Method of making a dynamic random access memory device utilizing chemical mechanical polishing
    12.
    发明授权
    Method of making a dynamic random access memory device utilizing chemical mechanical polishing 有权
    利用化学机械抛光制造动态随机存取存储器件的方法

    公开(公告)号:US06271124B1

    公开(公告)日:2001-08-07

    申请号:US09395291

    申请日:1999-09-13

    Abstract: A semiconductor memory device with a capacitor-over-bitline (COB) structure and a method for fabricating the same. The semiconductor memory device includes a transistor having a gate electrode formed on a gate insulating layer on a semiconductor substrate and having source and drain regions formed on the surface of the substrate and separated from each other by the gate electrode, a first interlayer insulating layer formed over the substrate including the transistor; a bitline formed over the first interlayer insulating layer; and a second interlayer insulating layer formed over the substrate including the bitline, for insulating the bitline from a storage node of a capacitor. A surface of the second interlayer insulating layer is planarized by a chemical-mechanical polishing (CMP) process so as to be substantially parallel to a surface of the substrate including the bitline.

    Abstract translation: 一种具有电容器 - 位线(COB)结构的半导体存储器件及其制造方法。 半导体存储器件包括晶体管,其晶体管具有形成在半导体衬底上的栅极绝缘层上并具有源极和漏极区的栅电极,该栅极和漏极区形成在衬底的表面上并被栅电极彼此分离,形成第一层间绝缘层 在包括晶体管的衬底上; 在所述第一层间绝缘层上形成的位线; 以及形成在包括所述位线的所述基板的上方的用于使所述位线与电容器的存储节点绝缘的第二层间绝缘层。 通过化学机械抛光(CMP)工艺将第二层间绝缘层的表面平坦化,以便基本平行于包括位线的衬底的表面。

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