公开(公告)号：US20220360336A1

公开(公告)日：2022-11-10

申请号：US17866482

申请日：2022-07-16

申请人： Ayar Labs, Inc.

发明人： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

IPC分类号： H04B10/50 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/02325

摘要： An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

公开(公告)号：US20220163723A1

公开(公告)日：2022-05-26

申请号：US17531678

申请日：2021-11-19

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade

IPC分类号： G02B6/26 ,  H04B10/25

摘要： A multi-MCP (multi-chip package) module assembly includes a plate, an integrated optical fiber shuffle disposed on the plate, a first MCP disposed on the plate, a second MCP disposed on the plate, a first optical fiber jumper disposed on the plate, and a second optical fiber jumper disposed on the plate. The first optical fiber jumper optically connects the first MCP to the integrated optical fiber shuffle. The second optical fiber jumper optically connects the second MCP to the integrated optical fiber shuffle. The integrated optical fiber shuffle includes an optical network configured to direct optical signals to and from each of the first optical fiber jumper and the second optical fiber jumper.

公开(公告)号：US20220155538A1

公开(公告)日：2022-05-19

申请号：US17524697

申请日：2021-11-11

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Chen Sun

IPC分类号： G02B6/42 ,  H04B10/2569

摘要： An optical data communication system includes an optical transmitter and an optical receiver. A polarization-maintaining optical data communication link extends from an optical output of the optical transmitter to an optical input of the optical receiver. The polarization-maintaining optical data communication link includes at least two sections of polarization-maintaining optical fiber optically connected through an optical connector. The at least two sections of polarization-maintaining optical fiber have different lengths. The optical connector is configured to optically align a fast polarization axis of a first polarization-maintaining optical fiber to a slow polarization axis of a second polarization-maintaining optical fiber. The optical connector is also configured to optically align a slow polarization axis of the first polarization-maintaining optical fiber to a fast polarization axis of the second polarization-maintaining optical fiber.

公开(公告)号：US11249260B2

公开(公告)日：2022-02-15

申请号：US16937428

申请日：2020-07-23

申请人： Ayar Labs, Inc.

发明人： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/293

摘要： An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

公开(公告)号：US20210405295A1

公开(公告)日：2021-12-30

申请号：US17353782

申请日：2021-06-21

申请人： Ayar Labs, Inc.

发明人： Pavan Bhargava ,  Derek Van Orden ,  Mark Wade ,  John Fini ,  Chen Sun ,  Milos Popovic ,  Anatol Khilo

IPC分类号： G02B6/27

摘要： An optical input polarization management device includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization so as to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Light within the first and second OW's is input to a first two-by-two optical splitter (2x2OS). A first phase shifter (PS) is interfaced with either the first or second OW. Light is output from the first 2x2OS into a third OW and a fourth OW. Light within the third and fourth OW's is input to a second 2x2OS. A second PS is interfaced with either the third or fourth OW. Light is output from the second 2x2OS into a fifth OW for further processing.

公开(公告)号：US11163120B2

公开(公告)日：2021-11-02

申请号：US16685838

申请日：2019-11-15

申请人： Ayar Labs, Inc.

发明人： Shahab Ardalan ,  Michael Davenport ,  Roy Edward Meade

IPC分类号： G02B6/30 ,  G02B6/122 ,  H01L21/56 ,  G02B6/42

摘要： A package assembly includes a silicon photonics chip having an optical waveguide exposed at a first side of the chip and an optical fiber coupling region formed along the first side of the chip. The package assembly includes a mold compound structure formed to extend around second, third, and fourth sides of the chip. The mold compound structure has a vertical thickness substantially equal to a vertical thickness of the chip. The package assembly includes a redistribution layer formed over the chip and over a portion of the mold compound structure. The redistribution layer includes electrically conductive interconnect structures to provide fanout of electrical contacts on the chip to corresponding electrical contacts on the redistribution layer. The redistribution layer is formed to leave the optical fiber coupling region exposed. An optical fiber is connected to the optical fiber coupling region in optical alignment with the optical waveguide within the chip.

公开(公告)号：US20210258078A1

公开(公告)日：2021-08-19

申请号：US17175677

申请日：2021-02-14

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

IPC分类号： H04B10/80 ,  H04B10/516

摘要： A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

公开(公告)号：US20210257288A1

公开(公告)日：2021-08-19

申请号：US17175490

申请日：2021-02-12

申请人： Ayar Labs, Inc.

发明人： Roy Edward Meade

IPC分类号： H01L23/498 ,  G02B6/42 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

摘要： A redistribution layer is formed on a carrier wafer. A cavity is formed within the redistribution layer. An electro-optical die is flip-chip connected to the redistribution layer. A plurality of optical fiber alignment structures within the electro-optical die is positioned over and exposed to the cavity. Mold compound material is disposed over the redistribution layer and the electro-optical die. A residual kerf region of the electro-optical die interfaces with the redistribution layer to prevent mold compound material from entering into the optical fiber alignment structures and the cavity. The carrier wafer is removed from the redistribution layer. The redistribution layer and the mold compound material are cut to obtain an electro-optical chip package that includes the electro-optical die. The cutting removes the residual kerf region from the electro-optical die to expose the plurality of optical fiber alignment structures and the cavity at an edge of the electro-optical chip package.

公开(公告)号：US10581215B2

公开(公告)日：2020-03-03

申请号：US16195829

申请日：2018-11-19

申请人： Ayar Labs, Inc.

发明人： Milos Popovic ,  Rajeev Ram ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Taylor Wade ,  Alexandra Carroll Wright

IPC分类号： H04J14/02 ,  H01S3/08 ,  H04B10/50 ,  H01S3/00 ,  H01S3/04 ,  H01S3/23 ,  H04B10/25 ,  H04B10/40 ,  H04B10/572

摘要： A laser light generator is configured to generate one or more wavelengths of continuous wave laser light. The laser light generator is configured to collectively and simultaneously transmit each of the wavelengths of continuous wave laser light through an optical output of the laser light generator as a laser light supply. An optical fiber is connected to receive the laser light supply from the optical output of the laser light generator. An optical distribution network has an optical input connected to receive the laser light supply from the optical fiber. The optical distribution network is configured to transmit the laser light supply to each of one or more optical transceivers and/or optical sensors. The laser light generator is physically separate from each of the one or more optical transceivers and/or optical sensors.

公开(公告)号：US20240302609A1

公开(公告)日：2024-09-12

申请号：US18669500

申请日：2024-05-20

申请人： Ayar Labs, Inc.

发明人： John Fini ,  Anatol Khilo ,  Chen Sun ,  Pavan Bhargava ,  Chandarasekaran Ramamurthy

IPC分类号： G02B6/42 ,  G02B6/293 ,  H04B10/60

CPC分类号： G02B6/4215 ,  G02B6/29335 ,  G02B6/29338 ,  G02B6/2938 ,  G02B6/29395 ,  G02B6/4213 ,  H04B10/60 ,  G02B6/29343

摘要： A first portion of incoming light and a second portion of incoming light travel in opposite directions within a first optical waveguide. A ring resonator in-couples the first portion of incoming light and the second portion of incoming light from the first optical waveguide, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the ring resonator. A second optical waveguide is disposed to in-couple the first portion of incoming light and the second portion of incoming light couple from the ring resonator, such that the first portion of incoming light and the second portion of incoming light travel in opposite directions within the second optical waveguide away from the ring resonator. One or more photodetector(s) are optically connected to receive the first portion of incoming light and the second portion of incoming light from the second optical waveguide.