公开(公告)号：US5686762A

公开(公告)日：1997-11-11

申请号：US577911

申请日：1995-12-21

Applicant: Rodney C. Langley

Inventor： Rodney C. Langley

IPC: H01L23/485 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05624 ,  H01L2224/451 ,  H01L2224/4807 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107

Abstract: A semiconductor device with improved bond pads. The semiconductor device includes bond pads electrically connected to an active circuit in the device and openings formed in the bonding surface of the bond pads. The opening(s) may include recesses extending partially into the bonding surface or channels that extend entirely through the bond pads. Various shapes and configurations of the openings may be used, such as a pattern of channels radiating from the center of the bonding surface, a series of spaced apart rectangular channels arranged parallel to one another, an array of L shaped channels arranged around the center of the bonding surface, or an array of holes.

Abstract translation: 具有改进的接合焊盘的半导体器件。 半导体器件包括与器件中的有源电路电连接的接合焊盘和形成在接合焊盘的接合表面中的开口。 开口可以包括部分地延伸到粘合表面的凹槽或者完全延伸穿过键合垫的通道。 可以使用开口的各种形状和构造，例如从接合表面的中心辐射的通道图案，彼此平行布置的一系列间隔开的矩形通道，围绕中心的L形通道的阵列 接合表面或孔阵列。