公开(公告)号：US20050272249A1

公开(公告)日：2005-12-08

申请号：US11137698

申请日：2005-05-24

Applicant: Andreas Karl ,  Andreas Muller-Hipper ,  Frank Puschner ,  Ewald Simmerlein-Erlbacher

Inventor： Andreas Karl ,  Andreas Muller-Hipper ,  Frank Puschner ,  Ewald Simmerlein-Erlbacher

IPC: H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H01L21/4763

CPC classification number: G06K19/07749 ,  H05K3/102 ,  H05K3/184 ,  H05K3/246 ,  H05K2201/0224 ,  H05K2203/0315

Abstract: A method of producing a conductive pattern on a substrate, including the steps of providing a surface of the substrate with a conductive layer, which is formed by providing the surface of the substrate at least partly with conductive particles, by directly using the adhesive power of the surface of the substrate, applying a passivation layer to the conductive layer, the passivation layer being formed as a negative image of the conductive pattern, and forming the conductive pattern in the regions not covered by the passivation layer.

Abstract translation: 一种在基板上制造导电图案的方法，包括以下步骤：通过直接使用导电图案的粘合力，提供基板的表面，该导电层是通过至少部分地提供导电颗粒来提供基板的表面而形成的 衬底的表面，向导电层施加钝化层，钝化层形成为导电图案的负像，并且在未被钝化层覆盖的区域中形成导电图案。