公开(公告)号：US20230174812A1

公开(公告)日：2023-06-08

申请号：US18102974

申请日：2023-01-30

Applicant: DAICEL CORPORATION

Inventor： Tsugio WATANABE

IPC: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  B22F1/00 ,  B41M1/30 ,  C09C3/08 ,  B82Y30/00 ,  H05K3/12 ,  B22F1/102 ,  B22F1/054 ,  B22F7/04 ,  C09D11/08 ,  H05K1/09

CPC classification number: C09D11/52 ,  C09D11/033 ,  C09D11/037 ,  B22F1/00 ,  B41M1/30 ,  C09C3/08 ,  B82Y30/00 ,  H05K3/12 ,  B22F1/102 ,  B22F1/054 ,  B22F7/04 ,  C09D11/08 ,  H05K1/097 ,  H05K3/1216 ,  H05K3/1283 ,  B22F2301/255 ,  B22F2302/45 ,  H05K2201/0224 ,  H05K2203/1131

Abstract: Provided is an ink for use in electronic component production making use of screen printing, which is suitable for actually allowing fine lines with high precision to be drawn in screen printing, and for actually allowing successive screen printing operations to be performed. The ink for screen printing of the present invention includes surface-modified silver nanoparticles (A) and a solvent (B), and has a viscosity at a shear rate of 10 (1/s) and 25° C. of 60 Pa·s or more. The surface-modified silver nanoparticles (A) each include a silver nanoparticle and an amine-containing protective agent coating the silver nanoparticle. The solvent (B) includes at least a terpene solvent. In solvent (B), a content of solvents having a boiling point of less than 130° C. is 20 wt % or less based on the total amount of solvents.

公开(公告)号：US09894761B2

公开(公告)日：2018-02-13

申请号：US15173697

申请日：2016-06-05

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takashi Hoshi ,  Takeshi Kitamura ,  Keiko Kashihara ,  Hiroharu Inoue

IPC: H05K1/03 ,  H05K1/02 ,  C08J5/24 ,  C08G59/62 ,  C08L63/00

CPC classification number: H05K1/0366 ,  B32B15/14 ,  B32B2260/046 ,  C08G59/62 ,  C08J5/24 ,  C08J2363/00 ,  C08J2433/02 ,  C08J2433/06 ,  C08J2433/08 ,  C08L63/00 ,  H05K1/0271 ,  H05K1/0373 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/029

Abstract: A prepreg includes a resin composition including: (A) at least one of an epoxy resin having a naphthalene skeleton and a phenolic hardener having a naphthalene skeleton; (B) a polymer having at least the structures of formulae (2) and (3) among formulae (1), (2) and (3) and having a weight-average molecular weight of from 200,000 to 850,000 inclusive; and (C) an inorganic filler: wherein x:y:z (molar fraction)=0:0.95:0.05 to 0.2:0.6:0.2 (where x+y+z≦1, 0≦x≦0.2, 0.6≦y≦0.95, 0.05≦z≦0.2); R1 represents a hydrogen atom or a methyl group and R2 includes at least one of a glycidyl group and an epoxidized alkyl group among a hydrogen atom, an alkyl group, a glycidyl group and an epoxidized alkyl group in formula (2); and R3 represents a hydrogen atom or a methyl group and R4 represents Ph (phenyl group), —COOCH2Ph or —COO(CH2)2Ph in formula (3).

公开(公告)号：US20160168428A1

公开(公告)日：2016-06-16

申请号：US14904456

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Seiichiro SHINOHARA

IPC: C09J9/02 ,  H01R4/04 ,  H05K3/30 ,  C09J7/00

CPC classification number: C09J9/02 ,  C08K3/04 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/303 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/0139 ,  H05K2203/0278

Abstract: A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

Abstract translation: 在具有根据导电颗粒的阵列图案形成并且防止带电的布线的布线板上散射导电颗粒并对导电颗粒进行充电的步骤; 通过移动所述布线板上的刮板将与所述布线图形对应的预定阵列图案对准所述带电的导电粒子的步骤; 以及将其上形成有粘合剂材料层的转移膜接合到所述布线板并将以预定阵列图案对准的导电颗粒转印到所述粘合剂层的步骤。

