公开(公告)号：US11343943B1

公开(公告)日：2022-05-24

申请号：US17101621

申请日：2020-11-23

Applicant: ABB Schweiz AG

Inventor： Giovanni Salvatore ,  Slavo Kicin ,  Fabian Mohn

IPC: H05K7/20 ,  H03K17/14 ,  H01H9/52 ,  H01L23/34

Abstract: Systems, methods, techniques and apparatuses of power switches are disclosed. One exemplary embodiment is a power switch comprising an outer housing; a power electronics board disposed within the housing and including a semiconductor switch structured to selectively conduct a current between a first power terminal and a second power terminal; a first heat sink coupled to the power electronics board; a plurality of thermally conductive connectors; a second heat sink coupled to the plurality of thermally conductive connectors, a control electronics board structured to control the semiconductor switch, the control electronics board being located within an enclosure formed of the second heat sink, the plurality of thermally conductive connectors, and the power electronics board.

公开(公告)号：US20210398958A1

公开(公告)日：2021-12-23

申请号：US16906799

申请日：2020-06-19

Applicant: ABB Schweiz AG

Inventor： Giovanni Salvatore ,  Slavo Kicin

IPC: H01L25/16 ,  H01L25/18 ,  H01L23/367 ,  H01L25/00 ,  H02H3/02

Abstract: A solid state switching device, such as a solid state circuit breaker, includes at least one heat sink, a control electronics printed circuit board (PCB), and power electronics. The power electronics are useful to regulate the flow of current from one terminal of the solid state switching device to another terminal. The power electronics can include one or more solid state devices such as FETs, Thyristors, Thyristors+SiC JFET in parallel, IGBTs, and IGCTs. The control PCB can include a variety of circuit elements useful to perform the function of a gate driver useful to activate the solid state device of the power electronics. The heat sink includes one or more signal vias formed therethrough to permit nesting of the control PCB within the heat sink.

公开(公告)号：US20190131211A1

公开(公告)日：2019-05-02

申请号：US16233266

申请日：2018-12-27

Applicant: ABB Schweiz AG

Inventor： Daniel Kearney ,  Jürgen Schuderer ,  Slavo Kicin ,  Liliana Duarte

IPC: H01L23/473 ,  H01L25/07 ,  H05K1/02

Abstract: An electronics package includes an electrically conducting support layer; at least one electrically conducting outer layer; at least two power electronics components arranged on different sides of the support layer and electrically interconnected with the support layer and with the at least one outer layer; and isolation material, in which the support layer and the at least two power electronics components are embedded, the support layer and the at least one outer layer are laminated together with the isolation material; and a cooling channel for conducting a cooling fluid through the electronics package, the cooling channel runs between the at least two power electronics components through the support layer.