same or similar materials are used for multiple layers in the MEMS device, and use of transparent conductors for partially transparent electrodes can be avoided to minimize the number of materials needed and minimize fabrication costs. Certain layers comprise alloys selected to achieve desired properties. Intermediate treatment of deposited layers during the manufacturing process can be used to provide layers having desired properties.
Abstract:
A separable modulator architecture is disclosed. The modulator has a mirror suspended from a flexible layer over a cavity. The flexible layer also forms supports and support posts for the mirror. An alternative separable modulator architecture has a mirror suspended over a cavity. The modulator is supported by supports and support posts. The support posts comprise a flexible layer over support post plugs. A bus structure may be formed upon the flexible layer arranged over the support posts.
Abstract:
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
Abstract:
A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.