公开(公告)号：US20160149366A1

公开(公告)日：2016-05-26

申请号：US14904443

申请日：2014-07-28

Applicant: DEXERIALS CORPORATION

Inventor： Yasushi AKUTSU

IPC: H01R43/20 ,  C09J7/02 ,  C09J9/02

CPC classification number: H01R43/205 ,  C08K3/04 ,  C08K3/08 ,  C08K7/18 ,  C09J7/20 ,  C09J9/02 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  H01R4/04 ,  H01R12/62 ,  H01R43/007 ,  H05K3/143 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1344

Abstract: An anisotropic conductive film is capable of preventing a short circuit between terminals even though narrowing of the interval between connecting terminals advances. An electrically conductive support plate supports a base film having one surface with an adhesive layer. An array plate is disposed to face the adhesive layer and has through holes arranged in a pattern corresponding to the array pattern of electrically conductive particles. A spray sprays the electrically conductive particles together with a liquid while applying a voltage to the electrically conductive particles, in which the electrically conductive particles which are charged with an electrical charge are sprayed together with a liquid from the spray while applying a voltage between the spray and the support plate and the electrically conductive particles which have passed through the through holes of the array plate are arranged on the adhesive layer in the array pattern of the through holes.

Abstract translation: 各向异性导电膜即使连接端子之间的间隔变窄也能够防止端子之间的短路。 导电支撑板支撑具有一个具有粘合剂层的表面的基底膜。 阵列板设置成面向粘合剂层并且具有以对应于导电颗粒的阵列图案的图案布置的通孔。 喷雾将导电颗粒与液体一起喷射，同时向导电颗粒施加电压，其中将带有电荷的导电颗粒与来自喷雾的液体一起喷射，同时在喷雾之间施加电压 并且已经穿过阵列板的通孔的支撑板和导电颗粒以通孔的阵列图案布置在粘合剂层上。

公开(公告)号：US09330807B2

公开(公告)日：2016-05-03

申请号：US14088737

申请日：2013-11-25

Applicant: Empire Technology Development LLC

Inventor： Kazufumi Ogawa ,  Kazuhiro Soejima

IPC: H05K1/09 ,  H01B1/12 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12

CPC classification number: H01B1/12 ,  C01P2006/40 ,  C09C1/62 ,  C09C3/08 ,  C09C3/12 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0239 ,  Y10T428/25 ,  Y10T428/29 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2998

Abstract: The present invention relates to a conductive paste in which fine metal particles are dispersed into a chemical adsorption liquid produced from a mixture of at least an alkoxysilane compound, a silanol condensation catalyst, and a nonaqueous organic solvent to form an organic thin film comprising molecules covalently bound to the surface of the fine metal particle by having the surface of the fine metal particle react with the alkoxysilane compound, so that fine metal particles that are given a reactive function to the surface are produced while almost maintaining the original conductivity of the fine metal particles, and further the particles are pasted with an organic solvent.

Abstract translation: 本发明涉及一种导电膏，其中细金属颗粒分散在由至少烷氧基硅烷化合物，硅烷醇缩合催化剂和非水有机溶剂的混合物制成的化学吸附液体中，以形成包含分子共价的有机薄膜 通过使细金属颗粒的表面与烷氧基硅烷化合物反应而与金属微粒表面结合，从而产生赋予表面的反应性功能的细小金属颗粒，同时几乎保持细金属的原始导电性 颗粒，然后用有机溶剂粘贴颗粒。

公开(公告)号：US09219218B2

公开(公告)日：2015-12-22

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki Ishigami ,  Hidefumi Nakamura ,  Yukihiko Shiohara ,  Taku Kawasaki ,  Fumiaki Akahane

IPC: H05K1/09 ,  H05K1/03 ,  H01L41/047 ,  H01L41/053 ,  H01L41/333 ,  H01L41/29 ,  B22F5/12 ,  B22F3/105

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US20150201504A1

公开(公告)日：2015-07-16

申请号：US14597649

申请日：2015-01-15

Applicant: Applied Nanotech, Inc.

