公开(公告)号：US20200285008A1

公开(公告)日：2020-09-10

申请号：US16295586

申请日：2019-03-07

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Kevin LIU ,  Hao-Chiang CHENG

IPC: G02B6/42 ,  H01S5/024 ,  H01S5/026 ,  H04B10/40

Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.

公开(公告)号：US20200073052A1

公开(公告)日：2020-03-05

申请号：US16116087

申请日：2018-08-29

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Kevin LIU ,  I-Lung HO

IPC: G02B6/12 ,  G02B6/42 ,  H04J14/02 ,  H04B10/40 ,  H04B10/50

Abstract: In general, a TOSA consistent with the present disclosure includes a light driving circuit coupled to a hermetically-sealed light engine. The hermetically-sealed light engine includes a housing defined by a plurality of sidewalls. The housing defines a cavity that is hermetically-sealed to prevent introduction of contaminants that would otherwise reduce optical power. The hermetically-sealed light engine optically couples to an external arrayed waveguide grating (AWG), or other multiplexing device, by way of an optical receptacle. The optical receptacle can include a waveguide implemented external to the hermetically-sealed cavity and can include, for instance, an optical isolator, fiber stub, and fiber ferrule section. Thus, the external AWG and associated external optical coupling components advantageously allow for the hermetically-sealed light engine to have a cavity with dimensions relatively smaller than other approaches that dispose an AWG and associated components within a hermetically-sealed cavity.

公开(公告)号：US20210072469A1

公开(公告)日：2021-03-11

申请号：US16561531

申请日：2019-09-05

Applicant: Applied Optoelectronics, Inc.

Inventor： Kevin LIU ,  Kai-Sheng LIN ,  Hsiu-Che WANG

IPC: G02B6/42

Abstract: The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.

公开(公告)号：US20200251879A1

公开(公告)日：2020-08-06

申请号：US16268765

申请日：2019-02-06

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Hsiu-Che WANG ,  Kevin LIU

IPC: H01S5/022 ,  H01S5/024 ,  H01S5/00 ,  H01S5/40

Abstract: The present disclosure is generally directed to a multi-channel TOSA with vertically-mounted MPDs to reduce TOSA housing dimensions and improve RF driving signal quality. In more detail, a TOSA housing consistent with the present disclosure includes at least one vertical MPD mounting surface that extends substantially transverse relative to a LD mounting surface, with the result being that a MPD coupled to the vertical MPD mounting surface gets positioned above an associated LD coupled to the LD mounting surface. The vertically-mounted MPD thus makes regions adjacent an LD that would otherwise be utilized to mount an MPD available for patterning of conductive RF traces to provide an RF driving signal to the LD. The conductive RF traces may therefore extend below the vertically-mounted MPD to a location that is proximate the LD to allow for relatively short wire bonds therebetween.

公开(公告)号：US20180287705A1

公开(公告)日：2018-10-04

申请号：US15475082

申请日：2017-03-30

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Yi WANG ,  Kevin LIU

IPC: H04B10/40 ,  H05K1/02 ,  H05K5/00 ,  H05K1/11 ,  G02B6/42

CPC classification number: H04B10/40 ,  G02B6/12004 ,  G02B6/12009 ,  G02B6/421 ,  G02B6/4246 ,  G02B6/4256 ,  G02B6/4262 ,  G02B6/4281 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/118 ,  H05K1/189 ,  H05K2201/052 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: In accordance with an embodiment, a multi-layered flexible printed circuit (FPC) is disclosed that includes two or more insulating layers to route conductive traces carrying radio frequency (RF) signals, e.g., data signals, and conductive traces carrying direct current (DC) signals, e.g., power signals and low-frequency control signals, while sufficiently isolating the RF signals from electrical interference by the DC transmission lines. This advantageously eliminates having two or more separate FPCs to electrically couple each optical subassembly, e.g., receiver optical subassemblies (ROSAs) and transmitter optical subassemblies (TOSAs), to associated circuitry in a transceiver housing, which saves space and reduces manufacturing complexity, for example.

公开(公告)号：US20230314736A1

公开(公告)日：2023-10-05

申请号：US17712807

申请日：2022-04-04

Applicant: Applied Optoelectronics, Inc.

Inventor： Hao-Chiang CHENG ,  Kai-Sheng LIN ,  Kevin LIU

IPC: G02B6/42 ,  H05K7/20

CPC classification number: G02B6/4256 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/428 ,  H05K7/20318

Abstract: The present disclosure is generally directed to an optical transceiver housing for use in an optical transceiver module with at least one vapor chamber integrated into the transceiver housing. In more detail, the transceiver housing includes at least first and second housing portions on opposite sides and forming a compartment defined by one or more inner surfaces therein. The vapor chamber includes a heat input side and a heat output side on opposite sides of the vapor chamber. An outer wall of at least one of the housing portions may be defined at least in part by the heat output side of the vapor chamber such that the heat output side is exposed to outside of the transceiver housing for transferring heat from inside to outside the optical transceiver module.

公开(公告)号：US20210234612A1

公开(公告)日：2021-07-29

申请号：US16751817

申请日：2020-01-24

Applicant: Applied Optoelectronics, Inc.

Inventor： Kai-Sheng LIN ,  Kevin LIU ,  Hao-Chiang CHENG

IPC: H04B10/40 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H04B10/50 ,  H04B10/66

Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.

公开(公告)号：US20200285007A1

公开(公告)日：2020-09-10

申请号：US16664202

申请日：2019-10-25

Applicant: Applied Optoelectronics, Inc.

Inventor： Kevin LIU ,  Kai-Sheng LIN ,  Ziliang CAI

IPC: G02B6/42 ,  H01S5/024 ,  H01S5/022 ,  H04B10/40 ,  H04B10/50 ,  G02B6/12

Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.

公开(公告)号：US20200041736A1

公开(公告)日：2020-02-06

申请号：US16053398

申请日：2018-08-02

Applicant: Applied Optoelectronics, Inc.

Inventor： Kevin LIU ,  Kai-Sheng LIN ,  Hao-Chiang CHENG

IPC: G02B6/42 ,  G02B6/38

Abstract: The present disclosure is generally directed to an on-board ROSA arrangement where a fiber receptacle element, optical components such as optical de-multiplexer (e.g., an arrayed waveguide grating (AWG)), turning mirror, photodiodes and light receiving chip are mounted to a common substrate. The fiber receptacle element includes a body that defines a slot to at least partially receive an end of the substrate and mount thereto. The body of the fiber receptacle further includes an aperture that extends through the body to receive an optical fiber and/or associated connector and align the same with ROSA components mounted on a surface of the substrate. The fiber receptacle body may be solid, e.g., formed from a single, monolithic piece of material, and may be manufactured from metal, plastic or other suitably rigid material.