公开(公告)号：US20240368025A1

公开(公告)日：2024-11-07

申请号：US18771189

申请日：2024-07-12

Applicant: AGC Inc.

Inventor： Shuhei NOMURA ,  Kazutaka ONO

IPC: C03C4/16 ,  C03C3/091 ,  H01Q1/36

Abstract: The present invention relates to a substrate having a dielectric loss tangent (A) as measured at 20° C. and 10 GHz of 0.1 or less, a dielectric loss tangent (B) as measured at 20° C. and 35 GHz of 0.1 or less, and a ratio [a dielectric loss tangent (C) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the dielectric loss tangent (A)] of 0.90-1.10, or a substrate having a relative permittivity (a) as measured at 20° C. and 10 GHz of 4 or more and 10 or less, a relative permittivity (b) as measured at 20° C. and 35 GHz of 4 or more and 10 or less, and a ratio [a relative permittivity (c) as measured at an arbitrary temperature in a range of −40 to 150° C. and at 10 GHz]/[the relative permittivity (a)] of 0.993-1.007.

公开(公告)号：US20230079562A1

公开(公告)日：2023-03-16

申请号：US18054667

申请日：2022-11-11

Applicant: AGC INC.

Inventor： Shuhei NOMURA ,  Kazutaka ONO

IPC: C03C3/091 ,  H01L21/02 ,  H01L27/12 ,  H01L29/786 ,  G02F1/1333 ,  H01L21/762 ,  C03C4/20

Abstract: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα50/100| of a difference between an average coefficient of thermal expansion α50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα100/200| of a difference between an average coefficient of thermal expansion α100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα200/300| of a difference between an average coefficient of thermal expansion α200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

公开(公告)号：US20220134713A1

公开(公告)日：2022-05-05

申请号：US17575827

申请日：2022-01-14

Applicant: AGC Inc.

Inventor： Shuhei OGAWA ,  Shuhei NOMURA ,  Norihito NAKAZAWA

IPC: B32B17/10

Abstract: A laminated member includes a glass member of which a linear transmittance at a wavelength of 850 nm is 80% or more, a bonding layer provided on or above the glass member, the bonding layer being constituted by a resin, and a Si—SiC member provided on or above the bonding layer.

公开(公告)号：US20190161388A1

公开(公告)日：2019-05-30

申请号：US16264734

申请日：2019-02-01

Applicant: AGC INC.

Inventor： Shuhei NOMURA ,  Kazutaka ONO

IPC: C03C3/093 ,  B32B17/00 ,  C03C3/091

Abstract: An alkali-free glass substrate which is a glass substrate includes, as represented by molar percentage based on oxides, 0.1% to 10% of ZnO. The alkali-free glass substrate has an average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 2.70 ppm/° C. to 3.20 ppm/° C., an average coefficient of thermal expansion α200/300 at 200 to 300° C. of from 3.45 ppm/° C. to 3.95 ppm/° C., and a value α200/300/α50/100 obtained by dividing the average coefficient of thermal expansion α200/300 at 200 to 300° C. by the average coefficient of thermal expansion α50/100 at 50 to 100° C. of from 1.20 to 1.30.