Inventor： ZVI YANIV ,  XUEPING LI ,  JAMES P. NOVAK

IPC: H05K3/38 ,  H05K3/10 ,  H05K3/12

CPC classification number: H05K3/1283 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0224

Abstract: Conductive patterns are formed using formulations containing metallic particles, which may be copper. These metallic particles may be coated with a binder material that improves adhesion during photosintering of the formulations. The binder contains chemistry suitable for it to be removed from the particles in a separate process such as drying or thermal sintering. The coating is a non-volatile organic compound attached to the metallic particles with a minimum thickness oxide coating. The organic coating improves a coefficient of thermal expansion value match between the metallic particles and the substrate, which may be polymeric.

Abstract translation: 使用含有金属颗粒（可以是铜）的配方形成导电图案。 这些金属颗粒可以用粘合剂材料涂覆，该粘合剂材料在制剂的光烧结期间改善粘附性。 粘合剂含有适合于在单独的工艺如干燥或热烧结中从颗粒中除去的化学物质。 涂层是附着在具有最小厚度的氧化物涂层的金属颗粒上的非挥发性有机化合物。 有机涂层改善金属颗粒和基底之间的热膨胀系数匹配，其可以是聚合物。

公开(公告)号：US08945297B2

公开(公告)日：2015-02-03

申请号：US13391175

申请日：2010-07-29

Applicant: Tarik Cheema ,  Georg Garnweitner ,  Günter Schmid ,  Dan Taroata

Inventor： Tarik Cheema ,  Georg Garnweitner ,  Günter Schmid ,  Dan Taroata

IPC: C09D1/00 ,  H01L21/316 ,  C23C16/40 ,  H05K1/16 ,  H01B3/00 ,  H01B3/10 ,  H01G4/12 ,  H01G11/48 ,  B05D1/18

CPC classification number: H05K1/162 ,  B05D1/185 ,  H01B3/002 ,  H01B3/10 ,  H01G4/1227 ,  H01G11/48 ,  H05K2201/0175 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y02E60/13

Abstract: A dielectric protective layer has nanoparticles integrated therein to increase the dielectric constants. The nanoparticles are surrounded by a protective shell to prevent agglomeration, in order to maintain the small particle size, for depositing an extra-thin film.

Abstract translation: 介电保护层具有集成在其中的纳米颗粒以增加介电常数。 纳米颗粒被保护壳包围以防止附聚，以便保持小的粒度，用于沉积超薄膜。

公开(公告)号：US20140168919A1

公开(公告)日：2014-06-19

申请号：US14184733

申请日：2014-02-20

Applicant: DEXERIALS CORPORATION

Inventor： Tomoyuki ISHIMATSU

IPC: H05K1/18 ,  H05K13/04

CPC classification number: H05K1/181 ,  H01R4/04 ,  H05K3/323 ,  H05K13/046 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T156/10 ,  Y10T428/2991

Abstract: To provide an anisotropic conductive film, which contains conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a substrate with a terminal of an electronic component, wherein the conductive particles are conductive particles, in each of which a metal plated layer and an insulating layer are sequentially provided on a surface of a resin particle, or conductive particles, in each of which an insulating layer is provided on a metal particle, or both thereof, and wherein 3.0 to 10.0 conductive particles are linked together on average.

Abstract translation: 为了提供含有导电颗粒的各向异性导电膜，其中各向异性导电膜是各向异性导电膜，其被配置成各自导电地连接基板的端子与电子部件的端子，其中导电粒子是导电粒子 其中金属镀层和绝缘层依次设置在树脂颗粒或导电颗粒的表面上，每个导电颗粒中的金属颗粒中均设置有绝缘层，或者其两者，其中3.0至10.0导电颗粒 平均连接在一起。

公开(公告)号：US08497057B2

公开(公告)日：2013-07-30

申请号：US13616558

申请日：2012-09-14

Applicant: Thomas N. Tombs ,  Donald S. Rimal

Inventor： Thomas N. Tombs ,  Donald S. Rimal

IPC: G03G13/22

CPC classification number: H05K3/1266 ,  B65H85/00 ,  B65H2301/33312 ,  G03G15/1625 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0783 ,  H05K2203/1572

Abstract: The present invention provides a method producing printed electronic circuits using electrophotography.