Receptacle configuration to support on-board receiver optical subassembly (ROSA)

    公开(公告)号:US10884201B2

    公开(公告)日:2021-01-05

    申请号:US16053398

    申请日:2018-08-02

    Abstract: The present disclosure is generally directed to an on-board ROSA arrangement where a fiber receptacle element, optical components such as optical de-multiplexer (e.g., an arrayed waveguide grating (AWG)), turning mirror, photodiodes and light receiving chip are mounted to a common substrate. The fiber receptacle element includes a body that defines a slot to at least partially receive an end of the substrate and mount thereto. The body of the fiber receptacle further includes an aperture that extends through the body to receive an optical fiber and/or associated connector and align the same with ROSA components mounted on a surface of the substrate. The fiber receptacle body may be solid, e.g., formed from a single, monolithic piece of material, and may be manufactured from metal, plastic or other suitably rigid material.

    TRANSMITTER OPTICAL SUBASSEMBLY (TOSA) WITH LASER DIODE DRIVER (LDD) CIRCUITRY MOUNTED TO FEEDTHROUGH OF TOSA HOUSING

    公开(公告)号:US20200285008A1

    公开(公告)日:2020-09-10

    申请号:US16295586

    申请日:2019-03-07

    Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.

    OPTICAL ISOLATOR ARRAY FOR USE IN AN OPTICAL SUBASSEMBLY MODULE

    公开(公告)号:US20200241334A1

    公开(公告)日:2020-07-30

    申请号:US16257635

    申请日:2019-01-25

    Abstract: This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.

    Transmitter optical subassembly arrangement with vertically-mounted monitor photodiodes

    公开(公告)号:US10714890B1

    公开(公告)日:2020-07-14

    申请号:US16268765

    申请日:2019-02-06

    Abstract: The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.

    PRINTED CIRCUIT BOARD ASSEMBLY (PCBA) WITH INTEGRATED MOUNTING STRUCTURE TO ALIGN AND COUPLE TO TRANSMITTER OPTICAL ASSEMBLY (TOSA) MODULES

    公开(公告)号:US20200218018A1

    公开(公告)日:2020-07-09

    申请号:US16239197

    申请日:2019-01-03

    Abstract: The present disclosure is generally directed to an optical transceiver module that includes a mounting section for aligning and coupling to associated TOSA modules. In particular, an embodiment of the present disclosure includes TOSA and ROSA components disposed on a printed circuit board assembly (PCBA). The PCBA includes a plurality of grooves at a optical coupling end to provide a TOSA mounting section. Each of the grooves provides at least one mating surface to receive and couple to an associated TOSA module. Opposite the optical coupling end, the PCBA includes an electric coupling section for coupling to, for example, a transmit (RX) circuit that provides one or more electrical signals to drive TOSA modules coupled to the TOSA mounting section.

    PHOTODIODE (PD) ARRAY WITH INTEGRATED BACK-SIDE LENSES AND A MULTI-CHANNEL TRANSCEIVER MODULE IMPLEMENTING SAME

    公开(公告)号:US20200168655A1

    公开(公告)日:2020-05-28

    申请号:US16202813

    申请日:2018-11-28

    Abstract: The present disclosure is generally directed to an optical transceiver that includes a multi-channel on-board ROSA arrangement that includes an optical demultiplexer, e.g., an arrayed waveguide grating (AWG) and an array of photodiodes disposed on a same substrate. The array of photodiodes may be optically aligned with an output port of the optical demultiplexer and be configured to detect channel wavelengths and output a proportional electrical signal to an amplification circuit, e.g., a transimpedance amplifier. Each of the photodiodes can include an integrated lens configured to increase the alignment tolerance between the demultiplexer and the light sensitive region such that relatively imprecise bonding techniques, e.g., die bonding, may be utilized while still maintaining nominal optical power.

    Laser subassembly having impedance-matching network integrated on laser submount and a transmitter optical subassembly (TOSA) implementing same

    公开(公告)号:US10608408B1

    公开(公告)日:2020-03-31

    申请号:US16202854

    申请日:2018-11-28

    Abstract: The present disclosure is generally directed to a laser subassembly for use in a TOSA module that includes an integrated impedance matching network to enable a plurality of selectable resistance configurations to ensure the driving circuit and laser emitter of the TOSA module have matching, or substantially matching, impedances. The laser subassembly includes a substrate with a driving circuit disposed thereon. The driving circuit includes signal conductors for electrically coupling to an external transmit connecting circuit, a conductive laser mounting section, and an impedance matching network. The impedance matching network includes a plurality of resistors, with one or more of the resistors being selectively electrically coupled to the conductive laser mounting section to introduce a selected amount of impedance to minimize or otherwise reduce reflection.

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