公开(公告)号：US20190082546A1

公开(公告)日：2019-03-14

申请号：US16127064

申请日：2018-09-10

Applicant: Apple Inc.

Inventor： Marwan RAMMAH ,  Lee E. HOOTON ,  Srikanth V. THIRUPPUKUZHI ,  Stoyan P. HRISTOV ,  Adam J. BRINKMAN ,  James A. BERTIN

IPC: H05K5/00 ,  H05K5/02 ,  H05K5/03 ,  H05K5/06 ,  H05K9/00

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes a protruding trim structure having walls that define a cavity, where the protruding trim structure is capable of carrying an electronic component within the cavity. The enclosure further includes a support plate that is coupled to the enclosure and the protruding trim structure, and a brace structure that secures and supports the protruding trim structure such that when the protruding trim structure is exposed to an external load during a drop event, the protruding trim structure is capable of redirecting an amount of the load away from the protruding trim structure and the electronic component.

公开(公告)号：US20170071064A1

公开(公告)日：2017-03-09

申请号：US15260222

申请日：2016-09-08

Applicant: Apple Inc.

Inventor： Lee E. HOOTON ,  Daniel W. JARVIS ,  Marwan RAMMAH ,  Ian A. SPRAGGS ,  Nicholas G. MERZ

IPC: H05K5/00 ,  H05K5/03 ,  H05K7/14 ,  H05K5/02

CPC classification number: H04M1/0266 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1637 ,  H04M1/0249

Abstract: An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.

Abstract translation: 公开了一种具有用框架固定的盖玻璃的电子设备。 电子设备包括位于盖玻璃和框架之间的掩模层。 掩模层可以包括几个油墨层。 可以改变一个油墨层的颜料组合物，以便改善油墨层和盖玻璃之间的粘结。 可以修改框架以增强掩模层和框架之间的粘结。 例如，可以改变框架以包括多孔区域以增加框架的表面积，使得粘合剂可以结合到附加表面区域。 框架还可以包括可以增加接收粘合剂的框架的表面积的延伸部或肋。 框架可以包括有助于嵌入成型特征之间的组装的开口或空腔。