公开(公告)号：US20240349450A1

公开(公告)日：2024-10-17

申请号：US18447704

申请日：2023-08-10

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Huan-Shu CHIEN

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20254

Abstract: A rotatable joint for use in a liquid cooling system comprises a main body and at least one housing portion. The main body has a main body passageway defined therethrough. The at least one housing portion is rotatably coupled to the main body and has a housing portion passageway defined therethrough that is fluidly coupled to the main body passageway. The main body is rotatable between a first position and a second position relative to the at least one housing portion. The main body passageway is fluidly coupled to the housing portion passageway when the main body is in either of the first position and the second position.

公开(公告)号：US20240237296A1

公开(公告)日：2024-07-11

申请号：US18180687

申请日：2023-03-08

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Kun-Pei LIU ,  Yu-Nien HUANG

IPC: H05K7/20 ,  F28F3/02

CPC classification number: H05K7/20636 ,  F28F3/02 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20272 ,  F28F2260/02

Abstract: A cooling assembly for liquid cooling of a heat-generating component such as a dual in-line memory module (DIMM) in a computer device is disclosed. The cooling assembly includes a bracket holding a micro-pipe assembly. The micro-pipe assembly has a cold manifold, a hot manifold and a series of micro-pipes. The micro-pipes are fluidly coupled between the cold manifold and hot manifold to allow coolant flow between the cold manifold and the hot manifold. The bracket positions the micro-pipe assembly such that micro-pipes are positioned proximate to opposite sides of the heat-generating component. A coolant inlet supplies coolant to the cold manifold and a coolant outlet collecting coolant from the hot manifold.

公开(公告)号：US20230417252A1

公开(公告)日：2023-12-28

申请号：US18462569

申请日：2023-09-07

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Chih-Hsiang LEE ,  Wei-Pin CHEN ,  Yu-Syuan LIN ,  Jyue HOU

IPC: F04D25/14 ,  H05K7/20 ,  F04D29/70

CPC classification number: F04D25/14 ,  H05K7/20172 ,  F04D29/703

Abstract: A fan system and a computing system with the fan system are disclosed. The fan system includes a fan module. The fan module includes a housing configured to retain a fan and a motor to rotate the fan. The housing includes an air inlet aperture on an air inlet side of the housing and an air outlet aperture on an air outlet side of the housing. The fan system further includes an outlet fan guard coupled to the fan module on the air outlet side of the housing. The outlet fan guard includes at least one flap rotatable between a closed position, covering the air outlet aperture of the housing, and an open position, uncovering the air outlet aperture of the housing. The outlet fan guard further includes at least one spring urging the at least one flap into the closed position.

公开(公告)号：US20230387629A1

公开(公告)日：2023-11-30

申请号：US17819431

申请日：2022-08-12

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Chih-Wei LIN ,  Chia-Wei HUANG

IPC: H01R13/629

CPC classification number: H01R13/62961 ,  H01R13/62938

Abstract: A connector assembly that may be used to connect an upper circuit board to a lower circuit board is disclosed. The connector assembly includes a base, and a bracket mechanically fastened to the base. The connector assembly also has a handle rotatably coupled to the base. The connector assembly includes a link bar movably coupling the handle to the base. The connector assembly further includes a guiding feature mechanically coupled between the base and the bracket. The guiding feature is configured to direct relative motion between the base and the bracket. The link bar and the guiding feature are also configured to transfer an external force applied to the handle, the external force being transferred to the upper and lower circuit boards via the base and the bracket.

公开(公告)号：US20230345672A1

公开(公告)日：2023-10-26

申请号：US17825433

申请日：2022-05-26

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20509

Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.

公开(公告)号：US20230345671A1

公开(公告)日：2023-10-26

申请号：US17851365

申请日：2022-06-28

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20318 ,  H05K7/2039

Abstract: A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.

公开(公告)号：US20230345661A1

公开(公告)日：2023-10-26

申请号：US17845319

申请日：2022-06-21

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Kun-Pei LIU ,  Te-Hao HU

IPC: H05K7/14

CPC classification number: H05K7/1489

Abstract: A module comprises a tray, a mechanical switch, and a linkage system. The tray is configured to receive a circuit board thereon. The mechanical switch is mounted to the tray and movable between an unsecured position and a secured position. The linkage system is mechanically coupled to the mechanical switch, and moves between an unsecured configuration and a secured configuration in response to the mechanical switch moving between the unsecured position and the secured position. When the module is coupled to a computing device and the linkage system is in the secured configuration, the linkage system engages the computing device, such that the module is locked to the computing device. When the module is coupled to the computing device and the linkage system is in the unsecured configuration, the linkage system is disengaged from the computing device, such that the module is unlocked from the computing device.

公开(公告)号：US20230304618A1

公开(公告)日：2023-09-28

申请号：US17804772

申请日：2022-05-31

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Chih-Hsiang LEE ,  Wei-Pin CHEN ,  Jyue HOU

IPC: F16L37/127 ,  H05K7/20

CPC classification number: F16L37/127 ,  H05K7/20272 ,  H05K7/20781

Abstract: A quick-disconnect (QD) connector is configured for a server having electronic modules and an internal fluid circulation system for circulating fluid to cool the electronic modules. The QD connector comprises a first manifold, a second manifold, and a mating actuator. The second manifold is removably connected to the first manifold. The fluid is flowable within the internal fluid circulation system of the server in response to the first manifold and the second manifold being in a connected state. The mating actuator includes a handle and a buckle attached to the handle. The handle is movably coupled to the first manifold so as to be movable from a first position to a second position. The buckle is configured to engage the second manifold and to move the first and second manifolds into the connected state in response to the handle being moved from the first position to the second position.

公开(公告)号：US20230262934A1

公开(公告)日：2023-08-17

申请号：US17725053

申请日：2022-04-20

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Herman TAN ,  Tien-Juei CHUANG

IPC: H05K7/20

CPC classification number: H05K7/20354 ,  H05K7/20318 ,  H05K7/20309 ,  H05K7/20381

Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.

公开(公告)号：US20230262930A1

公开(公告)日：2023-08-17

申请号：US17654115

申请日：2022-03-09

Applicant: Quanta Computer Inc.

Inventor： Chao-Jung CHEN ,  Yu-Nien HUANG ,  Chang-Yu CHIANG

IPC: H05K7/20

CPC classification number: H05K7/203 ,  H05K7/20318 ,  H05K7/20381

Abstract: An immersion liquid cooling tank assembly includes a tank, a condenser, at least one cross-flow fan, an internal wall system, a top cover, and at least one sloping wall. The tank includes a base and at least one sidewall. The base is connected to the sidewall. The condenser is located within the tank. The condenser is adapted to transform vapor into liquid. The cross-flow fan is near the condenser. The cross-flow fan produces an airflow. The internal wall system is located adjacent to the cross-flow fan to assist in directing the airflow from the cross-flow fan. The top cover is located generally opposite to the base. The sloping wall is located between the top cover and the sidewall. The sloping wall provides a closed airflow loop for the airflow produced by the cross-flow fan.