公开(公告)号：US20130015502A1

公开(公告)日：2013-01-17

申请号：US13179948

申请日：2011-07-11

Applicant: Benjamin A. Fox ,  Nathaniel J. Gibbs ,  Andrew B. Maki ,  David M. Onsongo ,  Trevor J. Timpane

Inventor： Benjamin A. Fox ,  Nathaniel J. Gibbs ,  Andrew B. Maki ,  David M. Onsongo ,  Trevor J. Timpane

IPC: H01L29/165 ,  H01L21/762

CPC classification number: H01L27/15 ,  H01L27/0694 ,  H01L27/1203 ,  H01L27/1461 ,  H01L27/1463 ,  H01L27/1464 ,  H01L31/125 ,  H01L33/382

Abstract: A structure and method for fabricating a light emitting diode and a light detecting diode on a silicon-on-insulator (SOI) wafer is provided. Specifically, the structure and method involves forming a light emitting diode and light detecting diode on the SOI wafer's backside and utilizing a deep trench formed in the wafer as an alignment marker. The alignment marker can be detected by x-ray diffraction, reflectivity, or diffraction grating techniques. Moreover, the alignment marker can be utilized to pattern openings and perform ion implantation to create p-n junctions for the light emitting diode and light detecting diode. By utilizing the SOI wafer's backside, the structure and method increases the number of light emitting diodes and light detecting diodes that can be formed on a SOI wafer, enables an increase in overall device density for an integrated circuit, and reduces attenuation of light signals being emitted and detected by the diodes.

Abstract translation: 提供了在绝缘体上硅（SOI）晶片上制造发光二极管和光检测二极管的结构和方法。 具体地，该结构和方法包括在SOI晶片的背面上形成发光二极管和光检测二极管，并且利用在晶片中形成的深沟槽作为对准标记。 可以通过x射线衍射，反射率或衍射光栅技术来检测对准标记。 此外，对准标记可用于图案化开口并执行离子注入以产生用于发光二极管和光检测二极管的p-n结。 通过利用SOI晶片的背面，结构和方法增加了可以在SOI晶片上形成的发光二极管和光检测二极管的数量，能够增加集成电路的整体器件密度，并且减少光信号的衰减 由二极管发射和检测。

公开(公告)号：US20090063867A1

公开(公告)日：2009-03-05

申请号：US11850079

申请日：2007-09-05

Applicant: Axel Aguado Granados ,  Benjamin A. Fox ,  Nathaniel J. Gibbs ,  Jamie R. Kuesel ,  Andrew B. Maki ,  Trevor J. Timpane

Inventor： Axel Aguado Granados ,  Benjamin A. Fox ,  Nathaniel J. Gibbs ,  Jamie R. Kuesel ,  Andrew B. Maki ,  Trevor J. Timpane

IPC: G06F21/22 ,  H04L9/28

CPC classification number: G06F21/125 ,  H04L9/0822 ,  H04L9/083

Abstract: A method, system and computer program product for partitioning the binary image of a software program, and partially removing code bits to create an encrypted software key, to increase software security. The software program's binary image is partitioned along a random segment length or a byte/nibble segment length, and the code bits removed, and stored, along with their positional data in a software key. The software key is encrypted and is separately distributed from the inoperable binary image to the end user. The encrypted key is stored on a secure remote server. When the end user properly authenticates with the developer's remote servers, the encrypted security key is downloaded from the secure remote server and is locally decrypted. The removed code bits are reinserted into the fractioned binary image utilizing the positional location information. The binary image is then operable to complete execution of the software program.

Abstract translation: 一种方法，系统和计算机程序产品，用于对软件程序的二进制图像进行分区，并部分地移除代码位以创建加密的软件密钥，以增加软件安全性。 软件程序的二进制图像沿随机分段长度或字节/半字节段长度进行分区，并将代码位与其位置数据一起删除并存储在软件密钥中。 软件密钥被加密，并且从不可操作的二进制图像分开分发给最终用户。 加密的密钥存储在安全的远程服务器上。 当最终用户对开发者的远程服务器进行正确认证时，加密的安全密钥从安全远程服务器下载，并被本地解密。 使用位置位置信息将去除的代码位重新插入分级二进制图像。 然后二进制图像可操作以完成软件程序的执行。