公开(公告)号：US20050115628A1

公开(公告)日：2005-06-02

申请号：US10935114

申请日：2004-09-08

申请人： Koki Sasaki ,  Takaomi Toi

发明人： Koki Sasaki ,  Takaomi Toi

IPC分类号： H01F41/06 ,  B21F3/00

CPC分类号： H01F41/066 ,  H01F41/082

摘要： A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.

摘要翻译： 一种用于形成线圈单元的线圈绕组方法包括以下步骤：绕着芯的第一层位置同时缠绕基本上彼此平行的第一和第二电线，以形成第一匝，同时缠绕第一和第二电线以形成第二线 在第二线直接设置在芯周围的情况下转动，与第一匝相邻的第二匝的第一线被设置在第一匝的第一匝的第一和第二线之间，以形成第二层，并且绕组 所述第一和第二线同时形成第三匝，而所述第二线直接设置在所述芯周围，所述第三匝的所述第一线设置在所述第二层中并缠绕在所述第一匝的第二线和所述第二匝的第二线之间 第二回合第一层。

公开(公告)号：US06480083B1

公开(公告)日：2002-11-12

申请号：US09648168

申请日：2000-08-25

申请人： Takaomi Toi ,  Koki Sasaki

发明人： Takaomi Toi ,  Koki Sasaki

IPC分类号： H01F2729

CPC分类号： H01F27/292 ,  H01F17/045 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.

摘要翻译： 线圈装置包括端子电极，每个端子电极包括设置在凸缘的底表面上的底表面电极，设置在凸缘的侧表面上的侧表面电极以及设置在凸缘的端面上的端面电极 端面的下部。 端面电极布置在凸缘的端面上，使得端面电极的上边缘设置在与第一侧面电极的侧边电极的上边缘基本相同的第一水平处 在凸缘的端表面和每个侧表面之间的边界附近，并且在法兰的端面的大致中央部处设置在比第一高度低的第二水平处。

公开(公告)号：US20090243777A1

公开(公告)日：2009-10-01

申请号：US12483279

申请日：2009-06-12

申请人： Takaomi TOI ,  Kosuke ISHIDA ,  Daisuke ISHIDE ,  Kazuhide KUDO

发明人： Takaomi TOI ,  Kosuke ISHIDA ,  Daisuke ISHIDE ,  Kazuhide KUDO

IPC分类号： H01F27/29

CPC分类号： H01F19/06 ,  H01F27/2804 ,  H01F2027/2809

摘要： A multilayer transformer component includes a chip body including a primary-side coil and a secondary-side coil, and first to fourth external electrodes. The primary-side coil includes a body portion, a first lead, and a second lead, and the secondary-side coil includes a body portion, a third lead, and a fourth lead. A first projection and a second projection of each body portion are arranged to lie substantially on a linear line. The first lead and the fourth lead are arranged to be line-symmetrical with respect to a center line which is arranged at an approximate center between respective distal ends of the first projection and the second projection, and which is perpendicular or substantially perpendicular to an overlying direction of the primary-side and secondary-side coils. The second lead and the third lead are also arranged to be line-symmetrical with respect to the center line.

摘要翻译： 多层变压器部件包括具有初级侧线圈和次级侧线圈以及第一至第四外部电极的芯片体。 初级侧线圈包括主体部，第一引线和第二引线，次级侧线圈包括主体部，第三引线和第四引线。 每个主体部分的第一突起和第二突出部布置成基本上位于线性线上。 第一引线和第四引线被布置成相对于布置在第一突起和第二突起的相应远端之间的大致中心处的中心线线对称，并且垂直或基本上垂直于上覆 初级侧和次级侧线圈的方向。 第二引线和第三引线也被布置为相对于中心线线对称。

公开(公告)号：US07373715B2

公开(公告)日：2008-05-20

申请号：US11062270

申请日：2005-02-18

申请人： Shinya Hirai ,  Takaomi Toi ,  Katsuhiko Tsubana ,  Hiroyuki Yasuzawa

发明人： Shinya Hirai ,  Takaomi Toi ,  Katsuhiko Tsubana ,  Hiroyuki Yasuzawa

IPC分类号： H01F7/06

CPC分类号： H01F27/292 ,  H01F17/045 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49076

摘要： A wire-wound type chip coil can take various inductance values while maintaining its outer dimension at a specified fixed value. A chip coil is formed by winding at least two conductive wires regularly in a single layer around a core made of a magnetic material and firmly connecting both ends of each conductive wire to terminal electrodes disposed on respective flanges of the core. This makes it possible to obtain a great current capacity. Furthermore, the inductance decreases because of an increase in the magnetic path length. A great number of different inductance values can be easily obtained by properly selecting parameters including the number of substantially parallel conductive wires, the diameter of each conductive wire, and the number of turns.

