Abstract:
Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. While a display of an electronic device with a fingerprint sensor displays a first user interface, the device may detect movement of a fingerprint on the fingerprint sensor. In accordance with a determination that the movement of the fingerprint is in a first direction, the device allows navigating through the first user interface, and in accordance with a determination that the movement of the fingerprint is in a second direction different from the first direction, the device allows displaying a second user interface different from the first user interface on the display.
Abstract:
Devices, methods and graphical user interfaces for manipulating user interfaces based on fingerprint sensor inputs are provided. An electronic device with a display and a fingerprint sensor may obtain fingerprint-verification criteria for controlling verification of fingerprints. For each of a plurality of respective inputs that correspond to respective restricted operations, the device may identify fingerprint features of the respective input. The device may determine fingerprint-verification information for the respective input. In response to detecting the respective input and in accordance with a determination that the fingerprint-verification information meets respective authorization criteria for the respective restricted operation, the device may perform the respective restricted operation. In response to detecting the respective input and in accordance with a determination that the fingerprint-verification information does not meet the respective authorization criteria for the restricted operation, the device may forgo performing the respective restricted operation.
Abstract:
Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.
Abstract:
According to some embodiments, a portable electronic device is described. The portable electronic device includes a housing having side walls and a back wall that define a cavity, where the back wall includes (i) a first section having a first exterior surface, and (ii) a second section having a second exterior surface that is parallel to and vertically displaced from the first exterior surface. The portable electronic device further includes a brace structure joined to the back wall, a trim structure welded to the brace structure, where the trim structure has an external surface that is vertically displaced from the second exterior surface, and a camera module disposed within the cavity and carried by the brace structure.
Abstract:
An electronic device having a cover glass secured with a frame is disclosed. The electronic device includes a masking layer positioned between the cover glass and the frame. The masking layer may include several ink layers. The pigment composition of one of the ink layers may be altered in order to improve an adhesive bond between the ink layer and the cover glass. The frame can be modified to enhance an adhesive bond between the masking layer and the frame. For example, the frame can be altered to include a porous region to increase the surface area of the frame such that the adhesive can bond to the additional surface area. The frame may also include an extension, or rib, that may increase the surface area of the frame that receives an adhesive. The frame may include an opening or a cavity that assists in assembly between an insert-molded feature.