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    Chip-to-Chip Optical Data Communication System
    1.
    发明公开
    Chip-to-Chip Optical Data Communication System 审中-公开

    公开(公告)号：US20240310589A1

    公开(公告)日：2024-09-19

    申请号：US18675112

    申请日：2024-05-27

    Applicant: Ayar Labs, Inc.

    Inventor： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

    IPC: G02B6/42 ,  G02B6/293

    CPC classification number: G02B6/4202 ,  G02B6/2934 ,  G02B6/4216 ,  G02B6/4219 ,  G02B6/4287

    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

    Laser Module for Optical Data Communication System within Silicon Interposer
    5.
    发明申请
    Laser Module for Optical Data Communication System within Silicon Interposer 有权

    公开(公告)号：US20220360336A1

    公开(公告)日：2022-11-10

    申请号：US17866482

    申请日：2022-07-16

    Applicant: Ayar Labs, Inc.

    Inventor： Chen Sun ,  Roy Edward Meade ,  Mark Wade ,  Alexandra Wright ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Derek Van Orden ,  Michael Davenport

    IPC: H04B10/50 ,  H01S5/40 ,  H01S5/026 ,  H04B10/80 ,  H01S5/02325

    Abstract: An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

    Chip-to-chip optical data communication system
    6.
    发明授权
    Chip-to-chip optical data communication system 有权

    公开(公告)号：US11249260B2

    公开(公告)日：2022-02-15

    申请号：US16937428

    申请日：2020-07-23

    Applicant: Ayar Labs, Inc.

    Inventor： Alexandra Wright ,  Mark Wade ,  Chen Sun ,  Vladimir Stojanovic ,  Rajeev Ram ,  Milos Popovic ,  Roy Edward Meade ,  Derek Van Orden

    IPC: G02B6/12 ,  G02B6/42 ,  G02B6/293

    Abstract: An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

    Optical Input Polarization Management Device and Associated Methods
    7.
    发明申请
    Optical Input Polarization Management Device and Associated Methods 有权

    公开(公告)号：US20210405295A1

    公开(公告)日：2021-12-30

    申请号：US17353782

    申请日：2021-06-21

    Applicant: Ayar Labs, Inc.

    Inventor： Pavan Bhargava ,  Derek Van Orden ,  Mark Wade ,  John Fini ,  Chen Sun ,  Milos Popovic ,  Anatol Khilo

    IPC: G02B6/27

    Abstract: An optical input polarization management device includes a polarization splitter and rotator (PSR) that directs a portion of incoming light having a first polarization through a first optical waveguide (OW). The PSR rotates a portion of the incoming light having a second polarization to the first polarization so as to provide polarization-rotated light. The PSR directs the polarization-rotated light through a second OW. Light within the first and second OW's is input to a first two-by-two optical splitter (2x2OS). A first phase shifter (PS) is interfaced with either the first or second OW. Light is output from the first 2x2OS into a third OW and a fourth OW. Light within the third and fourth OW's is input to a second 2x2OS. A second PS is interfaced with either the third or fourth OW. Light is output from the second 2x2OS into a fifth OW for further processing.

    Remote Memory Architectures Enabled by Monolithic In-Package Optical I/O
    8.
    发明申请
    Remote Memory Architectures Enabled by Monolithic In-Package Optical I/O 有权

    公开(公告)号：US20210258078A1

    公开(公告)日：2021-08-19

    申请号：US17175677

    申请日：2021-02-14

    Applicant: Ayar Labs, Inc.

    Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Chen Sun ,  Mark Wade ,  Hugo Saleh ,  Charles Wuischpard

    IPC: H04B10/80 ,  H04B10/516

    Abstract: A remote memory system includes a substrate of a multi-chip package, an integrated circuit chip connected to the substrate, and an electro-optical chip connected to the substrate. The integrated circuit chip includes a high-bandwidth memory interface. An electrical interface of the electro-optical chip is electrically connected to the high-bandwidth memory interface. A photonic interface of the electro-optical chip is configured to optically connect with an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals received through the electrical interface from the high-bandwidth interface into outgoing optical data signals. The optical macro transmits the outgoing optical data signals through the photonic interface to the optical link. The optical macro also converts incoming optical data signals received through the photonic interface into incoming electrical data signals. The optical macro transmits the incoming electrical data signals through the electrical interface to the high-bandwidth memory interface.

    Photonic Fanout
    9.
    发明申请
    Photonic Fanout 审中-公开

    公开(公告)号：US20200158950A1

    公开(公告)日：2020-05-21

    申请号：US16688904

    申请日：2019-11-19

    Applicant: Ayar Labs, Inc.

    Inventor： Roy Edward Meade ,  Vladimir Stojanovic ,  Mark Wade

    IPC: G02B6/12

    Abstract: A photonic fanout die has a planar structure that has a top surface, a bottom surface, and outer side surfaces extending between the top surface and the bottom surface around an outer perimeter of the planar structure. The planar structure includes an opening formed within the outer perimeter. The opening has side surfaces that extend from the top surface to the bottom surface. The photonic fanout die also includes a plurality of optical waveguides formed within the planar structure to extend from a side surface of the opening to an outer side surface of the planar structure. The plurality of optical waveguides is configured such that a spacing between adjacent optical waveguides at the outer side surface of the planar structure is greater than a spacing between adjacent optical waveguides at the side surface of the opening.

    Optical Multiplexer/Demultiplexer Module and Associated Methods
    10.
    发明申请
    Optical Multiplexer/Demultiplexer Module and Associated Methods 审中-公开

    公开(公告)号：US20200021385A1

    公开(公告)日：2020-01-16

    申请号：US16510829

    申请日：2019-07-12

    Applicant: Ayar Labs, Inc.

    Inventor： Vladimir Stojanovic ,  Alexandra Wright ,  Chen Sun ,  Mark Wade ,  Roy Edward Meade

    IPC: H04J14/02 ,  H04Q11/00 ,  H04B10/50

    Abstract: A TORminator module is disposed with a switch linecard of a rack. The TORminator module receives downlink electrical data signals from a rack switch. The TORminator module translates the downlink electrical data signals into downlink optical data signals. The TORminator module transmits multiple subsets of the downlink optical data signals through optical fibers to respective SmartDistributor modules disposed in respective racks. Each SmartDistributor module receives multiple downlink optical data signals through a single optical fiber from the TORminator module. The SmartDistributor module demultiplexes the multiple downlink optical data signals and distributes them to respective servers. The SmartDistributor module receives multiple uplink optical data signals from multiple servers and multiplexes them onto a single optical fiber for transmission to the TORminator module. The TORminator module coverts the multiple uplink optical data signals to multiple uplink electrical data signals, and transmits the multiple uplink electrical data signals to the rack switch.

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