摘要翻译： 线绕型芯片线圈可以采用各种电感值，同时将其外形尺寸保持在规定的固定值。 通过在由磁性材料制成的芯周围的单层中规则地缠绕至少两根导线并将每根导线的两端牢固地连接到设置在芯的相应凸缘上的端子电极而形成芯片线圈。 这使得可以获得大的电流容量。 此外，由于磁路长度的增加，电感减小。 通过适当地选择包括基本平行的导线的数量，每个导线的直径和匝数的参数，可以容易地获得大量不同的电感值。

公开(公告)号：US07051770B2

公开(公告)日：2006-05-30

申请号：US10935114

申请日：2004-09-08

申请人： Koki Sasaki ,  Takaomi Toi

发明人： Koki Sasaki ,  Takaomi Toi

IPC分类号： B21F3/00 ,  B21C47/14 ,  B21C47/02 ,  H01F41/06

CPC分类号： H01F41/066 ,  H01F41/082

摘要： A coil-winding method for forming a coil unit includes the steps of winding first and second wires substantially parallel to each other simultaneously around a first layer position of a core to form a first turn, winding the first and second wires simultaneously to form a second turn while the second wire is disposed directly around the core, the first wire of the second turn adjacent to the first turn being disposed between the first and second wires of the first turn in the first layer so as to form a second layer, and winding the first and second wires simultaneously to form a third turn while the second wire is disposed directly around the core, the first wire of the third turn being disposed in the second layer and wound between the second wire of the first turn and the second wire of the second turn in the first layer.

摘要翻译： 一种用于形成线圈单元的线圈绕组方法包括以下步骤：绕着芯的第一层位置同时缠绕基本上彼此平行的第一和第二电线，以形成第一匝，同时缠绕第一和第二电线以形成第二线 在第二线直接设置在芯周围的情况下转动，与第一匝相邻的第二匝的第一线被设置在第一匝的第一匝的第一和第二线之间，以形成第二层，并且绕组 所述第一和第二线同时形成第三匝，而所述第二线直接设置在所述芯周围，所述第三匝的所述第一线设置在所述第二层中并缠绕在所述第一匝的第二线和所述第二匝的第二线之间 第二回合第一层。

公开(公告)号：US06804882B2

公开(公告)日：2004-10-19

申请号：US10197855

申请日：2002-07-19

申请人： Takaomi Toi ,  Koki Sasaki

发明人： Takaomi Toi ,  Koki Sasaki

IPC分类号： H05K330

CPC分类号： H01F27/292 ,  H01F17/045 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155

摘要： A coil device includes terminal electrodes each including a bottom-surface electrode provided on a bottom surface of a flange, side-surface electrodes provided on side surfaces of the flange, and an end-surface electrode provided on an end surface of the flange at the lower part of the end surface. The end-surface electrode is arranged on the end surface of the flange so that the upper edge of the end-surface electrode is disposed at a first level that is substantially the same as that of the upper edges of the side-surface electrodes in the vicinity of boundaries between the end surface and each side surface of the flange and is disposed at a second level lower than the first level at an approximate central portion of the end surface of the flange.

摘要翻译： 线圈装置包括端子电极，每个端子电极包括设置在凸缘的底表面上的底表面电极，设置在凸缘的侧表面上的侧表面电极以及设置在凸缘的端面上的端面电极 端面的下部。 端面电极布置在凸缘的端面上，使得端面电极的上边缘设置在与第一侧面电极的侧边电极的上边缘基本相同的第一水平处 在凸缘的端表面和每个侧表面之间的边界附近，并且在法兰的端面的大致中央部处设置在比第一高度低的第二水平处。

公开(公告)号：US06515566B1

公开(公告)日：2003-02-04

申请号：US09676624

申请日：2000-10-02

申请人： Takaomi Toi ,  Tetsuya Morinaga

发明人： Takaomi Toi ,  Tetsuya Morinaga

IPC分类号： H01F2729

CPC分类号： H01F17/045 ,  H01F27/292

摘要： An electronic component is constructed to prevent Cu elution to a solder from a wire, and also prevents the wire from becoming thin and being broken. A chip coil includes electrodes provided at both ends of a core. The electrodes include an underlying metal layer (Ag), a Ni plated layer, and a Sn—Cu plated layer arranged in this sequence from the bottom thereof. Ends of a wire are embedded in the Sn—Cu plated layer of the electrodes by thermal compression bonding. When the chip coil is mounted on a land of a substrate by a reflow soldering, the Cu of the Sn—Cu plated layer is eluted into the reflow solder, and Cu elution from the wire is prevented

摘要翻译： 构造电子部件，以防止铜从焊丝中溶解到焊料，并且还防止电线变薄并被破坏。 芯片线圈包括设置在芯的两端的电极。 电极包括从其底部按顺序排列的下层金属层（Ag），Ni镀层和Sn-Cu镀层。 线的端部通过热压接而嵌入电极的Sn-Cu镀层中。 当通过回流焊接将芯片线圈安装在基板的台面上时，Sn-Cu镀层的Cu被洗脱回流焊料中，并且防止了从电线中的Cu洗脱