公开(公告)号：US20140091330A1

公开(公告)日：2014-04-03

申请号：US13633671

申请日：2012-10-02

申请人： Ming-Hung CHEN ,  Ching-Jen Pan ,  Shih-Chang Shei

发明人： Ming-Hung CHEN ,  Ching-Jen Pan ,  Shih-Chang Shei

IPC分类号： H01L33/42

CPC分类号： H01L27/156 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention discloses a LED package structure with transparent electrodes. The electrode layers the semiconductor layers inside the LED chip and the protection layer are all transparent to visible and invisible lights. With the adoption of the present invention, electrodes on the LED package no longer block any part of the light emission from inside the LED.

摘要翻译： 本发明公开了一种具有透明电极的LED封装结构。 LED芯片内的半导体层的电极层和保护层对可见光和隐形灯都是透明的。 采用本发明，LED封装上的电极不再阻挡来自LED内的发光的任何部分。

公开(公告)号：US20130126914A1

公开(公告)日：2013-05-23

申请号：US13407028

申请日：2012-02-28

申请人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

发明人： Ching-Jen PAN ,  Wei-Tai CHENG ,  Ming-Hung CHEN

IPC分类号： H01L27/15

CPC分类号： H01L27/156 ,  H01L33/0079 ,  H01L33/08 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/16

摘要： A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

摘要翻译： 提供了高压交流（AC）发光二极管（LED）结构。 高压AC LED结构包括电路基板和多个高压LED（HV LED）芯片。 每个HV LED芯片包括第一基板，粘合层，第一欧姆接触层，外延层，第一绝缘层，至少两个第一导电板，至少两个第二导电板和第二基板 。 通过晶片级工艺制造的HV LED芯片耦合到低成本电路基板以产生小型化的高压AC LED结构。