公开(公告)号：US09596788B1

公开(公告)日：2017-03-14

申请号：US14952946

申请日：2015-11-26

Applicant: Chung-Ping Lai ,  Kuo-Hsin Chang ,  Jia-Cing Chen

Inventor： Chung-Ping Lai ,  Kuo-Hsin Chang ,  Jia-Cing Chen

IPC: H05K7/20 ,  H01L23/373

CPC classification number: H01L23/373 ,  H01L23/3731 ,  H05K7/20436

Abstract: A hexagonal boron nitride heat dissipation structure includes a plurality of electronic components, plural thermally conductive buffer layers, and an electronic conductive heat dissipation element. Each electronic component is configured to generate heat, each thermally conductive buffer layer is made of hBN that has thermal conductivity range from 10 to 40 W/mK. Such structure can completely overcome the issue of short circuit of electronic devices. The cooling of modern electronic devices, which has limited space for cooling, can be improved by this simple structure that takes full advantage of hBN and other heat dissipation materials.

Abstract translation: 六方氮化硼散热结构包括多个电子元件，多个导热缓冲层和电子导电散热元件。 每个电子部件被配置为产生热量，每个导热缓冲层由热导率范围为10至40W / mK的hBN制成。 这种结构可以完全克服电子设备短路的问题。 通过采用hBN和其他散热材料的这种简单结构可以改善冷却空间有限的现代电子设备的冷却。

公开(公告)号：US20100290974A1

公开(公告)日：2010-11-18

申请号：US12505936

申请日：2009-07-20

Applicant: Chi-Chang HU ,  Ching-Chun HUANG ,  Kuo-Hsin CHANG

Inventor： Chi-Chang HU ,  Ching-Chun HUANG ,  Kuo-Hsin CHANG

IPC: C01G23/047 ,  C25D5/18 ,  C01G23/00 ,  C01B21/20

CPC classification number: C01G23/047 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2006/14 ,  C01P2006/40 ,  C25D3/54 ,  C25D5/18 ,  C25D5/50

Abstract: A titanium dioxide coating method is disclosed. An electrolyte containing Ti3+ and at least one of NO3− and NO2− is provided for an electrodeposition device. A substrate is immersed into the electrolyte and electrically connected to the electrodeposition device. A cathodic current is applied to the substrate via the electrodeposition device for reduction of NO2− or NO3−. A titanium dioxide film is thus formed on the surface of the substrate. The thickness, porosity, and morphology of the titanium dioxide film can be controlled by varying the electroplating parameters, and relatively uniform deposits on complex shapes can be obtained by use of low cost instruments.

Abstract translation: 公开了一种二氧化钛涂覆方法。 为电沉积装置提供含有Ti 3+和至少一种NO 3 - 和NO 2 - 的电解质。 将基板浸入电解质中并电连接到电沉积装置。 通过电沉积装置将阴极电流施加到基底上以还原NO 2 - 或NO 3 - 。 因此，在基板的表面上形成二氧化钛膜。 可以通过改变电镀参数来控制二氧化钛膜的厚度，孔隙率和形态，并且可以通过使用低成本仪器来获得复杂形状上的相对均匀的沉积物。