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公开(公告)号：US20230083830A1
公开(公告)日：2023-03-16
申请号：US17943600
申请日：2022-09-13
Inventor： AKIHIKO TESHIGAHARA , TETSUYA ENOMOTO , HIDEO YAMADA
IPC: H01L41/08 , H01L41/187 , H01L41/316 , H01L41/319
Abstract: A piezoelectric film laminated body includes a metal film, an amorphous film, and a scandium aluminum nitride film. The amorphous film has an insulation property and is disposed on the metal film. The scandium aluminum nitride film is disposed on the amorphous film and is in contact with a surface of the amorphous film.
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公开(公告)号：US20230058463A1
公开(公告)日：2023-02-23
申请号：US17877249
申请日：2022-07-29
Inventor： Hiroshi ANDO , Kazuyuki ISHIHARA , Masatoshi TSUJI
IPC: F21V8/00
Abstract: An optical member includes a light guide body. The light guide body has an incident surface on which an outside light is incident, a first surface having flat portions and prism portions, an incident light incident on the incident surface reaching the first surface for the first time, and a second surface arranged opposite to the flat portions. The flat portions totally reflect the incident light toward the second surface. The second surface totally reflects a reflected light reflected by the flat portion toward the first surface. The prism portion has an ejection surface to emit the incident light to outside.
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公开(公告)号：US20230058119A1
公开(公告)日：2023-02-23
申请号：US17887044
申请日：2022-08-12
Inventor： HIROMICHI KATO , NOBUYUKI OTAKE , TAKASHI INOUE , TAKAYUKI SHIBATA
IPC: H04R17/00
Abstract: An ultrasonic generator has a speaker element having a first resonance frequency and a speaker element having a second resonance frequency. The first resonance frequency and the second resonance frequency are adjacent resonance frequencies in the speaker. The distance between the elements is set so that the sound from the first speaker element and the sound from the second speaker element have a predetermined relationship at a target position. The target position is two or more positions on the object located in the target space. A predetermined relationship is a relationship in which a sound from the first speaker element and a sound from the second speaker element strengthen each other at an intermediate frequency between the first resonance frequency and the second resonance frequency.
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公开(公告)号：US20230054772A1
公开(公告)日：2023-02-23
申请号：US17875677
申请日：2022-07-28
Inventor： TOMOHIRO NEZUKA , YOSHIKAZU FURUTA , SHOTARO WADA
Abstract: A current sensor of a detection target current using a shunt resistor includes: a resistance value correction circuit having: a correction resistor; a signal application unit that applies an alternating current signal to a series circuit of the shunt resistor and the correction resistor; a first voltage detection unit that detects the terminal voltage of the shunt resistor; a second voltage detection unit that detects a terminal voltage of the correction resistor; and a correction unit that calculates the resistance value of the shunt resistor based on a first voltage detection value by the first voltage detection unit and a second voltage detection value by the second voltage detection unit, and corrects the resistance value for current detection based on a calculated resistance value of the shunt resistor.
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公开(公告)号：US20230042721A1
公开(公告)日：2023-02-09
申请号：US17877282
申请日：2022-07-29
Inventor： YOHEI IWAHASHI
Abstract: A semiconductor device includes a gate extraction portion extracted from a gate electrode and extending from an active region to an outer peripheral region so as to be disposed above an end portion of a field insulating film. The end portion of the gate field insulating film above which the gate extraction portion is disposed is inclined in such a manner that a thickness of the field insulating film increases in a direction from the active region toward the outer peripheral region.
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Patent Agency Ranking
公开(公告)号：US20220407748A1
公开(公告)日：2022-12-22
申请号：US17841030
申请日：2022-06-15
Inventor： SHIGEKI OTSUKA , HYOUNGJUN NA , TAKASUKE ITO , YOSHIKAZU FURUTA , TOMOHIRO NEZUKA
Abstract: A differential communication circuit is connected to a communication line formed of a positive communication line and a negative communication line for differential communication. The differential communication circuit includes: a series circuit that includes a resistor element and a connection switch. The resistor element is connected between the positive and negative communication lines when the connection switch is turned on. The circuit also includes a transmission unit that is configured to output a differential signal to the communication line and a controller that is configured to change impedance of the communication line by turning on the connection switch in a period during which the transmission unit does not output the differential signal.
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公开(公告)号：US20220402506A1
公开(公告)日：2022-12-22
申请号：US17836446
申请日：2022-06-09
Inventor： YUJIRO MIZOBUCHI , HIROSHI ANDO , KODAI TAKEDA
Abstract: A blind spot assist device includes a first optical element and a second optical element. The first optical element reflects a part of incident light having a first angle of incidence at different second angles such that light is incident at the first angle on the first optical element from an outdoor view and reflected at the second angles on the first optical element. The second optical element is positioned to face the first optical element and reflects incident lights having different angles of incidence at a third angle such that lights reflected by the first optical element are incident at the second angles on the second optical element and reflected at the third angle on the second optical element toward a user.
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公开(公告)号：US20220352027A1
公开(公告)日：2022-11-03
申请号：US17708490
申请日：2022-03-30
Applicant: DENSO CORPORATION , TOYOTA JIDOSHA KABUSHIKI KAISHA , MIRISE Technologies Corporation , National University Corporation Tokai National Higher Education and Research System , HAMAMATSU PHOTONICS K.K.
Inventor： Shinichi Hoshi , Masatake Nagaya , Chiaki Sasaoka , Daisuke Kawaguchi , Keisuke Hara
IPC: H01L21/78 , H01L29/20 , H01L29/778 , H01L21/02
Abstract: A semiconductor chip includes a chip constituent substrate having a first surface and a second surface, and including a layer containing gallium nitride. The chip constituent substrate is provided with a semiconductor element, and components constituting the semiconductor element are located more in an area adjacent to the first surface than in an area adjacent to the second surface. The chip constituent substrate is formed with a through hole penetrating the chip constituent substrate from the first surface to the second surface. The through hole defines a first opening adjacent to the first surface and a second opening adjacent to the second surface, and the first opening is larger than the second opening.
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公开(公告)号：US20220322515A1
公开(公告)日：2022-10-06
申请号：US17679622
申请日：2022-02-24
Inventor： Shohei NAGAI
Abstract: A semiconductor device includes: a substrate main body having a first surface and a second surface; an electric component arranged in the substrate main body; a surface conductor pattern arranged in a first circuit layer located on the second surface; a first internal conductor pattern and a second internal conductor pattern arranged in a second circuit layer located between the electric component and the second surface, and insulated from each other; at least one first heat conductor via extending from the electric component to the first internal conductor pattern; and at least one second heat conductor via extending from the surface conductor pattern to the second internal conductor pattern.
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公开(公告)号：US20220293485A1
公开(公告)日：2022-09-15
申请号：US17684550
申请日：2022-03-02
Inventor： Shohei NAGAI
IPC: H01L23/367
Abstract: A semiconductor device includes a semiconductor chip, a heat sink, a resin package, heat transfer material and multiple spacers. The heat sink absorbs heat of the semiconductor chip. The resin package accommodates the semiconductor chip, and the resin package has a surface at which the heat sink is disposed. The heat transfer material has fluidity, and the heat transfer material is filled between the heat sink and the cooling plate. The spacers are dispersedly arranged in the heat transfer material, and the spacers are in contact with the heat sink and the cooling plate.
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