公开(公告)号：US4911597A

公开(公告)日：1990-03-27

申请号：US89926

申请日：1987-08-25

Applicant: Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

Inventor： Dan Maydan ,  Sasson R. Somekh ,  Charles Ryan-Harris ,  Richard A. Seilheimer ,  David Cheng ,  Edward M. Abolnikov ,  Lance S. Reinke ,  J. Christopher Moran ,  Richard M. Catlin, Jr. ,  Robert B. Lowrance ,  Gregory W. Ridgeway

IPC: H01L21/677 ,  B65G49/07 ,  H01L21/67 ,  H01L21/683 ,  H05K13/02

CPC classification number: H05K13/021 ,  H01L21/67 ,  Y10S414/13 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14 ,  Y10S414/141

Abstract: A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.

Abstract translation: 晶片处理系统包括安装在负载锁中的自动装载机，用于在半导体处理室和装载锁之间的卸载位置之间提供批处理，盒到盒自动晶片传送。 该系统提供快速，无污染的半导体晶片装载和卸载。

公开(公告)号：US5643366A

公开(公告)日：1997-07-01

申请号：US189951

申请日：1994-01-31

Applicant: Sasson R. Somekh ,  Philip M. Salzman ,  Oskar U. Vierny

Inventor： Sasson R. Somekh ,  Philip M. Salzman ,  Oskar U. Vierny

IPC: H01L21/677 ,  H01L21/683 ,  H01L21/687 ,  C23C16/00

CPC classification number: H01L21/67748 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68742 ,  Y10S414/135

Abstract: A structure and method for handling and processing wafers in a face down configuration is disclosed. A robot insertion blade supports a wafer to be processed in a recess having conically sloping wafer holding surfaces which touch the wafer only at its outer periphery. Once positioned in the chamber, a set of three transfer finger with sloped contact surfaces supported from a "C" shaped support assembly raise the wafer adjacent to a susceptor bottom surface. A recess in the face of the susceptor covering a large portion of the wafer is evacuated, compared to process chamber pressure, and when the differential pressure between the processing chamber and the evacuated recess behind the wafer can support the wafer, the transfer finger supports are lower and rotated out from under the wafer and susceptor assembly. The susceptor with the wafer attached by vacuum is then lowered to a processing location in contact with shadow rings supported by the "C" shaped support assembly and opposite a gas distribution plate.

Abstract translation: 公开了一种面朝下配置处理和处理晶片的结构和方法。 机器人插入刀片在具有锥形倾斜的晶片保持表面的凹部中支撑要处理的晶片，其仅在其外周缘处接触晶片。 一旦定位在腔室中，一组具有从“C”形支撑组件支撑的倾斜接触表面的三个转移手指将晶片靠近基座底表面提升。 与处理室压力相比，在覆盖晶片的大部分的基座的表面上的凹部被抽真空，并且当处理室和晶片后面的抽真空凹槽之间的压差可以支撑晶片时，转印手指支撑件 从晶片和基座组件下方旋转出来。 然后将具有通过真空附接的晶片的感受器降低到与由“C”形支撑组件支撑并与气体分配板相对的阴影环接触的处理位置。