公开(公告)号：US20080161048A1

公开(公告)日：2008-07-03

申请号：US11934270

申请日：2007-11-02

申请人： Chih-Hung Chuang

发明人： Chih-Hung Chuang

IPC分类号： G06F1/16

CPC分类号： G06F1/1626 ,  G06F1/1656 ,  G06F1/1662 ,  H04M1/23

摘要： A wireless handheld communication device is described. A main body has a first interfering portion in inner walls thereof. A keyboard structure has a frame and a flexible body, wherein the plastic frame has a second interfering portion for engaging with the first interfering portion so as to fix the keyboard structure in the main body.

摘要翻译： 描述无线手持通信设备。 主体在其内壁上具有第一干涉部分。 键盘结构具有框架和柔性主体，其中塑料框架具有用于与第一干涉部分接合的第二干涉部分，以将键盘结构固定在主体中。

公开(公告)号：US20070191061A1

公开(公告)日：2007-08-16

申请号：US11671597

申请日：2007-02-06

申请人： CHIH-HUNG CHUANG

发明人： CHIH-HUNG CHUANG

IPC分类号： H04B1/38

CPC分类号： H04B1/3816 ,  G06K7/003 ,  G06K7/0073 ,  G06K7/04 ,  G06K19/07739 ,  G06K19/07743

摘要： The invention provides an apparatus for switching from a first Subscriber Identity Module (SIM) card with a set of first contact points to a second SIM card with a set of second contact points. The first SIM card and the second SIM card are both disposed inside a communication equipment. When a user replaces the first SIM card with the second SIM card, the user rotates the circumference of the disc exposed outside the casing, until the second SIM card is positioned so that the second set of contact points contact the fourth set of contact points on the inner wall, and the resilient pins on the inner wall pass through the second set of openings to contact the third contact points on the battery.

摘要翻译： 本发明提供了一种用于从具有一组第一接触点的第一用户识别模块（SIM）卡切换到具有一组第二接触点的第二SIM卡的装置。 第一SIM卡和第二SIM卡都设置在通信设备内部。 当用户用第二SIM卡替换第一SIM卡时，用户旋转暴露在外壳外部的盘的圆周，直到第二SIM卡被定位，使得第二组接触点接触第四组接触点， 内壁和内壁上的弹性销通过第二组开口以接触电池上的第三接触点。

公开(公告)号：US06894315B2

公开(公告)日：2005-05-17

申请号：US10640478

申请日：2003-08-12

申请人： Huai Ku Chung ,  Chih Hung Chuang ,  Shun Lih Tu ,  Chien Chen Hung

发明人： Huai Ku Chung ,  Chih Hung Chuang ,  Shun Lih Tu ,  Chien Chen Hung

IPC分类号： B41J2/45 ,  H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L33/00

CPC分类号： H01L25/167 ,  B41J2/45 ,  H01L25/0753 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention discloses a structure of light-emitting diode (LED) array module, comprising a substrate, a carrier substrate, a chip, a driving circuit chip, and a plurality of metal lines. The carrier substrate is on top of the substrate, and the top surface of the carrier substrate is divided into a first area and a second area. The chip is attached to the first area of the carrier substrate, and further comprising a light-emitting component array and a pad array. The driving circuit chip is attached to the second area of the carrier substrate, and further comprising a pad array and a pad. The metal lines are for electrically connecting the substrate to the driving circuit chip, and the chip to the driving circuit chip, respectively. The present invention can reduce the manufacturing cost, and improve the yield rate.

摘要翻译： 本发明公开了一种发光二极管（LED）阵列模块的结构，其包括基板，载体基板，芯片，驱动电路芯片和多个金属线。 载体衬底位于衬底的顶部，并且载体衬底的顶表面被分成第一区域和第二区域。 芯片附接到载体基板的第一区域，并且还包括发光部件阵列和焊盘阵列。 驱动电路芯片附接到载体基板的第二区域，并且还包括焊盘阵列和焊盘。 金属线分别用于将基板与驱动电路芯片和芯片电连接到驱动电路芯片。 本发明可以降低制造成本，提高成品率。