公开(公告)号：US11623368B2

公开(公告)日：2023-04-11

申请号：US16983876

申请日：2020-08-03

Applicant: Align Technology, Inc.

Inventor： Yevgeniy Sirovskiy ,  James C. Culp

IPC: B29C51/42 ,  B29B13/02

Abstract: Methods for thermal forming an object are provided. In some embodiments, a method includes reading a mold identifier located on or in a mold, and determining mold process information from the mold identifier, the mold process information including heating information. The method can include heating a thermoformable material according to the heating information by adjusting power of one or more independently controllable heat sources. The method can also include monitoring one or more temperatures from a plurality of temperature sensing elements operably coupled to different areas of the thermoformable material. The thermoformable material can be heated according to the heating information and in response to the one or more monitored temperatures such that each of the different areas of the thermoformable material reach a respective desired temperature. The method can further include disposing the heated thermoformable material over at least a portion of the mold to form the object.

公开(公告)号：US11383322B2

公开(公告)日：2022-07-12

申请号：US17167056

申请日：2021-02-03

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: B23K26/06 ,  B23K26/142 ,  B23K26/08 ,  A61C13/00 ,  G05B15/02 ,  B23K26/38 ,  B23K26/064 ,  A61C7/08

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

公开(公告)号：US11241758B2

公开(公告)日：2022-02-08

申请号：US17182207

申请日：2021-02-22

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: B23K26/06 ,  B23K26/38 ,  B23K26/142 ,  B23K26/08 ,  A61C13/00 ,  G05B15/02 ,  B23K26/064 ,  A61C7/08

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

公开(公告)号：US10195690B2

公开(公告)日：2019-02-05

申请号：US15218778

申请日：2016-07-25

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: B23K26/06 ,  B23K26/08 ,  B23K26/38 ,  B23K26/142 ,  B23K26/064

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

公开(公告)号：US12208542B2

公开(公告)日：2025-01-28

申请号：US18180373

申请日：2023-03-08

Applicant: Align Technology, Inc.

Inventor： Yevgeniy Sirovskiy ,  James C. Culp

IPC: B29C51/42 ,  B29B13/02

Abstract: Methods for manufacturing thermoformed objects are provided. In some embodiments, a method includes controlling a material transport system to move a material to a first location proximate to one or more heat sources. The method can include controlling the one or more heat sources to heat a first region of the material to a first temperature and heat a second region of the material to a second temperature. The method can also include controlling the material transport system to move the material to a second location proximate to an object forming element, and controlling the object forming element to form a dental appliance from the material.

公开(公告)号：US11850680B2

公开(公告)日：2023-12-26

申请号：US18088518

申请日：2022-12-23

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: G05B15/02 ,  B23K26/06 ,  B23K26/142 ,  B23K26/08 ,  A61C13/00 ,  B23K26/38 ,  B23K26/064 ,  A61C7/08

CPC classification number: B23K26/0626 ,  A61C13/0006 ,  B23K26/064 ,  B23K26/08 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/142 ,  B23K26/38 ,  G05B15/02 ,  A61C7/08 ,  G05B2219/45041

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser, an optical component, a fixture for holding a support with a part positioned on the support, and a controller. The controller is configured to identify a cut path for trimming excess material from a dental appliance, determine adjustment instructions for adjusting a focal length of the laser to cut along the cut path, and trim the excess material from the dental appliance along the cut path with the laser. The focal length is adjusted by adjusting at least one of: the laser, the optical component, and the fixture, and while moving the fixture at a constant speed relative to the laser to avoid increasing a brittleness of a polymer material of the dental appliance along the cut path.

公开(公告)号：US11633877B2

公开(公告)日：2023-04-25

申请号：US16711223

申请日：2019-12-11

Applicant: ALIGN TECHNOLOGY, INC.

Inventor： Yevgeniy Sirovskiy ,  James C. Culp

IPC: B29C51/42 ,  B29B13/02

Abstract: A method and system for thermal forming an object. A mold is provided, a shape of which corresponds to a desired shape of the object. A material is inserted into a heating area, and the material is heated using a plurality of independently controllable heat sources that heat different areas of the material. The heated material is then disposed over or into at least a portion of the mold so as to deform the material. The deformed material may then be trimmed so as to form the object.

公开(公告)号：US11565441B2

公开(公告)日：2023-01-31

申请号：US14796824

申请日：2015-07-10

Applicant: Align Technology, Inc.

Inventor： Yevgeniy Sirovskiy ,  James C. Culp

IPC: B29C51/42 ,  B29B13/02

Abstract: A method and system for thermal forming an object. A mold is provided, a shape of which corresponds to a desired shape of the object. A material is inserted into a heating area, and the material is heated using a plurality of independently controllable heat sources that heat different areas of the material. The heated material is then disposed over or into at least a portion of the mold so as to deform the material. The deformed material may then be trimmed so as to form the object.

公开(公告)号：US10421152B2

公开(公告)日：2019-09-24

申请号：US16265287

申请日：2019-02-01

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: B23K26/06 ,  B23K26/38 ,  B23K26/08 ,  B23K26/064 ,  B23K26/142

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.

公开(公告)号：US20190160590A1

公开(公告)日：2019-05-30

申请号：US16265287

申请日：2019-02-01

Applicant: Align Technology, Inc.

Inventor： James C. Culp

IPC: B23K26/06 ,  B23K26/38 ,  B23K26/08 ,  B23K26/064 ,  B23K26/142

CPC classification number: B23K26/0626 ,  A61C7/08 ,  A61C13/0006 ,  B23K26/064 ,  B23K26/08 ,  B23K26/083 ,  B23K26/0853 ,  B23K26/0861 ,  B23K26/142 ,  B23K26/38

Abstract: Laser cutting systems and methods are described herein. One or more systems include a laser generating component, an optical component, a fixture for holding a support with a part positioned on the support, and a control mechanism for adjusting at least one of the laser generating component, the optical component, and the fixture such that a ratio of a laser energy applied to the part and a part material thickness is maintained within a predetermined acceptable range at each point along a cut path to cut through the part while maintaining the integrity of the support. Other systems and methods are disclosed herein.